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公开(公告)号：KR1020130077705A
公开(公告)日：2013-07-09
申请号：KR1020110146570
申请日：2011-12-29
Applicant: 제일모직주식회사
Abstract: PURPOSE: A highly rigid electromagnetic interference shielding composite is provided to excellent dimensional stability by replacing an existing metal material. CONSTITUTION: A thermoplastic resins (40) of a highly rigid electromagnetic interference shielding composite forms a continuous phase. A semi-dispersed phase is formed by a first metal filler (10), a second metal filler (20) and a surface-treated carbon fiber (30). The first filler continuously or discontinuously surrounds the surface of the second metal filler. The surface-treated carbon fiber is treated by resin and metal and the treated resin consists of polyamide and epoxy resin. The melting point of the thermoplastic resin, the first metal filler and the second metal filler satisfies Tma-30°C> Tmb and Tma+500°C
Abstract translation: 目的：通过更换现有的金属材料，提供高刚性的电磁干扰屏蔽复合材料，以获得优异的尺寸稳定性。 构成：高刚性电磁干扰屏蔽复合材料的热塑性树脂（40）形成连续相。 半分散相由第一金属填料（10），第二金属填料（20）和表面处理的碳纤维（30）形成。 第一填料连续或不连续地围绕第二金属填料的表面。 经表面处理的碳纤维经树脂和金属处理，经处理的树脂由聚酰胺和环氧树脂组成。 热塑性树脂，第一金属填料和第二金属填料的熔点分别满足Tma-30℃> Tmb和Tma + 500℃
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公开(公告)号：KR101267266B1
公开(公告)日：2013-05-23
申请号：KR1020090135872
申请日：2009-12-31
Applicant: 제일모직주식회사
Abstract: 본발명은 (A) 폴리카보네이트수지 50 내지 80 중량%; 및 (B) 폴리에스테르수지 20 내지 50 중량%;를포함하는열가소성수지조성물로부터성형되고, 두께가 0.2 내지 2mm이고, 겉보기비중이 0.8 내지 2.5 g/ml인전자기기의하우징(housing)용성형품을제공한다. 본발명에따른성형품은전자기기하우징용도로사용하기에유용하며, 특히치수안정성및 기계적강도가우수하다.
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公开(公告)号：KR1020120023490A
公开(公告)日：2012-03-13
申请号：KR1020100129508
申请日：2010-12-16
Applicant: 제일모직주식회사
CPC classification number: H05K9/009 , C08J7/047 , C08K7/06 , C08L101/00
Abstract: PURPOSE: A high modulus composite for EMI shielding is provided to be suitable for the EMI shielding by having high conductivity and low surface resistance. CONSTITUTION: A highly-rigid electromagnetic interference shielding composite comprises a thermoplastic resin(10) and a carbon fiber(20). The length of the carbon fiber is 8-20mm. The carbon fiber is 45-65 parts by weight of a whole composite. A thermoplastic resin is a crystallizable thermoplastic resin.
Abstract translation: 目的：通过具有高导电性和低表面电阻，适用于EMI屏蔽的高模量复合材料适用于EMI屏蔽。 构成：高刚性的电磁干扰屏蔽复合材料包括热塑性树脂（10）和碳纤维（20）。 碳纤维的长度为8-20mm。 碳纤维是整个复合材料的45-65重量份。 热塑性树脂是可结晶的热塑性树脂。
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公开(公告)号：KR1020100053905A
公开(公告)日：2010-05-24
申请号：KR1020080112782
申请日：2008-11-13
Applicant: 제일모직주식회사
Abstract: PURPOSE: A thermoplastic resin composition is provided to secure the impact strength, and the mechanical property including the flowage and heat resistance, and to prevent environment contamination by reducing the generation of total volatile organic compounds. CONSTITUTION: A thermoplastic resin composition contains 100 parts of base resin by weight, and 0.1~5 parts of porous silica nano particle by weight. The base resin is formed with 30~99 parts of styrene-based resin including an epoxy group by weight, and 1~70 parts of polyester resin. The average particle size of the porous silica nano particle is 5~800 nano meters. The average diameter of each pore is 1~80 nano meters. The styrene-based resin contains 5~100wt% of epoxy radical including vinyl copolymer, and 0~95wt% of rubber strengthening styrenic copolymer resin.
