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公开(公告)号：KR101411017B1
公开(公告)日：2014-06-23
申请号：KR1020110143776
申请日：2011-12-27
Applicant: 제일모직주식회사
Abstract: 본 발명의 고충격 및 고강성 전자파 차폐 복합재는 (A) 열가소성 수지; (B) 제1금속 필러; (C) 제2금속 필러; (D) 카본섬유; 및 (E) 관능기를 갖는 충격보강제를 포함하여 이루어지며, 상기 열가소성 수지(A), 상기 제1금속 필러(B) 및 상기 제2금속 필러(C) 의 융점은 하기 식 1을 충족하는 것을 특징으로 한다:
[식 1]
Tma
-30 ℃ ＞
Tmb
,
Tma
+500 ℃＜
Tmc
(상기에서, Tma는 열가소성 수지(A)의 융점(℃), Tmb는 제1금속 필러(B)의 융점(℃), Tmc는 제2금속 필러(C)의 융점(℃)).-
公开(公告)号：KR100960866B1
公开(公告)日：2010-06-08
申请号：KR1020080057852
申请日：2008-06-19
Applicant: 제일모직주식회사
CPC classification number: C08L25/14 , C08K5/1345 , C08K5/3462 , C08K5/3475 , C08K5/524 , C08L25/08 , C08L25/12 , C08L35/06 , C08L55/02 , C08L67/02 , C08L2666/02 , C08L2666/18
Abstract: 본 발명은 스티렌계 수지 30∼99 중량부 및 폴리에스테르 수지 1∼70 중량부로 이루어진 기초수지 100 중량부에 대하여, 공중합 폴리에스테르 수지 0.1∼10 중량부, 1차 산화방지제로 페놀계 화합물 0.05 ∼ 2 중량부, 2차 산화방지제로 포스파이트계 화합물 0.05 ∼ 4 중량부, 할스계 화합물, 벤조트리아졸(Benzotriazole)계 화합물 및 이들의 혼합물로 이루어진 군으로부터 선택된 화합물 0.2 ∼ 6.0 중량부를 포함하는 것을 특징으로 하는 열안정성, 광안정성 및 내충격성이 우수한 스티렌계 열가소성 수지 조성물에 관한 것이다.
스티렌계 수지, 에폭시기가 포함된 스티렌계 수지, 고무강화 스티렌계 공중합 수지, 폴리에스테르, 열안정성, 광안정성, 내충격-
公开(公告)号：KR1020100006499A
公开(公告)日：2010-01-19
申请号：KR1020080066746
申请日：2008-07-09
Applicant: 제일모직주식회사
CPC classification number: C08L67/00 , C08L25/14 , C08L55/02 , C08L67/02 , C08L2666/02
Abstract: PURPOSE: A styrenic thermoplastic resin composition is provided to ensure excellent shock resistance, paintability, and property balance of chemical resistance and gloss, and to reduce production cost because separate primer process is not needed. CONSTITUTION: A styrenic thermoplastic resin composition with excellent shock resistance and paintability comprises a base resin 100.0 parts by weight and a copolyester resin 0.1~97 parts by weight. The base resin includes epoxy group-containing styrene resin 30~99 parts by weight and polyester resin 1~70 parts by weight. The epoxy group-containing styrene resin comprises an epoxy group-containing vinyl copolymer 5~100 weight% and rubber-reinforced styrenic copolymer resin 0~95 weight%.
Abstract translation: 目的：提供苯乙烯类热塑性树脂组合物，以确保优异的抗冲击性，可涂饰性和耐化学性和光泽的性能平衡，并降低生产成本，因为不需要单独的底漆工艺。 构成：具有优异的抗冲击性和可涂饰性的苯乙烯类热塑性树脂组合物包括100.0重量份的基础树脂和0.1〜97重量份的共聚酯树脂。 基础树脂包括30〜99重量份的含环氧基的苯乙烯树脂和1〜70重量份的聚酯树脂。 含环氧基的苯乙烯树脂包含5〜100重量％的含环氧基乙烯基共聚物和0〜95重量％的橡胶增强苯乙烯共聚物树脂。
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公开(公告)号：KR100875957B1
公开(公告)日：2008-12-26
申请号：KR1020070139975
申请日：2007-12-28
Applicant: 제일모직주식회사
CPC classification number: C08L51/04 , C08K5/1515 , C08L25/12 , C08L25/14 , C08L33/062 , C08L33/068 , C08L33/20 , C08L35/06 , C08L55/02 , C08L67/00 , C08L2205/03 , C08L2666/02
Abstract: An impact resistant thermoplastic resin composition, and a molded product prepared by using the composition are provided to improve chemical resistance and impact resistance and to enhance extrusion moldability. An impact resistant thermoplastic resin composition comprises 100 parts by weight of a base resin which comprises 1-98 wt% of a vinyl copolymer resin containing an epoxy group which comprises 0.01-5.0 mol% of an epoxy compound and 95-99.99 mol% of a vinyl-based compound, 1-98 wt% of a rubber reinforced styrene-based copolymer resin, and 1-98 wt% of a polyester resin; and 1-6 parts by weight of an ultrahigh molecular weight aromatic vinyl-cyanovinyl copolymer resin having a weight average molecular weight of 1,000,000-5,000,000.
