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公开(公告)号：US20190035993A1
公开(公告)日：2019-01-31
申请号：US16135317
申请日：2018-09-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
IPC: H01L33/62 , B32B15/08 , B32B27/28 , H01L33/48 , H01L33/58 , B32B7/12 , H05K1/03 , H05K1/18 , H05K3/28
CPC classification number: H01L33/62 , B32B7/12 , B32B15/08 , B32B27/281 , B32B2255/10 , B32B2255/20 , B32B2307/202 , B32B2457/202 , H01L33/486 , H01L33/58 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H05K1/0306 , H05K1/0346 , H05K1/036 , H05K1/189 , H05K3/28 , H05K2201/0154 , H05K2201/017 , H05K2201/0179 , H05K2201/09827 , H05K2201/09881 , H05K2201/10106
Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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Patent Agency Ranking
公开(公告)号：US10438897B2
公开(公告)日：2019-10-08
申请号：US15753426
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Siang Sin Foo , Hiromitsu Kosugi , Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
IPC: H01L23/544 , H01L23/498 , H01L23/00 , H05K1/02 , H05K1/18 , H01L33/62 , H01L21/48 , H05K1/11 , H05K3/32 , H05K3/34
Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.
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公开(公告)号：US20180240756A1
公开(公告)日：2018-08-23
申请号：US15753426
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Siang Sin Foo , Hiromitsu Kosugi , Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
IPC: H01L23/544 , H01L23/498 , H01L33/62 , H01L21/48
CPC classification number: H01L23/544 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/4985 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L33/62 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/10175 , H01L2224/131 , H01L2224/1319 , H01L2224/26175 , H01L2224/2919 , H01L2224/81132 , H01L2224/81385 , H01L2224/83132 , H01L2224/83385 , H01L2224/85132 , H01L2224/85385 , H01L2924/00014 , H01L2924/12041 , H01L2933/0066 , H05K1/0269 , H05K1/111 , H05K1/189 , H05K3/321 , H05K3/3436 , H05K2201/09745 , H05K2201/09918 , H05K2201/10106 , H01L2224/45099 , H01L2924/014
Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.
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公开(公告)号：US10424707B2
公开(公告)日：2019-09-24
申请号：US16135317
申请日：2018-09-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
IPC: H01L33/62 , B32B15/08 , H05K1/03 , B32B7/12 , B32B27/28 , H01L33/48 , H01L33/58 , H05K1/18 , H05K3/28
Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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公开(公告)号：US10121947B2
公开(公告)日：2018-11-06
申请号：US15316028
申请日：2015-05-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
IPC: H01L33/62 , B32B15/08 , B32B7/12 , B32B27/28 , H01L33/48 , H01L33/58 , H05K1/03 , H05K1/18 , H05K3/28
Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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公开(公告)号：US20170104143A1
公开(公告)日：2017-04-13
申请号：US15316028
申请日：2015-05-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
CPC classification number: H01L33/62 , B32B7/12 , B32B15/08 , B32B27/281 , B32B2255/10 , B32B2255/20 , B32B2307/202 , B32B2457/202 , H01L33/486 , H01L33/58 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H05K1/0306 , H05K1/0346 , H05K1/036 , H05K1/189 , H05K3/28 , H05K2201/0154 , H05K2201/017 , H05K2201/0179 , H05K2201/09827 , H05K2201/09881 , H05K2201/10106
Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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