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公开(公告)号：US20210098678A1
公开(公告)日：2021-04-01
申请号：US15733294
申请日：2018-12-20
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ravi Palaniswamy , Antonny E. Flor , HongQian Bao , Jaime L. Angeles , Jae Yong Lee , Mahmut Aksit
Abstract: Flexible thermoelectric devices including a flexible heat management layer on the hot side thereof, and methods of making and using the same, are provided. The flexible heat management layer includes a water harvesting material configured to absorb water or moisture and dissipate heat by evaporation of the absorbed water or moisture. In some cases, the water harvesting material includes a mixture of a superabsorbent polymer (SAP) material and a metal-organic framework (MOF) material.
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公开(公告)号：US20200236780A1
公开(公告)日：2020-07-23
申请号：US16843282
申请日：2020-04-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Nicholas T. Gabriel , Ronald D. Jesme , Andrew J. Ouderkirk , Ravi Palaniswamy , Andrew P. Bonifas , Alejandro Aldrin A. Narag, II , Robert M. Jennings , Robin E. Gorrell
Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
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公开(公告)号：US20170359894A1
公开(公告)日：2017-12-14
申请号：US15536394
申请日：2015-12-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Nicholas T. Gabriel , Ronald D. Jesme , Andrew J. Ouderkirk , Ravi Palaniswamy , Andrew P. Bonifas , Alejandro Aldrin A. Narag, II , Robert M. Jennings , Robin E. Gorrell
Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
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公开(公告)号：US20170290212A1
公开(公告)日：2017-10-05
申请号：US15626373
申请日：2017-06-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agacaoili Narag , Siang Sin Foo , Fong Liang Tan , Wei Meng Pee , Andrew J. Ouderkirk , Justine A. Mooney
IPC: H01L23/498 , H01L33/62
CPC classification number: H01L23/4985 , H01L23/498 , H01L23/49838 , H01L23/49872 , H01L24/17 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/00 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/112 , H05K1/189 , H05K2201/10106
Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.
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公开(公告)号：US09564568B2
公开(公告)日：2017-02-07
申请号：US14859512
申请日：2015-09-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
CPC classification number: H01L33/647 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/0203 , H05K1/0277 , H05K1/183 , H05K1/189 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
Abstract translation: 一种制品包括具有第一和第二主表面的柔性聚合物电介质层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。
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Patent Agency Ranking
公开(公告)号：US20210195743A1
公开(公告)日：2021-06-24
申请号：US16077804
申请日：2017-02-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Donato G. Caraig , Choong Meng How , Ravi Palaniswamy , Alejandro Aldrin A. Narag, II , Bing Liu
Abstract: A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.
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公开(公告)号：US10818642B2
公开(公告)日：2020-10-27
申请号：US16243420
申请日：2017-07-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Alejandro Aldrin Il A. Narag , Ravi Palaniswamy
Abstract: A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.
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公开(公告)号：US10653006B2
公开(公告)日：2020-05-12
申请号：US15536394
申请日：2015-12-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Nicholas T. Gabriel , Ronald D. Jesme , Andrew J. Ouderkirk , Ravi Palaniswamy , Andrew P. Bonifas , Alejandro Aldrin A. Narag, II , Robert M. Jennings , Robin E. Gorrell
Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
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公开(公告)号：US10424707B2
公开(公告)日：2019-09-24
申请号：US16135317
申请日：2018-09-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
IPC: H01L33/62 , B32B15/08 , H05K1/03 , B32B7/12 , B32B27/28 , H01L33/48 , H01L33/58 , H05K1/18 , H05K3/28
Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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公开(公告)号：US20190269016A1
公开(公告)日：2019-08-29
申请号：US16243420
申请日：2017-07-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Alejandro Aldrin II A. Narag , Ravi Palaniswamy
Abstract: A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.
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