公开(公告)号：EP3971680A3

公开(公告)日：2022-06-08

申请号：EP21196766.6

申请日：2021-09-15

Applicant: Apple Inc.

Inventor： BLOOM, Daniel R. ,  WOJESKI, Chelsea E. ,  SIAHAAN, Edward ,  MORRIS, Nathan ,  HALEY, Ryan S. ,  LI, Tian Shi ,  RISTOSKI, Toni

IPC: G06F1/16

Abstract: There is provided an electronic device (200) comprising: a radio-frequency (RF) component; and an enclosure at least partially surrounding the RF component and comprising: a housing (210) formed from a metal material and defining: an exterior surface (206); a first surface (208b) extending inward from a first portion (206b) of the exterior surface, and a second surface (208f) facing the first surface and extending inward from a second portion (206f) of the exterior surface; and a window (214b) formed from an RF-transmissive material, positioned over the RF component, and adhered to the first and the second surfaces (208b, 208f), the RF-transmissive material (214b) including a thermoset composite material comprising nano-sized silica particles dispersed within a thermoset matrix.

公开(公告)号：EP3685593A2

公开(公告)日：2020-07-29

申请号：EP18815488.4

申请日：2018-11-20

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M. ,  SHAFFER, Benjamin A. ,  TIKANDER, Miikka O. ,  WRIGHT, Derek W. ,  MINERBI, Mike B. ,  ANDERSEN, Esge B. ,  CORONA APARICIO, Edwin J. ,  ANANTHARAMAN, Rajesh ,  KADETOTAD, Sneha ,  MATTINGLEY, Jacob E. ,  ERICKSON, Christopher, S. ,  LIN, Tsu-Hui ,  KUBOYAMA, Yuta ,  ZUPKE, Robert D. ,  HEWITT, Oliver M. ,  HATFIELD, Dustin A. ,  HELLWIG, Alex C. ,  PATEL, Axit H. ,  ILKORUR, Onur I. ,  DOCHERTY, Sean J.

IPC: H04R1/10 ,  H04R5/033

公开(公告)号：EP4362495A3

公开(公告)日：2024-05-29

申请号：EP24163721.4

申请日：2016-08-25

Applicant: Apple Inc.

Inventor： QIAN, Phillip ,  SIAHAAN, Edward ,  GRINKER, Scott C. ,  LEBLANC, Jason J.

IPC: H04R1/10 ,  H04R25/02 ,  A61B5/00 ,  H04R1/40 ,  H04R5/033 ,  H04R5/04 ,  A61B5/024 ,  A61B5/0205 ,  A61B5/01 ,  A61B5/1455 ,  H04R3/00

CPC classification number: A61B5/01 ,  A61B5/02416 ,  A61B5/14552 ,  A61B5/14557 ,  A61B5/6817 ,  H04R1/1016 ,  H04R5/033 ,  H04R5/04 ,  H04R1/1083 ,  H04R3/005 ,  H04R2201/10920130101 ,  H04R2420/0720130101 ,  H04R2460/0320130101 ,  H04R2420/0320130101 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/406 ,  A61B5/0205 ,  A61B5/0008

Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be positioned within.

公开(公告)号：EP4362495A2

公开(公告)日：2024-05-01

申请号：EP24163721.4

申请日：2016-08-25

Applicant: Apple Inc.

Inventor： QIAN, Phillip ,  SIAHAAN, Edward ,  GRINKER, Scott C. ,  LEBLANC, Jason J.

IPC: H04R1/40

CPC classification number: A61B5/01 ,  A61B5/02416 ,  A61B5/14552 ,  A61B5/14557 ,  A61B5/6817 ,  H04R1/1016 ,  H04R5/033 ,  H04R5/04 ,  H04R1/1083 ,  H04R3/005 ,  H04R2201/10920130101 ,  H04R2420/0720130101 ,  H04R2460/0320130101 ,  H04R2420/0320130101 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/406

Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be positioned within.

公开(公告)号：EP3629592A1

公开(公告)日：2020-04-01

申请号：EP19200551.0

申请日：2019-09-30

Applicant: Apple Inc.

