Abstract:
PURPOSE: A polyamic acid derivative having an imide side chain containing double bond for a liquid crystal alignment layer and a monomer for the preparation of the polyamic acid derivative are provided, to improve heat resistance, solubility, surface strength, transparency, vertical alignment of liquid crystal and rubbing resistance. CONSTITUTION: The polyamic acid derivative is represented by the formula 1, wherein n is an integer of 1-300 and m is an integer of 1-30. Preferably the polyamic acid derivative has an intrinsic viscosity of 0.3-1.5 dL/g, a molecular weight of 10,000-150,000 g/mol, a surface pencil hardness of H to 7H, a pretilt angle of 88-89.9 degree and a pretilt angle after rubbing of 70-89.9 degree, is soluble in a solvent selected from the group consisting of dimethyl acetamide, dimethyl formamide, N-methyl-2-pyrrolidone, tetrahydrofuran, chloroform, acetone, ethyl acetate and γ-butyrolactone, and has an imidation temperature of 200-300 deg.C. The monomer is represented by the formula 2, wherein m is an integer of 1-30.
Abstract:
PURPOSE: An acid liable polyamide polymer and a photosensitive heat resisting insulator composition containing the polymer are provided, which are improved in the photosensitivity, the resolution, the mechanical properties and the flatness of coating. CONSTITUTION: The acid liable polyamide polymer has a repeating unit represented by the formula 1, and contains an acetal or carbonate side group as an acid liable group and a terminal group containing an acetylene group, wherein Ar1 is a tetravalent aromatic group; Ar2 is a divalent aromatic group; R1 and R2 are the same or different each other and are an acid liable group comprising carbonate or acetal; T1 and T2 are the same or different each other and are a terminal group comprising acetylene group; and m and n are an integer of 5-100, respectively. The acid liable polyamide polymer can be a homopolymer or a copolymer according to the combination of Ar1 and Ar2. The photosensitive heat resisting insulator composition comprises the polyamide polymer; and 0.3-15 wt% of a photoacid generator.
Abstract:
PURPOSE: A novel polyamide polymer capable of preventing an increase of a dielectric constant by the remaining hydroxyl group and having high heat resistance by transforming a hydroxyl group produced by pyrolysis of acetal or a side chain of its cyclic derivatives by heating a patterned exposed section to a thermally stable benzoxazole group and photosensitive heat resistant insulator composition are provided, which are useful as a layer insulation film of a passivation layer of semiconductors, a buffer coat or composite multilayer PCP. CONSTITUTION: A polyamide polymer having an intrinsic viscosity of 0.1 to 2.5 dL/g contains the formula 1 as a repeating unit and a photosensitive heat resistant insulator composition contains 0.3 to 20% by weight of a photoacid generator based on the polyamide. A concentration of an acid sensitive group (-OR1 or -OR2) is 3 to 70%. The photoacid generator is a material for generating an acid by absorbing light in an area of long wavelength (more than 300nm) as compared to an absorbing area of polyamide