公开(公告)号：US20130279126A1

公开(公告)日：2013-10-24

申请号：US13670015

申请日：2012-11-06

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Yi Chen ,  Wu-Yung Yang ,  Chih-Wei Lin

IPC: C08G73/10 ,  H05K7/06 ,  H01L31/0216 ,  B32B15/08 ,  B05D5/12

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/18 ,  B32B2457/206 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1085 ,  C08G73/22 ,  C09D179/08 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/31681

Abstract: An aromatic polyimide film can be formed from a plurality of monomers comprising an aromatic dianhydride, and a first aromatic diamine selected from a group consisting of formulae (I) and (II): and wherein X and Y are respectively selected from the group consisting of oxygen, nitrogen and sulfur, and R and R′ are respectively selected from the group consisting of NH2, wherein the aromatic polyimide film has an average linear coefficient of thermal expansion equal to or below about 5 ppm/° C. in a temperature range between about 50° C. and about 500° C.

Abstract translation: 芳族聚酰亚胺膜可以由多种包含芳族二酐的单体和选自式（I）和（II）的第一芳族二胺形成：其中X和Y分别选自 氧，氮和硫，R和R'分别选自NH 2，其中芳族聚酰亚胺膜的平均线性热膨胀系数等于或低于约5ppm /℃，在 约50℃和约500℃

公开(公告)号：US20230416480A1

公开(公告)日：2023-12-28

申请号：US18336050

申请日：2023-06-16

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-HUA LI ,  JIA-HAO WU

IPC: C08J5/18 ,  C08G73/10 ,  C08K3/04 ,  C08L79/08

CPC classification number: C08J5/18 ,  C08G73/1007 ,  C08G73/105 ,  C08G73/1071 ,  C08G73/1042 ,  C08J2379/08 ,  C08L79/08 ,  C08K2201/005 ,  C08L2205/12 ,  C08L2205/22 ,  C08K3/04

Abstract: A high-modulus black matte polyimide film is provided, the high-modulus black matte polyimide film includes polyimide in an amount from 75 to 93 wt % of the high-modulus matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide; carbon black in an amount from 2 to 8 wt % of the high-modulus matte polyimide film; and liquid crystal polymer micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 20 wt % of the high-modulus matte polyimide film, wherein the high-modulus matte polyimide film has a gloss value at 60° being less than 50.

公开(公告)号：US20210198528A1

公开(公告)日：2021-07-01

申请号：US17106211

申请日：2020-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-CHI HSU ,  CHUN-TING LAI ,  CHIH-WEI LIN

IPC: C09J7/38 ,  H01L33/00

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

公开(公告)号：US10212821B2

公开(公告)日：2019-02-19

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  C03C17/34 ,  H01L21/683 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H01L23/498 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US20180105657A1

公开(公告)日：2018-04-19

申请号：US15365679

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Wen-Hsuan Chung

IPC: C08J5/18 ,  B29C59/04 ,  B29C35/02

CPC classification number: C08J5/18 ,  B29C35/02 ,  B29C59/046 ,  B29K2079/08 ,  B29K2105/0032 ,  B29K2995/0018 ,  C08J2379/08 ,  C08J2479/08

Abstract: The present application provides a polyimide film having low gloss and a process of fabricating the same. The process includes forming a polyimide precursor solution by reacting diamine monomers with dianhydride monomers in a solvent, forming a wet polyimide film on a support with the polyimide precursor solution, pressing the wet film with an embossing roller at a temperature equal to or higher than 100° C. and an applied pressure equal to or higher than 1 kg, thereby causing the wet film to exhibit an uneven surface, and heating the wet film to form a polyimide film.

公开(公告)号：US09914841B2

公开(公告)日：2018-03-13

申请号：US14165274

申请日：2014-01-27

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chih-Wei Lin ,  Wu-Yung Yang

IPC: C08K3/04 ,  C08K3/36 ,  B32B5/16 ,  B32B27/20 ,  C08L79/08 ,  C09D7/00 ,  B29C41/24 ,  H05K9/00 ,  C08J3/22 ,  C08K3/00 ,  C08K5/00 ,  B29K105/00 ,  B29K79/00 ,  C08K13/02

CPC classification number: C09D7/42 ,  B29C41/24 ,  B29K2079/08 ,  B29K2105/0032 ,  C08J3/226 ,  C08J2379/08 ,  C08J2479/08 ,  C08K3/013 ,  C08K5/0041 ,  C08K13/02 ,  H05K9/0084 ,  Y10T428/254 ,  C08K3/0033 ,  C08L79/08

Abstract: A colored matting powder includes particles containing a polyimide obtained by reacting diamine and dianhydride monomers at a substantially equal molar ratio, and a pigment incorporated with the polyimide, a portion of the pigment being located at an outer surface of the particles. Moreover, a colored polyimide film is also described as incorporating the colored matting powder, and can exhibit low gloss, low transparency and good insulation.