Abstract translation: 提供抗冲击热塑性树脂组合物和通过使用该组合物制备的模塑产品以改善耐化学性和耐冲击性并提高挤出成型性。 耐冲击热塑性树脂组合物包含100重量份的基础树脂，其包含1-98重量％的包含环氧基的乙烯基共聚物树脂，其包含0.01-5.0摩尔％的环氧化合物和95-99.99摩尔％的 乙烯基类化合物，1-98重量％橡胶增强苯乙烯类共聚物树脂和1-98重量％聚酯树脂; 和1-6重量份的重均分子量为1,000,000-5,000,000的超高分子量芳族乙烯基 - 氰乙烯基共聚物树脂。
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公开(公告)号：KR101374363B1
公开(公告)日：2014-03-17
申请号：KR1020100136067
申请日：2010-12-27
Applicant: 제일모직주식회사
CPC classification number: G06F1/1637 , C08K7/06 , C08K2201/011 , C08L77/02 , C08L77/06 , C08L77/10 , C08L2205/02 , G06F1/1601
Abstract: 본 발명의 휴대용 디스플레이 제품의 LCD 보호용 브라켓은 (A) 폴리아미드 수지 및 (B) 카본섬유를 포함하여 이루어지며, 상기 (A) 폴리아미드 수지와 (B) 카본섬유의 중량비는 (A):(B)=20~40 중량%: 60~80 중량%이고, 상기 (A) 폴리아미드 수지는 (a1)탄소수 4~6의 지방족기를 주쇄로 함유하는 지방족 폴리아미드 및 (a2)방향족 폴리아미드를 포함하는 것을 특징으로 한다.
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Patent Agency Ranking
公开(公告)号：KR1020130075417A
公开(公告)日：2013-07-05
申请号：KR1020110143776
申请日：2011-12-27
Applicant: 제일모직주식회사
CPC classification number: H05K9/0081 , C08L101/00 , C08L2203/20 , C08L2666/30 , C08L2666/72 , C08L2666/84
Abstract: PURPOSE: A high impact and high stiffness electromagnetic shielding composite is provided to improve conductivity by increasing mechanical strength. CONSTITUTION: A thermoplastic resin is formed of crystalline thermoplastic resin. Second metal filler (20) is equipped with a sphere or flake shape. The weight ratio of first metal filler (10) is formed with 1:1. The weight ratio of the second metal filler is formed with 3:1. The diameter of a carbon fiber (30) is 3-10 μm.
Abstract translation: 目的：提供高冲击和高刚度的电磁屏蔽复合材料，以通过增加机械强度来提高导电性。 构成：热塑性树脂由结晶热塑性树脂形成。 第二金属填料（20）装有球形或薄片状。 第一金属填料（10）的重量比为1:1。 第二金属填料的重量比形成为3:1。 碳纤维（30）的直径为3-10μm。
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公开(公告)号：KR1020120077599A
公开(公告)日：2012-07-10
申请号：KR1020100139622
申请日：2010-12-30
Applicant: 제일모직주식회사
Abstract: PURPOSE: A thermoplastic resin composition is provided to enhance mobility such as a melt flow index, heat resistance, and impact strength. CONSTITUTION: A thermoplastic resin composition comprises a styrene based polymer which includes epoxy group, a recycled polyester resin, a polycarbonate, N- phenylmaleimide based heat-proof reinforcing agent, a thermal stabilizer, and a lubricant. The styrene based polymer which includes epoxy group is composed of vinyl copolymer which includes epoxy group and rubber strengthening styrenic copolymer resin. The recycled polyester resin is a recycled polyethylene terephthalate. 1-30 parts by weight of the recycled polyester resin is included based on 100 parts by weight of base resin which consists of styrene based polymer, recycled polyester resin, and polycarbonate and N- phenylmaleimide based heat-proof reinforcing agent. The melt flow index of the resin composition is 8-25 g/10 minutes.
