公开(公告)号：US20200054979A1

公开(公告)日：2020-02-20

申请号：US16609005

申请日：2018-04-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jae Yong Lee ,  Mahmut Aksit ,  Ravi Palaniswamy ,  Antonny E. Flor ,  James F. Poch ,  Michael A. Meis ,  Alejandro Aldrin A. Narag, II ,  Siang Sin Foo ,  Donato G. Caraig

IPC: B01D46/00 ,  B01D46/44 ,  B01D46/10

Abstract: Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.

公开(公告)号：US20180240756A1

公开(公告)日：2018-08-23

申请号：US15753426

申请日：2016-08-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Siang Sin Foo ,  Hiromitsu Kosugi ,  Alejandro Aldrin A. Narag, II ,  Ravi Palaniswamy

IPC: H01L23/544 ,  H01L23/498 ,  H01L33/62 ,  H01L21/48

CPC classification number: H01L23/544 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L33/62 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/81132 ,  H01L2224/81385 ,  H01L2224/83132 ,  H01L2224/83385 ,  H01L2224/85132 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K1/0269 ,  H05K1/111 ,  H05K1/189 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09745 ,  H05K2201/09918 ,  H05K2201/10106 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

公开(公告)号：US20240250484A1

公开(公告)日：2024-07-25

申请号：US18569406

申请日：2022-06-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chin Hua Lim ,  Saujit Bandhu ,  Kok Hoe Lee ,  Siang Sin Foo

IPC: H01R13/6594 ,  H01R12/72 ,  H01R13/405

CPC classification number: H01R13/6594 ,  H01R12/722 ,  H01R13/405

Abstract: An electrical connector configured to mate with a mating connector along a mating direction includes an electrically insulative unitary housing, pluralities of top and bottom contacts, and an electrically conductive unitary shield. The pluralities of top and bottom contacts are disposed in a central slot at a respective top surface and a bottom surface of the central slot for making contact with corresponding conductive terminals of a tongue of the mating connector. The shield is removably assembled to the housing along the mating direction from a rear side of the housing. The shield includes a base shield substantially covering an entire bottom surface of a bottom wall of the housing, and opposing side shields substantially covering opposing side walls of the housing. The shield leaves substantially an entire top surface of a top wall of the housing and the rear side of the housing exposed.

公开(公告)号：US20220415752A1

公开(公告)日：2022-12-29

申请号：US17781129

申请日：2020-12-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Sung W. Moon ,  Brinda B. Badri ,  Siang Sin Foo

IPC: H01L23/427 ,  H05K1/02

Abstract: A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.

公开(公告)号：US20190035993A1

公开(公告)日：2019-01-31

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  B32B7/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US10424707B2

公开(公告)日：2019-09-24

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  H05K1/03 ,  B32B7/12 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  H05K1/18 ,  H05K3/28

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US10121947B2

公开(公告)日：2018-11-06

申请号：US15316028

申请日：2015-05-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin Il Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  B32B7/12 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US20170104143A1

公开(公告)日：2017-04-13

申请号：US15316028

申请日：2015-05-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US11338236B2

公开(公告)日：2022-05-24

申请号：US16609005

申请日：2018-04-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jae Yong Lee ,  Mahmut Aksit ,  Ravi Palaniswamy ,  Antonny E. Flor ,  James F. Poch ,  Michael A. Meis ,  Alejandro Aldrin A. Narag, II ,  Siang Sin Foo ,  Donato G. Caraig

IPC: B01D46/10 ,  B01D46/46 ,  H01M8/04089 ,  G11B9/10 ,  B01D46/00 ,  B01D46/44

Abstract: Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.

公开(公告)号：US20210202818A1

公开(公告)日：2021-07-01

申请号：US16948395

申请日：2019-03-14

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Donato G. Caraig ,  Jian Xia Gao ,  Alejandro Aldrin A. Narag, II ,  Siang Sin Foo ,  Antonny E. Flor

IPC: H01L35/32 ,  H01L35/34

Abstract: Flexible thermoelectric devices including an array of slot openings on a flexible substrate, and methods of making and using the same are provided. The slot openings on the flexible substrate can help remove the tension or compression induced during bending of the devices. Slot openings each extend along a cross direction substantially perpendicular to the longitudinal direction of the substrate.