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公开(公告)号：KR101346583B1
公开(公告)日：2014-01-03
申请号：KR1020130058564
申请日：2013-05-23
Applicant: 한국기계연구원 , (주)에스엠인스트루먼트
CPC classification number: H04R31/006 , G01S3/808 , H04R1/04 , H04R2201/003
Abstract: The present invention relates to a sound measuring apparatus with a flexible substrate using a MEMS microphone and a manufacturing method thereof. The purpose of the present invention is to provide the sound measuring apparatus with the flexible substrate using the MEMS microphone and the manufacturing method thereof, capable of easily and stably being attached to a complex structure by flexibly changing a shape by forming the MEMS microphone on the flexible substrate.
Abstract translation: 本发明涉及一种使用MEMS麦克风的柔性基板的声音测量装置及其制造方法。 本发明的目的是提供具有使用MEMS麦克风的柔性基板的声音测量装置及其制造方法，其能够通过在MEMS传感器上形成MEMS麦克风来灵活地改变形状而容易且稳定地附着到复杂结构 柔性基材。
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公开(公告)号：KR101334578B1
公开(公告)日：2013-11-28
申请号：KR1020120050439
申请日：2012-05-11
Applicant: 이화여자대학교 산학협력단 , 한국기계연구원
IPC: H01L23/12
Abstract: 본 발명은, 개구부를 포함하는 전자기기 패키지에 관한 것으로, 보다 상세하게는, 센서부 및 센서부를 포함하고 센서부에 대응하는 위치에 형성된 개구부를 포함하는 패키지를 포함하고, 개구부는 복수 개의 홀부 및 비홀부를 포함하고 비홀부에 형성된 나노 구조물을 포함한다.
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公开(公告)号：KR1020130126362A
公开(公告)日：2013-11-20
申请号：KR1020120050439
申请日：2012-05-11
Applicant: 이화여자대학교 산학협력단 , 한국기계연구원
IPC: H01L23/12
Abstract: The present invention relates to a package for electronic equipment with opening part. Particularly, the package for electronic equipment includes a sensor part and an opening part including the sensor part and formed in a position corresponding to the sensor part. The opening part includes hole parts and non-hole part and a nanostructure formed on the non-hole part.
Abstract translation: 本发明涉及一种具有开口部分的电子设备的包装。 特别地，电子设备用包装件包括传感器部件和包括传感器部件并且形成在与传感器部件相对应的位置的开口部分。 开口部包括形成在非孔部上的孔部和非孔部以及纳米结构。
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公开(公告)号：KR1020130099731A
公开(公告)日：2013-09-06
申请号：KR1020120021458
申请日：2012-02-29
Applicant: 한국기계연구원
Abstract: PURPOSE: A hybrid electrothermal pin with hydrophilic and hydrophobic properties and a manufacturing method thereof are provided to support the function to form water drop and to rapidly form the water drop as a condensation core is positioned on the coating of a hydrophilic material in an evaporation or spraying method. CONSTITUTION: A hybrid electrothermal pin with hydrophilic and hydrophobic properties comprises a substrate, a hydrophobic coating layer (114), hydrophilic condensation cores (111). The hydrophobic coating layer is coated on the substrate. The hydrophilic condensation cores are positioned in the hydrophobic coating layer. The hydrophilic condensation cores include a hydrophilic metal particle. The hydrophilic condensation cores consist of aluminium or cuprum in which thermal conduction coefficient is high.
Abstract translation: 目的：提供具有亲水和疏水特性的混合电热销及其制造方法，以支持形成水滴的功能，并且当冷凝芯位于蒸发中的亲水材料的涂层上时快速形成水滴， 喷涂方法。 构成：具有亲水性和疏水性的混合电热销包括基底，疏水性涂层（114），亲水性缩合核心（111）。 疏水涂层涂覆在基材上。 亲水缩合核心位于疏水涂层中。 亲水性缩合核心包括亲水性金属颗粒。 亲水缩合核心由导热系数高的铝或铜制成。
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公开(公告)号：KR101118627B1
公开(公告)日：2012-03-06
申请号：KR1020110044380
申请日：2011-05-12
Applicant: 한국기계연구원
CPC classification number: H04R19/005 , H01L29/84 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: PURPOSE: An MEMS(Micro Electro Mechanical System) microphone and a manufacturing method thereof are provided to obtain a thickness of a solder part for stable bonding by forming a solder settling part on a membrane part or a back plate part. CONSTITUTION: A first electrode and a first wet layer is formed on a top portion of a first nitride film which is formed in one side of a first silicon substrate(S11). A first solder part is formed on the top portion of the first wet layer(S12). The other side of the first silicon substrate is etched(S13). A membrane part is manufactured(S10). A back plate is formed by etching one side of a second silicon substrate having a second nitride film(S21). A solder settling part is formed by etching the other side of the second silicon substrate(S22). A second electrode and a second wet layer are formed on the top portion of the solder settling part(S23). An acoustic hole is formed on a back plate(S24). A back plate part is manufactured(S20). The membrane part and the back plate part are connected by welding the first solder part and the second solder part(S30).