公开(公告)号：US20170298249A1

公开(公告)日：2017-10-19

申请号：US15131990

申请日：2016-04-18

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chih-Wei Lin ,  Chun-Ting Lai ,  Yen-Po Huang

IPC: C09D179/08

CPC classification number: C09D179/08 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/106

Abstract: The present disclosure relates, according to some embodiments, to a multilayered polyimide film comprising a peelable base layer, and a polyimide layer adhered in contact with the peelable base layer. A peelable base layer may be derived from a reaction comprising a diamine compound and a dianhydride compound, wherein the peelable base comprises a polyimide and a structure according to formula (I): wherein n is a number of repeating units. According to some embodiments, a quantity of silicon atoms present in a peelable base layer comprises about 1% to about 12% of a total weight of the peelable base layer.

公开(公告)号：US20170064838A1

公开(公告)日：2017-03-02

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S.C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract translation: 根据一些实施例，本公开涉及柔性电路板的制造，其包括形成包含聚酰亚胺的基层，在基层上形成聚酰亚胺层，所述聚酰亚胺层具有第一表面和与第二表面相对的第二表面 彼此之间，第一表面可剥离地与基底层接触，在聚酰亚胺层的第二表面上形成金属层，并且在聚酰亚胺层上剥离基底层，金属层残留在聚酰亚胺的第二表面上 层。

公开(公告)号：US20150064484A1

公开(公告)日：2015-03-05

申请号：US14292254

申请日：2014-05-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Wen-Hsuan Chung ,  Mei-Hui Lee

IPC: C08L79/08 ,  H05K1/05 ,  H05K1/03

CPC classification number: H05K1/053 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08L2205/025 ,  C09D179/08 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0154 ,  Y10T428/31681 ,  C08K5/0041 ,  C08L79/08 ,  C08K3/013

Abstract: A colored polyimide film includes a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, wherein the diamine monomers are oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers are pyromellitic dianhydride (PMDA); a matting agent comprised of polyimide particles; and one or more color pigment. The polyimide films described herein have low gloss, low transparency, and low coefficient of thermal expansion.

Abstract translation: 着色的聚酰亚胺膜包括通过二胺单体与二酐单体反应而得到的聚酰亚胺聚合物，其中二胺单体是氧化二苯胺（ODA）和苯二胺（PDA）单体，二酐单体是均苯四酸二酐（PMDA）; 由聚酰亚胺颗粒组成的消光剂; 和一种或多种着色颜料。 本文所述的聚酰亚胺膜具有低光泽度，低透明度和低热膨胀系数。

公开(公告)号：US20140050935A1

公开(公告)日：2014-02-20

申请号：US14060131

申请日：2013-10-22

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Yi CHEN ,  Chih-Wei LIN ,  Chi-Huan LO ,  Shihan TAI

IPC: C09D179/08

CPC classification number: C09D179/08 ,  C08G73/10 ,  C08J5/18 ,  C08J2379/08 ,  C08J2479/08 ,  C08K13/02 ,  C08L79/08 ,  Y10T428/31721

Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.

Abstract translation: 聚酰亚胺膜包括聚酰亚胺基层聚酰亚胺层和分散在聚酰亚胺基聚合物中的聚酰亚胺粉末，该聚酰亚胺粉末是通过二胺与二酸酐的摩尔比为约1:0.950至约1:0.995 。 此外，聚酰亚胺膜可以具有至少包含层叠在聚酰亚胺层的表面上的第二聚酰亚胺层的多层结构。 第二聚酰亚胺还可以包含聚酰亚胺粉末，其重量比小于第二聚酰亚胺层的总重量的约20重量％。 本文所述的实施方案还包括制备聚酰亚胺膜的方法。