Abstract:
Provided is a method for manufacturing a flexible electronic device using a water-soluble adhesive comprising the following steps of: manufacturing an electronic device in a sacrificial substrate; adhering the electronic device to a water penetrating support layer capable of fixating the electronic device using a water-soluble adhesive; separating the electronic device from the sacrificial substrate; transcribing the electronic device by contacting the electronic device to a flexible substrate using the water penetrating support layer; dissolving the water-soluble adhesive by contacting water to the water penetrating support layer; and removing the water penetrating support layer.
Abstract:
PURPOSE: A flexible gallium nitride light-emitting diode element production method and a flexible gallium nitride light-emitting diode element produced thereby are provided to facilitate an establishment of neural circuit as light on-and-off stimulation of the neural circuit is enabled in various parts through an LED array which is turned on and off independently. CONSTITUTION: A gallium nitride light-emitting diode unit element is equipped on a substrate (100) and contains an n-gallium nitride layer (202) laminated in an order, a light-emitting layer (203), and a p-gallium nitride layer. A metal contact is laminated on the n-gallium nitride layer and a p-gallium nitride layer of the gallium nitride light-emitting diode unit element. A first metal line and a second metal line connect the metal contact laminated on the n-gallium nitride layer and the p-gallium nitride layer of the gallium nitride light-emitting diode unit element. The metal contact is laminated on the first metal line and the second metal line.
Abstract:
PURPOSE: A GaN LED array device for a photo-dielectric crane is provided to have the flexibility, thereby easily stimulating the meandering surface. CONSTITUTION: A GaN LED device is manufactured on a sacrificial substrate. The GaN LED device is separated from the sacrificial substrate. The separated GaN LED device is transferred to a plastic substrate(500). The GaN LED device generates the blue light of the wavelength band less than 470nm. The GaN LED device activates the protein which reacts to the blue light.
Abstract translation:目的:提供一种用于光电介质起重机的GaN LED阵列装置,以具有灵活性,从而容易地刺激蜿蜒曲面。 构成:在牺牲衬底上制造GaN LED器件。 GaN LED器件与牺牲衬底分离。 分离的GaN LED器件被转移到塑料基板(500)。 GaN LED器件产生小于470nm的波长带的蓝色光。 GaN LED器件激活与蓝光反应的蛋白质。
Abstract:
층상구조 기판을 이용한 플라스틱 소자 제조방법, 이에 따라 제조된 플라스틱 소자 및 그 응용이 제공된다. 본 발명에 따른 플라스틱 전지소자 제조방법은 층상구조 기판상에 소자를 제조하는 단계; 및 상기 층상구조 기판의 층을 박리시켜, 상기 층상구조 기판을 제거하는 단계;를 포함하는 것을 특징으로 한다.
Abstract:
PURPOSE: A flexible solid secondary battery is provided to have stable flexible performance and to have excellent efficiency and battery performance. CONSTITUTION: A flexible solid secondary battery comprises a polymer layer(400), and a battery layer mounted in the polymer layer. The battery layer is located in a range of ±20% of total thickness from a neutral dynamic layer which is generated from the polymer layer and has a theoretical strain of zero. The battery layer consists of a laminated current collector, positive electrode, electrolyte, and a negative electrode. The battery layer is manufactured on the sacrifice substrate and transcribed to the polymer layer.
Abstract:
PURPOSE: A GaN LED device for optogenetics is provided to be used in a narrow space by controlling a size and reducing a weight. CONSTITUTION: A plurality of GaN LED unit device arrays are laminated on a plastic substrate(500). A contact line is connected to a plurality of GaN LED unit devices. A passivation layer(330) is laminated on the plurality of GaN LED unit devices. A part of the contact line is exposed to the outside through the passivation layer. The GaN LED unit device array for the optogenetics generates blue light of a wavelength band less than 470 nm and activates protein.
Abstract:
희생기판을 이용한 플라스틱 압전소자 제조방법, 이에 따라 제조된 플라스틱 압전소자가 제공된다. 본 발명에 따른 플렉서블 압전소자 제조방방법은 희생기판 상에 압전소자를 제조하는 단계; 상기 희생기판을 제거한 후, 상기 압전소자를 플라스틱 기판으로 옮기는 단계를 포함하는 것을 특징으로 한다.
Abstract:
PURPOSE: A manufacturing method for a plastic piezoelectric device using a sacrificial substrate and a plastic piezoelectric device manufactured by the same are provided to increase the reliability of a process without removing a lower plate using wet etching. CONSTITUTION: A piezoelectric element(200) is manufactured on a sacrificial substrate. The piezoelectric element is transferred to a plastic substrate(800) after the sacrificial substrate is eliminated. The piezoelectric element is manufactured on a layered substrate. The layered substrate is removed by stripping a layer of the layered substrate. The piezoelectric element is transferred to the plastic substrate.
Abstract:
PURPOSE: A manufacturing method of plastic element is provide to improve reliability of process because of not using wet etching method to remove a lower substrate, and to effectively solve a substrate deformation generated by free-standing in solution state. CONSTITUTION: A manufacturing method of plastic element comprises: a step of manufacturing an element on a layered structure substrate; a step of removing the layered structure substrate by separating layers of the substrate. The layered structure substrate is mica substrate. A plastic battery element manufactured by the method comprises: a plastic substrate(600), and a battery element(200) laminated on the plastic substrate. The battery element is manufactured in the mica substrate, and transferred to the plastic substrate.