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    MANAGED MEMORY COMPONENT
    22.
    发明申请
    MANAGED MEMORY COMPONENT 审中-公开

    公开(公告)号：WO2007136917A3

    公开(公告)日：2007-11-29

    申请号：PCT/US2007/064407

    申请日：2007-03-20

    Applicant: STAKTEK GROUP L.P. ,  WEHRLY, James, Douglas, Jr. ,  SZEWERENKO, Leland ,  ROPER, David, L.

    Inventor： WEHRLY, James, Douglas, Jr. ,  SZEWERENKO, Leland ,  ROPER, David, L.

    IPC: H01L23/495

    Abstract: A system and method for combining a leaded package IC (12) and a semiconductor die (14) using a flex circuitry (20). The leaded packaged IC (12) is disposed along an obverse side of a flex circuit. In a preferred embodiment, the lower surface of the body of the leaded packaged IC (12) contacts the surface of the flex circuitry (20). The semiconductor die (14) is disposed beneath the leaded package IC (12) and, in preferred embodiments, disposed in a window that passes through at least a part of the flex circuitry (20) and is attached to a conductive layer of the flex circuitry (20). In other embodiments, the semiconductor die is attached to the body of the leaded packaged IC. The flex circuitry preferably employs at least two conductive layers (20M1, 20M2).

    MINIMIZED PROFILE CIRCUIT MODULE SYSTEMS AND METHODS
    23.
    发明申请
    MINIMIZED PROFILE CIRCUIT MODULE SYSTEMS AND METHODS 审中-公开
    最小化型式电路模块系统和方法

    公开(公告)号：WO2007044368A2

    公开(公告)日：2007-04-19

    申请号：PCT/US2006/038720

    申请日：2006-10-03

    Applicant: STAKTEK GROUP L.P. ,  CADY, James, W. ,  WEHRLY, James, Douglas ,  GOODWIN, Paul

    Inventor： CADY, James, W. ,  WEHRLY, James, Douglas ,  GOODWIN, Paul

    IPC: H01R43/02

    CPC classification number: G11C5/143 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: Flexible circuitry is populated on one or both sides with integrated circuits (ICs) each of which ICs has an IC profile (height). A substantially flat, windowed fixture with a fixture profile less than the IC profiles of the ICs is applied over an IC-populated side of the flexible circuitry causing at least a part of the ICs to emerge from respective fixture windows. Material is removed simultaneously from that portion of the ICs that emerge from the windows to result in lower-profile ICs which, in a preferred embodiment exhibit profiles substantially coincident with the fixture profile established by the upper surface of the fixture. The method is used to advantage in devising circuit modules by disposing the flexible circuitry about a rigid substrate to form the circuit module with a low profile. Some embodiments use substrates that are windowed or have inset areas into which the lower profile CSPs may be set to reach profile requirements.

    Abstract translation: 灵活的电路在一侧或两侧安装集成电路（IC），每个IC都具有IC配置文件（高度）。 具有小于IC的IC配置文件的夹具型材的基本平坦的窗口固定件被施加在柔性电路的IC填充侧上，导致至少一部分IC从相应的固定窗口露出。 与从窗户出现的IC的那部分同时移除材料以产生下轮廓的IC，其在优选实施例中表现出与由固定装置的上表面确定的夹具轮廓基本一致的轮廓。 该方法用于通过将柔性电路围绕刚性基板布置以形成具有低轮廓的电路模块来设计电路模块。 一些实施例使用被窗口化或具有插入区域的衬底，下部轮廓CSP可被设置到其中以达到轮廓要求。

    COMPACT MODULE SYSTEM AND METHOD
    24.
    发明申请
    COMPACT MODULE SYSTEM AND METHOD 审中-公开
    紧凑型模块系统和方法

    公开(公告)号：WO2006121489A2

    公开(公告)日：2006-11-16

    申请号：PCT/US2006/007193

    申请日：2006-02-28

    Applicant: STAKTEK GROUP L.P. ,  CADY, James, W. ,  WEHRLY, James, Douglas, Jr. ,  GOODWIN, Paul

    Inventor： CADY, James, W. ,  WEHRLY, James, Douglas, Jr. ,  GOODWIN, Paul

    IPC: G06F11/00

    CPC classification number: H05K1/189 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10189

    Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.

    Abstract translation: 柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。 沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。 在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。 可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境 。

    THIN CIRCUIT MODULE AND METHOD
    26.
    发明申请
    THIN CIRCUIT MODULE AND METHOD 审中-公开
    薄电路模块和方法

    公开(公告)号：WO2009039263A2

    公开(公告)日：2009-03-26

    申请号：PCT/US2008/076839

    申请日：2008-09-18

    Applicant: STAKTEK GROUP L.P. ,  WOLFE, Mark ,  WILDER, James ,  ROPER, David L.