Abstract translation: 目的：提供一种MEMS（微机电系统）麦克风及其制造方法，以通过在膜部件或背板部件上形成焊料沉降部件来获得用于稳定接合的焊料部分的厚度。 构成：第一电极和第一湿层形成在形成在第一硅衬底的一侧的第一氮化物膜的顶部（S11）上。 第一焊接部分形成在第一湿层的顶部（S12）上。 蚀刻第一硅衬底的另一侧（S13）。 制造膜部（S10）。 通过蚀刻具有第二氮化物膜的第二硅衬底的一侧来形成背板（S21）。 通过蚀刻第二硅衬底的另一侧形成焊料沉积部分（S22）。 第二电极和第二湿层形成在焊料沉降部分的顶部（S23）上。 在背板上形成声孔（S24）。 制造背板部（S20）。 通过焊接第一焊料部和第二焊料部来连接膜部和背板部（S30）。
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Patent Agency Ranking
公开(公告)号：KR102210567B1
公开(公告)日：2021-02-02
申请号：KR1020180166551
申请日：2018-12-20
Applicant: 한국기계연구원
Abstract: 본발명은고내열성초발수표면처리방법및 장치에관한것으로, 일실시예에서, 기재표면이소정범위의조도를갖도록요철을형성하기위해기재표면에블라스팅처리를행하는단계; 및서스펜션플라즈마용사코팅에의해코팅용용액을기재표면에분사하여초발수코팅막을형성하는단계;를포함하며, 상기코팅용용액은 (i) 불소(F), 질소(N), 탄소(C), 또는실리콘(Si) 중하나를도핑한금속산화물미세입자를용매에분산시킨슬러리용액; 또는 (ii) 금속산화물미세입자를용매에분산시킨슬러리용액및 불소(F), 질소(N), 탄소(C), 또는실리콘(Si) 중하나를도핑한금속산화물미세입자를용매에분산시킨슬러리용액;인것을특징으로하는고내열성초발수표면처리방법을개시한다.
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公开(公告)号：KR1020160051960A
公开(公告)日：2016-05-12
申请号：KR1020140149367
申请日：2014-10-30
Applicant: 한국기계연구원
CPC classification number: A61F2/18 , A61F2002/183 , A61F2002/482 , H04R25/48
Abstract: 넓은주파수대역의소리를감지할수 있도록구조가개선된인공와우패키지에관한것이다. 인공와우패키지는하우징과, 가진막과, 인공기저막, 및파이프를포함한다. 하우징은내부에유체를저장한다. 가진막은하우징외부의소리에의해진동가능하게설치된다. 인공기저막은하우징내부에서가진막의진동에의한유체의진동을감지하여주파수대역별로구별하고, 구별된주파수를전기신호로변환하여출력한다. 파이프는하우징의외부에배치되며, 하우징의내부와연통된다.
Abstract translation: 本发明涉及一种具有改进结构的人造耳蜗包装，能够感测宽范围内的频率声音。 用于人造耳蜗的包装包括壳体，人造振动膜，人造基底膜和管。 房屋内储存液体 安装人造振动膜以响应于外部声音振动。 壳体内的人造基底膜检测由人造振动膜的振动引起的流体的振动，并且根据其频率范围进行微分，然后将微分频率转换为电信号并将其传输。 管道设置在壳体外部，并且连接到壳体的内部。
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公开(公告)号：KR101510304B1
公开(公告)日：2015-04-10
申请号：KR1020120021458
申请日：2012-02-29
Applicant: 한국기계연구원
Abstract: 열교환기에사용되는전열핀에있어서, 기판, 기판상에소수성물질로코팅된소수성코팅층, 및소수성코팅층에위치된복수의포함하는하이브리드전열핀이개시된다. 이로써, 전열핀에물방울이효과적으로빨리맺히게할 수있고, 맺힌물방울을보다효과적으로제거시킬수 있게된다.
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