中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

54 records (took 0.019 seconds)

    반도체 제조설비용 헤드플레이트 개폐장치
    26.
    发明公开
    반도체 제조설비용 헤드플레이트 개폐장치 无效
    用于切换制造半导体设备头板的装置

    公开(公告)号：KR1020010044888A

    公开(公告)日：2001-06-05

    申请号：KR1019990047938

    申请日：1999-11-01

    Applicant: 삼성전자주식회사

    Inventor： 박진선

    IPC: H01L21/66

    Abstract: PURPOSE: An apparatus for switching a head plate of equipment for manufacturing a semiconductor is provided to easily switch a head plate, by installing a cylinder to automatically make the head plate perform a switching process. CONSTITUTION: A head plate(12) is installed on the upper surface of an open probe body, and a portion of the head plate is connected to the probe body by a hinge. A cylinder(14) moves up/down the head plate to switch the upper surface of the probe body while the head plate is revolving with reference to its axis. An air pump(16) supplies air to the cylinder to move up/down the head plate. A Solenoid(18) is installed between the cylinder and the air pump to intermit the supply of air to the cylinder.

    Abstract translation: 目的：提供一种用于切换用于制造半导体的设备的头板的设备，通过安装气缸来自动地使头板执行切换处理来容易地切换头板。 构成：头板（12）安装在开放的探针体的上表面上，头板的一部分通过铰链连接到探针体上。 气缸（14）在头板相对于其轴线旋转的同时上下移动头板以切换探针体的上表面。 空气泵（16）将空气供给到气缸以使头板上下移动。 电磁阀（18）安装在气缸和空气泵之间，以将空气供给到气缸。

Patent Agency Ranking