公开(公告)号：KR1020040047616A

公开(公告)日：2004-06-05

申请号：KR1020030083533

申请日：2003-11-24

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사카이미츠히로 ,  이케다카츠히로

IPC: G02F1/13

Abstract: PURPOSE: A substrate handling device is provided to support a substrate with a small number of line materials and sealing materials without forming plural holes in a plate member. CONSTITUTION: Supporting balls(50) connected by line materials(54) are disposed on a surface of a hot plate. Pins(55) for attaching the line materials(54) are installed on sides(45a,45b) of the hot plate. Hooking portions(54a) are formed on both ends of the line materials(54) to be attached to the hot plate. The line materials(54) are attached to the hot plate, depending on whether the hooking portions(54a) are hooked over the pins(55) of the hot plate.

Abstract translation: 目的：提供一种基板处理装置，用于支撑具有少量线材和密封材料的基板，而不在板构件中形成多个孔。 构成：通过线材（54）连接的支撑球（50）设置在热板的表面上。 用于安装线材（54）的销（55）安装在热板的侧面（45a，45b）上。 钩挂部分（54a）形成在线材（54）的两端以附接到热板上。 根据挂钩部分（54a）是否钩在热板的销（55）上，线材（54）附接到热板。