Abstract:
구동전압의저감과높은광흡수강도를동시에달성할수 있는 3중연결양자우물구조를갖는광학소자가개시된다. 개시된광학소자는, 통상적인장벽층에비해에너지준위가낮은 2개의연결장벽층을통해서로연결된 3개의비대칭적인양자우물을갖는 3중연결양자우물구조를포함할수 있다. 이러한 3중연결양자우물구조에서는광학소자에전압이인가되면, 2개의연결장벽층의에너지조절기능을통해정공의파동함수와전자의파동함수의상당부분이중앙에있는양자우물내에중첩하여분포하게된다. 따라서, 양자우물층의두께증가로광학소자의구동전압을낮출수 있을뿐만아니라, 정공의파동함수와전자의파동함수사이의중첩을충분한정도로유지할수 있어서흡수강도의향상이가능하다.
Abstract:
The present invention discloses an optical device including a quantum well structure having triple connections. The optical device may include the quantum well structure having triple connections which includes three asymmetric quantum wells connected to each other through two connection walls having a lower energy level compared to a common wall. In the quantum well structure having triple connections, when voltages are applied to the optical device, much of the wave function of holes and electrons are distributed in the quantum wells in the center to be overlapped via an energy controlling function of the two connection walls. Therefore, increased thickness of a quantum well layer can not only reduce driving voltages of the optical device but also maintain an overlapped state of the wave function of holes and electrons to be enough. Therefore, absorption intensity can be increased.
Abstract:
A stacked semiconductor device package is provided to be stronger with respect to physical impact applied from the outside by including an interposer on which semiconductor device packages having mutual mirror effect are mounted by a land grid array method. An interposer(170) having first and second surfaces are formed between first and second semiconductor device packages. The first and second semiconductor device packages are mounted on the first and second surfaces of the interposer by a land grid array method wherein the first and second semiconductor devices packages are mirror structures to each other or become a mutual mirror structure by the interposer. The first and second semiconductor device packages can be connected to a system board(200) by using the interposer as a medium.
Abstract:
An infrared-transmitting large-area shutter is disclosed. The disclosed infrared-transmitting large-area shutter includes: a first contact layer which is formed on a substrate; a plurality of laminations which are formed on the first area of the first contact layer in a two-dimensional array form and each of which includes a lower reflection layer, an active layer, and an upper reflection layer formed on the first contact layer in order, and a second contact layer; a first electrode which is formed on the first contact layer; a plurality of second electrodes each of which is formed on each second contact layer; a first polymer layer which surrounds the side walls of the laminations on the first contact layer and is made of low-permittivity material; and a second polymer layer which covers the second electrodes on the second contact layers. On the substrate, through holes corresponding to the laminations are formed.
Abstract:
PURPOSE: A transmitting type optical image modulator having a large aperture area, a method for manufacturing the same, and an optical apparatus comprising a transmitting type optical image modulator are provided to improve the tolerance of a transmitting type optical image modulator to external impact and mechanical deformation by forming a transparent substrate which functions as a support unit for holding the upper part of an electrode. CONSTITUTION: A first epitaxial layer (32) is formed on a base substrate. A second epitaxial layer is formed on the first epitaxial layer. A first electrode is formed on the first epitaxial layer. A second electrode is formed on the second epitaxial layer. A transparent substrate (52) covers the second epitaxial layer and the second electrode.