    Inventor： WOLFE, Mark ,  WILDER, James ,  ROPER, David L.

    CPC classification number: H05K1/183 ,  H05K1/0203 ,  H05K1/117 ,  H05K2201/09972 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2203/1572 ,  Y10T29/49124

    Abstract: A circuit module includes a printed circuit board (PCB) (12) having a first side (22), a second side (24), and a bottom perimeter edge (42). The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area (70) and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts (30) are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector.

    Abstract translation: 电路模块包括具有第一侧面（22），第二侧面（24）和底部周边边缘（42）的印刷电路板（PCB）（12）。 PCB沿着底部周边边缘呈现第一厚度。 第一侧包括凹陷区域（70），并且在该凹陷区域中，PCB具有小于第一厚度的第二厚度。 多个集成电路（IC）在凹陷区域中固定到PCB。 多个模块触点（30）连接到IC并且沿着第一和第二侧中的至少一个设置，并且被配置为在电路模块和边缘连接器之间提供电连接。

    LEADED PACKAGE INTEGRATED CIRCUIT STACKING
    28.
    发明申请
    LEADED PACKAGE INTEGRATED CIRCUIT STACKING 审中-公开
    引导式封装集成电路堆栈

    公开(公告)号：WO2007044019A1

    公开(公告)日：2007-04-19

    申请号：PCT/US2005/039307

    申请日：2005-10-28

    Applicant: STAKTEK GROUP L.P. ,  WEHRLY, James, Douglas, Jr. ,  ROPER, David, L.

    Inventor： WEHRLY, James, Douglas, Jr. ,  ROPER, David, L.

    IPC: H01L29/40

    CPC classification number: H05K1/147 ,  H01L23/49827 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3421 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

    Abstract: A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of the ICs. Thus, the flex does not require discrete leads which must be individually aligned with the individual leads of the constituent ICs employed in the stack. The principle may be employed to aggregate two or more contact areas for respective connection to leads of constituent ICs but is most profitably employed with a continuous connective field that provides contact areas for many leads of the ICs.

    Abstract translation: 提供了一种用于将堆叠配置中相邻IC封装彼此电和热耦合的系统和方法。 将柔性电路部分地插入待堆叠的IC之间，并且提供连接到IC的各个引线的多个接触区域的连接场。 因此，柔性件不需要离散引线，这些引线必须与堆叠中采用的构成IC的各引脚单独对齐。 该原理可以用于聚合两个或更多个接触区域以用于分量连接到构成IC的引线，但是对于提供IC的许多引线的接触面积的连续连接场最有利地使用。

    MEMORY MODULE SYSTEM AND METHOD
    29.
    发明申请
    MEMORY MODULE SYSTEM AND METHOD 审中-公开

    公开(公告)号：WO2006124085A3

    公开(公告)日：2006-11-23

    申请号：PCT/US2006/004690

    申请日：2006-02-09

    Applicant: STAKTEK GROUP L.P. ,  RAPPORT, Russell ,  GOODWIN, Paul ,  CADY, James W.

    Inventor： RAPPORT, Russell ,  GOODWIN, Paul ,  CADY, James W.

    IPC: H01L23/495

    Abstract: A circuit module is provided in which two secondary substrates (21A, 21B) or cards or the rigid portions (16B) of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector (12). The flexible circuitry (20) is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

    CIRCUIT MODULE SYSTEM AND METHOD
    30.
    发明申请
    CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
    电路模块系统和方法

    公开(公告)号：WO2006028643A2

    公开(公告)日：2006-03-16

    申请号：PCT/US2005/028547

    申请日：2005-08-10

    Applicant: STAKTEK GROUP L.P. ,  GOODWIN, Paul ,  CADY, James ,  WEHRLY, James, Douglas, Jr.

    Inventor： GOODWIN, Paul ,  CADY, James ,  WEHRLY, James, Douglas, Jr.

    IPC: H05K7/06 ,  H05K7/10

    CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L25/105 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

    Abstract: Flexible circuitry is populated with integrated circuits (ICs) disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

    Abstract translation: 灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。 沿柔性电路分布的触点提供与IC的连接。 优选地，柔性电路围绕刚性的导热基底的边缘设置，因此将集成电路置于衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。 其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。 在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。 优选的衬底由导热材料构成。 预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。

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