Abstract translation: 目的：提供热塑性树脂组合物以提高流动性，例如熔体流动指数，耐热性和冲击强度。 构成：热塑性树脂组合物包含包含环氧基的苯乙烯基聚合物，再循环聚酯树脂，聚碳酸酯，N-苯基马来酰亚胺基的耐热增强剂，热稳定剂和润滑剂。 包括环氧基的苯乙烯基聚合物由包含环氧基和橡胶强化苯乙烯共聚物树脂的乙烯基共聚物组成。 回收的聚酯树脂是回收的聚对苯二甲酸乙二醇酯。 基于100重量份由苯乙烯基聚合物，再循环聚酯树脂和聚碳酸酯和N-苯基马来酰亚胺基耐热增强剂组成的基础树脂，包括1-30重量份的再循环聚酯树脂。 树脂组合物的熔体流动指数为8-25g / 10分钟。
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公开(公告)号：KR1020110079492A
公开(公告)日：2011-07-07
申请号：KR1020100101870
申请日：2010-10-19
Applicant: 제일모직주식회사
Abstract: PURPOSE: A electronic housing mold and a manufacturing method of the same are provided to reduce the total weight by decreasing the specific gravity and to change the form of succession into form of mold by using the pressure difference between the inside of the mold and outside of the mold. CONSTITUTION: The electronic housing mold has 0.2~2 mm of thickness. The apparent specific gravity of the molded product for the electronic device housing is 0.8~2.5 g/ml. The width / thickness of the molded product for the electronic device housing is 300,000~1500,000mm. The width / thickness of the molded product for the electronic device housing 500,000~1500,000mm. The electronic housing mold is manufactured by vacuum molding the extrusion flat board to have single layer or multi-layers. The curve modulus of the molded product for the electronic device housing is 1.8~20Gpa. The molded product for the electronic device housing is manufactured from the thermoplastic resin which is capable of extrusion.
Abstract translation: 目的：提供一种电子外壳模具及其制造方法，通过降低比重来降低总重量，并通过使用模具内部和外部之间的压力差将模具形式改变成模具的形式 模具。 规定：电子外壳模具的厚度为0.2〜2mm。 电子设备外壳的成型品的表观比重为0.8〜2.5g / ml。 电子设备外壳的成型品的宽度/厚度为30万〜150万。 用于电子设备外壳的模制产品的宽度/厚度为500,000〜1500,000mm。 电子外壳模具通过将挤出平板真空成型为具有单层或多层制造。 电子设备外壳的模制产品的弯曲模量为1.8〜20Gpa。 用于电子器件壳体的模制产品由能够挤出的热塑性树脂制成。
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公开(公告)号：KR1020110078945A
公开(公告)日：2011-07-07
申请号：KR1020090135872
申请日：2009-12-31
Applicant: 제일모직주식회사
Abstract: PURPOSE: Molded articles for electronic device housings and a method for preparing the same are provided to ensure excellent dimensional stability and mechanical strength and to secure thin thickness using a thermoplastic resin. CONSTITUTION: A molded product for an electronic device housing is molded from a thermoplastic resin composition including (A) 50-90 wt% of a polycarbonate resin and (B) 20 ~ 50 wt% of a polyester resin. The molded product for an electronic device housing has the thickness of 0.2-2mm and 0.8-2.5 g/ml of apparent specific gravity.
Abstract translation: 目的：提供用于电子设备外壳的模制品及其制备方法，以确保优异的尺寸稳定性和机械强度，并使用热塑性树脂确保薄的厚度。 构成：由（A）50-90重量％的聚碳酸酯树脂和（B）20〜50重量％的聚酯树脂的热塑性树脂组合物成型电子器件外壳的成型体。 用于电子设备外壳的模制产品具有0.2-2mm的厚度和0.8-2.5g / ml的表观比重。
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公开(公告)号：KR1020130065457A
公开(公告)日：2013-06-19
申请号：KR1020110132315
申请日：2011-12-09
Applicant: 제일모직주식회사
IPC: C08L101/12 , C08K3/08 , C08K7/02 , C08J5/00
Abstract: PURPOSE: A thermoplastic resin composition is provided to have excellent processability, high bending strength, low surface resistance, high electric conductivity, and excellent electronic wave blocking effect. CONSTITUTION: A thermoplastic resin composition comprises 5-30 wt% of a first filler which is a fusible metal; 1-20 wt% of a second filler which is a non-fusible metal or fused of a metal and inorganic material; 10-60 wt% of a conductive fiber third filler; and 10-84 wt% of a thermoplastic resin. The first filler is a fusible metal filler which has a lower melting point than the melting point of the thermoplastic resin by 30 °C or more. The second filler is a fusible metal filler or fused filler of metal ad inorganic material which has a higher melting point than the melting point of the thermoplastic resin by 500 °C or more.
Abstract translation: 目的：提供热塑性树脂组合物以具有优异的加工性，高弯曲强度，低表面电阻，高导电性和优异的电子阻挡效果。 构成：热塑性树脂组合物包含5-30重量％的作为易熔金属的第一填料; 1-20重量％的第二填料，它是非易熔金属或熔融金属和无机材料; 10-60重量％的导电纤维第三填料; 和10-84重量％的热塑性树脂。 第一填料是熔融金属填料，其熔点比热塑性树脂的熔点低30℃以上。 第二填料是金属和无机材料的熔融金属填料或熔融填料，其熔点比热塑性树脂的熔点高500℃以上。
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