Abstract:
본 발명은 이중결합 함유 이미드 측쇄기를 갖는 폴리아믹산 유도체에 관한 것으로서, 보다 상세하게는 지방족 테트라카르복실산이무수물과 이중결합 함유 이미드 측쇄기를 갖는 방향족 디아민을 적정비율로 포함한 혼합물을 용액중합함으로써 폴리아믹산 유도체에 이중 결합이 함유된 이미드 측쇄기를 부여하고, 이를 원료로하여 내열성, 용해성, 표면강도특성, 기계적 특성, 투명성, 액정의 수직배향성 및 특히 내러빙특성이 우수한 폴리이미드 수지 유도체를 제조할 수 있고, 액정 공정에 대한 안정성이 우수하기 때문에 수직배향형 TFT-TN 및 STN LCD용 액정배향막으로의 응용이 가능한 폴리이미드 수지 유도체를 제조할 수 있는 신규한 이중결합 함유 이미드 측쇄기를 갖는 폴리아믹산 유도체에 관한 것이다.
Abstract:
PURPOSE: A polyamic acid derivative having an aliphatic ring-based side chain for a liquid crystal alignment layer is provided, to improve the heat resistance, the surface strength characteristic, the transparency, the pretilt angle of liquid crystal and the solubility of the polyamic acid derivative. CONSTITUTION: The polyamic acid derivative is represented by the formula 1, wherein n is an integer of 1-300. Preferably the polyamic acid derivative has an intrinsic viscosity of 0.3-1.5 dL/g, a molecular weight of 10,000-150,000, a glass transition temperature of 230-400 deg.C, a pretilt angle of 4-89.5 degree, and an imidization temperature of 200-300 deg.C. The polyamic acid derivative is soluble in dimethylacetamide, dimethylformamide, N-methyl-2-pyrrolidone, tetrahydrofuran, chloroform, acetone, ethyl acetate or γ-butyrolactone.
Abstract:
PURPOSE: An acid liable polyamide polymer and a photosensitive heat resisting insulator composition containing the polymer are provided, which are improved in the photosensitivity, the resolution, the mechanical properties and the flatness of coating. CONSTITUTION: The acid liable polyamide polymer has a repeating unit represented by the formula 1, and contains an acetal or carbonate side group as an acid liable group and a terminal group containing an acetylene group, wherein Ar1 is a tetravalent aromatic group; Ar2 is a divalent aromatic group; R1 and R2 are the same or different each other and are an acid liable group comprising carbonate or acetal; T1 and T2 are the same or different each other and are a terminal group comprising acetylene group; and m and n are an integer of 5-100, respectively. The acid liable polyamide polymer can be a homopolymer or a copolymer according to the combination of Ar1 and Ar2. The photosensitive heat resisting insulator composition comprises the polyamide polymer; and 0.3-15 wt% of a photoacid generator.
Abstract:
PURPOSE: A polyamic acid derivative having an imide side chain containing double bond for a liquid crystal alignment layer and a monomer for the preparation of the polyamic acid derivative are provided, to improve heat resistance, solubility, surface strength, transparency, vertical alignment of liquid crystal and rubbing resistance. CONSTITUTION: The polyamic acid derivative is represented by the formula 1, wherein n is an integer of 1-300 and m is an integer of 1-30. Preferably the polyamic acid derivative has an intrinsic viscosity of 0.3-1.5 dL/g, a molecular weight of 10,000-150,000 g/mol, a surface pencil hardness of H to 7H, a pretilt angle of 88-89.9 degree and a pretilt angle after rubbing of 70-89.9 degree, is soluble in a solvent selected from the group consisting of dimethyl acetamide, dimethyl formamide, N-methyl-2-pyrrolidone, tetrahydrofuran, chloroform, acetone, ethyl acetate and γ-butyrolactone, and has an imidation temperature of 200-300 deg.C. The monomer is represented by the formula 2, wherein m is an integer of 1-30.
Abstract:
PURPOSE: An acid liable polyamide polymer and a photosensitive heat resisting insulator composition containing the polymer are provided, which are improved in the photosensitivity, the resolution, the mechanical properties and the flatness of coating. CONSTITUTION: The acid liable polyamide polymer has a repeating unit represented by the formula 1, and contains an acetal or carbonate side group as an acid liable group and a terminal group containing an acetylene group, wherein Ar1 is a tetravalent aromatic group; Ar2 is a divalent aromatic group; R1 and R2 are the same or different each other and are an acid liable group comprising carbonate or acetal; T1 and T2 are the same or different each other and are a terminal group comprising acetylene group; and m and n are an integer of 5-100, respectively. The acid liable polyamide polymer can be a homopolymer or a copolymer according to the combination of Ar1 and Ar2. The photosensitive heat resisting insulator composition comprises the polyamide polymer; and 0.3-15 wt% of a photoacid generator.
Abstract:
PURPOSE: A novel polyamide polymer capable of preventing an increase of a dielectric constant by the remaining hydroxyl group and having high heat resistance by transforming a hydroxyl group produced by pyrolysis of acetal or a side chain of its cyclic derivatives by heating a patterned exposed section to a thermally stable benzoxazole group and photosensitive heat resistant insulator composition are provided, which are useful as a layer insulation film of a passivation layer of semiconductors, a buffer coat or composite multilayer PCP. CONSTITUTION: A polyamide polymer having an intrinsic viscosity of 0.1 to 2.5 dL/g contains the formula 1 as a repeating unit and a photosensitive heat resistant insulator composition contains 0.3 to 20% by weight of a photoacid generator based on the polyamide. A concentration of an acid sensitive group (-OR1 or -OR2) is 3 to 70%. The photoacid generator is a material for generating an acid by absorbing light in an area of long wavelength (more than 300nm) as compared to an absorbing area of polyamide
Abstract:
본 발명은 이미드 고리 함유 측쇄기를 갖는 액정배향막용 폴리아믹산 유도체와 그의 제조방법에 관한 것으로서, 보다 상세하게는 지방족 고리계 산이무수물을 적정비율 이상 포함하는 산이무수물과 이미드 고리 함유 측쇄기를 갖는 방향족 디아민을 적정비율 이상 포함하는 방향족 디아민류를 용액중합함으로써, 제조된 폴리아믹산이 이미드 고리를 측쇄기로 갖게 되어 내열성과 표면강도 특성 등의 기계적특성과 투명성 및 액정의 수직 배향성이 우수한 폴리이미드 수지를 제조할 수 있는 신규한 폴리아믹산 유도체와 그의 제조방법에 관한 것이다.
Abstract:
PURPOSE: A polyamic acid derivative having an imide ring-containing side chain for a liquid crystal alignment layer and a monomer for the preparation of the polyamic acid derivative are provided, to improve heat resistance, surface strength, transparency and vertical alignment of liquid crystal. CONSTITUTION: The polyamic acid derivative is represented by the formula 1, wherein n is an integer of 1-300 and m is an integer of 1-30. Preferably the polyamic acid derivative has an intrinsic viscosity of 0.3-1.5 dL/g, a molecular weight of 10,000-150,000 g/mol, a glass transition temperature of 230-400 deg.C and a pretilt angle of 85-89.9 degree, is soluble in a solvent selected from the group consisting of dimethyl acetamide, dimethyl formamide, N-methyl-2-pyrrolidone, tetrahydrofuran, chloroform, acetone, ethyl acetate and γ -butyrolactone, and has an imidation temperature of 200-300 deg.C. The monomer is represented by the formula 2, wherein m is an integer of 1-30.