Abstract:
PURPOSE: A metal substrate module for an LED, a manufacturing method thereof, and an LED package for a vehicle using the same are provided to improve heat dissipation by growing an insulation layer on a metal substrate without solder by an anodizing process. CONSTITUTION: A metal substrate(111) is anodized. An insulation layer(112) is made of metal oxide laminated on one side of the metal substrate by an anodizing process. A conductive layer(113) is formed on the insulation layer to form a circuit pattern and an electrode for operating an LED. A metal junction layer(114) for a heat radiation is formed on a surface which is opposite to the insulation layer of the metal substrate and is connected to a radiator.
Abstract:
PURPOSE: A steering wheel heater is provided to simplify the structure thereof by not requiring a temperature sensor and a controller. CONSTITUTION: A steering wheel heater is formed by winding a sheet-shaped PTC(positive temperature coefficient) heater(10) around a steering wheel body portion. The PTC heater comprises a base layer(11), a PTC material layer(12), and electrodes(13,14). The base layer surrounds the PTC material layer and the electrodes. The PTC material layer is fixed to one surface of the base layer. The electrodes are fixed to one surface of the base layer to touch the PTC material layer.
Abstract:
PURPOSE: A method for bonding a heat sink and a printed circuit board is provided to increase bonding force and heat dissipation by inserting a heating foil between a printed circuit board and a heat sink. CONSTITUTION: A solder layer(300) is respectively formed on both sides facing a heat sink(200) and a printed circuit board(100). A heating foil(400) is inserted between the printed circuit board and the heat sink. The printed circuit board includes an LED chip(110) and a circuit board(120). The heat sink includes a bonding unit(210) and a radiating unit(220). The solder layer increases the thermal conductivity of the heat sink and the printed circuit board. The solder layer includes 0-50% of indium, 0-30% of silver, 0-10% of copper, and 0-100% of bismuth. The heating foil is used to bond solder layers respectively formed on the printed circuit board and the heat sink.