公开(公告)号：KR1020100120485A

公开(公告)日：2010-11-16

申请号：KR1020090039320

申请日：2009-05-06

Applicant: 삼성전자주식회사

Inventor： 정창권 ,  김현 ,  김명화 ,  김근우 ,  조경환 ,  김두나

IPC: H04W88/06 ,  H04B7/02

CPC classification number: H04B1/3838 ,  H01Q1/243 ,  H01Q21/28

Abstract: PURPOSE: A terminal including a plurality of antennas and an operation method thereof for supplying a communication service are provided to remove antenna radiation specific loss according to a grasping state of a user. CONSTITUTION: An RF(Radio Frequency) unit(110) includes a plurality of antennas. A sensor unit(170) prepares in one side of a terminal case. In case hands of a user touch, a sensor unit generates a sensor signal. A controller(160) forms a communication path with a specific antenna included in the RF unit according to the sensor signal.

Abstract translation: 目的：提供一种包括多个天线的终端及其提供通信服务的操作方法，以根据用户的掌握状态去除天线辐射特定的损失。 构成：RF（射频）单元（110）包括多个天线。 传感器单元（170）准备在终端壳体的一侧。 如果用户触摸手，传感器单元产生传感器信号。 控制器（160）根据传感器信号与包括在RF单元中的特定天线形成通信路径。

公开(公告)号：KR1020100104590A

公开(公告)日：2010-09-29

申请号：KR1020090023109

申请日：2009-03-18

Applicant: 삼성전자주식회사

Inventor： 김근우 ,  송호건 ,  한만희

IPC: H01L23/495 ,  H01L23/498

CPC classification number: H01L23/49548 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: The lead frame and the semiconductor package having the same comprise the dam bar in the lead frame and rigid gusset. It is bent of the lead frame by the thermal expansion coefficient mismatch between the lead frame and the molding material, warpage is prevented. CONSTITUTION: A frame(110) comprises a plurality of openings accepting semiconductor chips. A lead structure(120) is arranged within openings according to the first direction. The lead structure comprises the semiconductor chip, the electrically connected inner lead(122) and the outer lead(124) expanded from inner leads.

Abstract translation: 目的：引线框架和具有该引线框架的半导体封装包括引线框架中的阻挡条和刚性的角撑板。 引线框架与成型材料之间的热膨胀系数不匹配导致引线框弯曲，防止翘曲。 构成：框架（110）包括容纳半导体芯片的多个开口。 引线结构（120）根据第一方向布置在开口内。 引线结构包括半导体芯片，电连接的内引线（122）和外引线（124）从内引线扩展。

公开(公告)号：KR1020100012330A

公开(公告)日：2010-02-08

申请号：KR1020080073667

申请日：2008-07-28

Applicant: 삼성전자주식회사

Inventor： 김근우 ,  한만희 ,  송호건

IPC: H01L21/60

CPC classification number: H01L23/49565 ,  H01L23/49517

Abstract: PURPOSE: A method of forming an electric device having stacked chips is provided to minimize the package warpage by cutting the part of lead frame connected to the lead among the semiconductor process and to improve productivity of finished product. CONSTITUTION: The lead support bar(120) is near to the side rail(110). A plurality of leads(130) is contacted with one side of the lead support bar. The connecting lead(140) is connected between the lead support bar and the side rail. The leads have a smaller cross section. The connecting lead has the notch.

Abstract translation: 目的：提供一种形成具有堆叠芯片的电子装置的方法，以通过切割半导体工艺中连接到引线的引线框架的一部分来最小化封装翘曲并提高成品的生产率。 构成：引线支撑杆（120）靠近侧轨（110）。 多个引线（130）与引线支撑条的一侧接触。 连接引线（140）连接在引线支撑杆和侧轨之间。 导线的横截面较小。 连接引线有缺口。