Abstract translation: 目的：提供热塑性树脂组合物以确保冲击强度和包括流动性和耐热性的机械性能，并且通过减少总挥发性有机化合物的产生来防止环境污染。 构成：热塑性树脂组合物含有100重量份的基础树脂和0.1〜5重量份的多孔二氧化硅纳米颗粒。 基础树脂由30〜99份的包含环氧基的苯乙烯基树脂和1〜70份聚酯树脂形成。 多孔二氧化硅纳米颗粒的平均粒径为5〜800纳米。 每个孔的平均直径为1〜80纳米。 苯乙烯类树脂含有5〜100重量％的环氧基，包括乙烯基共聚物，和0〜95重量％的橡胶强化苯乙烯共聚物树脂。
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公开(公告)号：KR101411021B1
公开(公告)日：2014-06-24
申请号：KR1020110146570
申请日：2011-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명의 고강성 전자파 차폐 복합재는 (A) 열가소성 수지; (B) 제1금속 필러; (C) 제2금속 필러; 및 (D) 표면처리된 카본섬유를 포함하여 이루어지며, 상기 표면처리된 카본섬유(D)는 수지 또는 금속으로 표면처리되어 있으며, 상기 표면처리되는 수지는 폴리아미드 또는 에폭시 수지이고, 상기 열가소성 수지(A), 상기 제1금속 필러(B) 및 상기 제2금속 필러(C) 의 융점은 하기 식 1을 충족하는 것을 특징으로 한다:
[식 1]
Tma-30 ℃ ＞ Tmb, Tma+500 ℃＜ Tmc
(상기에서, Tma는 열가소성 수지(A)의 융점(℃), Tmb는 제1금속 필러(B)의 융점(℃), Tmc는 제2금속 필러(C)의 융점(℃)).-
Patent Agency Ranking
公开(公告)号：KR101280304B1
公开(公告)日：2013-07-01
申请号：KR1020100101870
申请日：2010-10-19
Applicant: 제일모직주식회사
Abstract: 본 발명은 두께가 0.2 내지 2 mm이고, 겉보기 비중이 0.8 내지 2.5 g/ml인 전자기기 하우징(housing)용 성형품을 제공한다. 또한, 본 발명은 열가소성 수지 조성물을 압출성형하는 방법에 의하여 소정의 단면 형상을 가진 연속체를 제조하는 압출성형 단계, 및 상기 연속체를 진공성형하는 방법에 의하여 두께가 0.2 내지 2 mm이고, 겉보기 비중이 0.8 내지 2.5 g/ml인 성형품을 제조하는 진공성형 단계를 포함하는 전자기기 하우징용 성형품의 제조방법을 제공한다.
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公开(公告)号：KR101251332B1
公开(公告)日：2013-04-05
申请号：KR1020090133047
申请日：2009-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명에 따른 내충격성 및 내화학성이 우수한 친환경 열가소성 수지 조성물은 (A) 폴리에스테르와 반응할 수 있는 관능기를 갖는 변성 방향족 비닐-시안화 비닐계 공중합체 수지 1∼80 중량%; (B) 고무변성 방향족 비닐-시안화 비닐계 그라프트 공중합체 수지 1∼93 중량%; (C) 폴리에스테르 수지 5∼80 중량%; 및 (D) 폴리유산 수지 1∼60 중량%를 포함하여 이루어진다.
변성 방향족 비닐-시안화 비닐계 공중합체 수지, 고무변성 방향족 비닐-시안화 비닐계 그라프트 공중합체 수지, 폴리에스테르 수지, 폴리유산, 충격성, 내화학성-
公开(公告)号：KR1020120034538A
公开(公告)日：2012-04-12
申请号：KR1020100129506
申请日：2010-12-16
Applicant: 제일모직주식회사
CPC classification number: H05K9/009 , C08K3/04 , C08K3/041 , C08K3/08 , C08K7/06 , H01B1/22 , H01B1/24 , Y10T428/2998 , C08L77/06 , C08L77/10
Abstract: PURPOSE: A High-modulus composition for shielding electromagnetic wave is provided to have excellent mechanical strength and conductivity, and to have low surface resistance, thereby suitable for shielding EMI, to have excellent flowability and moldability, not to need post processing, to have excellent profitability and productivity, and excellent dimensional stability, thereby replacing existing magnesium material. CONSTITUTION: A High-modulus composition for shielding electromagnetic wave comprises 10-34 weight% of polyamide resin which has aromatic group in backbone, 65-85 weight% of carbon fiber, 1-20 weight% of metal filler. The polyamide resin is wholly aromatic polyamide, semi-aromatic polyamide, or a mixture thereof. The carbon fiber comprises bundle shape. The metal filer comprises one or more kinds selected from a group consisting of metal powder, metal beads, metal fiber, metal flake, metal-coated particle, and metal-coated fiber.
Abstract translation: 目的：提供用于屏蔽电磁波的高模量组合物以具有优异的机械强度和导电性，并且具有低的表面电阻，因此适合于屏蔽EMI，具有优异的流动性和成型性，不需要后处理，具有优异的 盈利能力和生产力，优良的尺寸稳定性，从而取代了现有的镁材料。 构成：用于屏蔽电磁波的高模量组合物包括10-34重量％的在主链上具有芳族基团的聚酰胺树脂，65-85重量％的碳纤维，1-20重量％的金属填料。 聚酰胺树脂是全芳族聚酰胺，半芳族聚酰胺或其混合物。 碳纤维包括束形。 金属滤波器包括从由金属粉末，金属珠，金属纤维，金属薄片，金属涂覆颗粒和金属涂覆纤维组成的组中选择的一种或多种。
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公开(公告)号：KR1020120022506A
公开(公告)日：2012-03-12
申请号：KR1020100130087
申请日：2010-12-17
Applicant: 제일모직주식회사
CPC classification number: C08K3/04 , C08J5/042 , C08J2377/02 , C08J2377/06 , C08K3/041 , C08K7/06 , C08L77/02 , C08L77/06 , C08L77/10
Abstract: PURPOSE: A bracket protecting LCD for a portable display product is provided to improve modulus, impact strength, productivity, dimensional stability, and molding accuracy. CONSTITUTION: A bracket protecting LCD for a portable display product comprises polyamide resin and carbon fiber with weight ratio of 20~40 weight% to 60~80 weight%. The polyamide resin comprises aromatic poly amide and aliphatic polyamide which contains C10~20 aliphatic group. The aromatic polyamide is either wholly aromatic polyamide, semi-aromatic polyamide, or a mixture thereof. The aromatic polyamide contains polyamide marked in chemical formula 1. A glass transition temperature of the aromatic poly amide is 80-120deg.C.
Abstract translation: 目的：提供用于便携式显示产品的支架保护LCD，以提高模数，冲击强度，生产率，尺寸稳定性和成型精度。 构成：用于便携式显示产品的支架保护LCD包括聚酰胺树脂和碳纤维，重量比为20〜40重量％〜60〜80重量％。 聚酰胺树脂包含芳香族聚酰胺和含有C10〜20脂肪族基团的脂肪族聚酰胺。 芳族聚酰胺是全芳族聚酰胺，半芳族聚酰胺或其混合物。 芳香族聚酰胺含有以化学式1表示的聚酰胺。芳香族聚酰胺的玻璃化转变温度为80〜120℃。
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公开(公告)号：KR1020110079056A
公开(公告)日：2011-07-07
申请号：KR1020090136012
申请日：2009-12-31
Applicant: 제일모직주식회사
Abstract: PURPOSE: A molded product for an electronic device housing is provided to ensure excellent mechanical properties such as impact resistance and tensile strength as well as chemical resistance. CONSTITUTION: A molded product for an electronic device housing is molded from a thermoplastic resin composition including 30~70 weight% of a polycarbonate resin, 20~50 weight% of a rubber-modified vinyl copolymer resin, and 5~40 weight% of a noncrystalline polyester resin. In the molded product, the thickness is 0.2~2mm and apparent specific gravity is 0.8~2.5 g/ml.
Abstract translation: 目的：提供用于电子设备外壳的模制产品，以确保优异的机械性能，如抗冲击性和抗拉强度以及耐化学性。 构成：用于电子器件壳体的模制产品由热塑性树脂组合物模制而成，该热塑性树脂组合物包含30〜70重量％的聚碳酸酯树脂，20〜50重量％的橡胶改性乙烯基共聚物树脂和5〜40重量％ 非结晶聚酯树脂。 在成型品中，厚度为0.2〜2mm，表观比重为0.8〜2.5g / ml。
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