Inventor： JI, Qigen ,  ZHU, Hao ,  SANG, Haochuan ,  COUSINS, Benjamin A ,  WU, Meiting ,  MCINTOSH, Sean T. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan ,  STANLEY, Craig M. ,  TWEHUES, Brian R. ,  GRINKER, Scott ,  ANDERSEN, Esge ,  PARKER, Samuel ,  SIAHAAN, Edward ,  JUHNKE, Ethan W. ,  ZHANG, Mei ,  HUA, Thanh P ,  CHAWAN, Arun D ,  PANECKI, Lee M ,  LEBLANC, Jason J. ,  GHAHRI SARABI, Mohammad Soroush

IPC: H04R1/08 ,  H04R1/10 ,  A45C13/10 ,  A45C11/00

Abstract: Embodiments describe a magnetic securing component including a set of magnets positioned laterally adjacent to one another and having a curved top surface defined by individual curved top surfaces of each magnet in the set of magnets. The set of magnets includes: first and second magnets positioned laterally adjacent to one another, where the first and second magnets each have a polarity that is oriented parallel to a vertical dimension; and third and fourth magnets laterally positioned from the first and second magnets, where the third magnet is positioned adjacent to the first magnet and the fourth magnet is positioned adjacent to the second magnet, the third and fourth magnets each having a magnetic polarity that is oriented at an angle with respect to the vertical dimension.

公开(公告)号：EP2764583A1

公开(公告)日：2014-08-13

申请号：EP12779195.2

申请日：2012-09-24

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  ARDISANA, John B. ,  GOLKO, Albert J. ,  JOL, Eric S.

IPC: H01R13/504 ,  H01R24/60 ,  H01R13/6581

CPC classification number: H01R13/504 ,  H01R13/6581 ,  H01R24/28 ,  H01R24/60

Abstract: Devices and methods of manufacture for improved connector plugs are provided herein. In one aspect, an exemplary connector plug comprises a shield shell having a proximal stepped-down portion and a boot member that fittingly receives the stepped-down proximal portion so that an outer surface of the distal shield shell and the boot member is about flush with a minimal or negligible space therebetween. In some embodiments, the shield shell comprises a separate front shield shell and a reduced profile rear shield shell welded together so as to provide the advantageous reduced profile and improved aesthetic appearance, while maintaining the structural integrity of the connector. In many embodiments, weld strength of the shield shells is improved by providing line-to-line contact between shield shells by using deflectable tabs and/or utilizing thermal expansion properties of one or both shield shells.

公开(公告)号：EP4465658A2

公开(公告)日：2024-11-20

申请号：EP24205115.9

申请日：2019-04-02

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R ,  PANECKI, Lee M ,  QIAN, Phillip ,  SHAFFER, Benjamin A ,  STRINGER, Christopher J ,  WHANG, Eugene A ,  NARAJOWSKI, David H ,  OSHITA, Scott Y ,  DOCHERTY, Sean J ,  HATFIELD, Dustin A ,  SEGRAVES, Zachary G

IPC: H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：EP3971680A2

公开(公告)日：2022-03-23

申请号：EP21196766.6

申请日：2021-09-15

Applicant: Apple Inc.

Inventor： BLOOM, Daniel R. ,  WOJESKI, Chelsea E. ,  SIAHAAN, Edward ,  MORRIS, Nathan ,  HALEY, Ryan S. ,  LI, Tian Shi ,  RISTOSKI, Toni

IPC: G06F1/16

Abstract: There is provided an electronic device (200) comprising: a radio-frequency (RF) component; and an enclosure at least partially surrounding the RF component and comprising: a housing (210) formed from a metal material and defining: an exterior surface (206); a first surface (208b) extending inward from a first portion (206b) of the exterior surface, and a second surface (208f) facing the first surface and extending inward from a second portion (206f) of the exterior surface; and a window (214b) formed from an RF-transmissive material, positioned over the RF component, and adhered to the first and the second surfaces (208b, 208f), the RF-transmissive material (214b) including a thermoset composite material comprising nano-sized silica particles dispersed within a thermoset matrix.

公开(公告)号：EP3777236A1

公开(公告)日：2021-02-17

申请号：EP19717705.8

申请日：2019-04-02

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHAFFER, Benjamin A. ,  STRINGER, Christopher J. ,  WHANG, Eugene A. ,  NARAJOWSKI, David H. ,  OSHITA, Scott Y. ,  HATFIELD, Dustin A. ,  SEGRAVES, Zachary G. ,  DOCHERTY, Sean J.

IPC: H04R5/033

公开(公告)号：EP3629593A1

公开(公告)日：2020-04-01

申请号：EP19200553.6

申请日：2019-09-30

Applicant: Apple Inc.

Inventor： MCINTOSH, Sean T. ,  DELLA ROSA, Jason C. ,  PARKER, Samuel G. ,  COUSINS, Benjamin A. ,  HUWE, Ethan L. ,  GRINKER, Scott ,  ANDERSEN, Esge ,  STANLEY, Craig M. ,  JUHNKE, Ethan W ,  SIAHAAN, Edward ,  ZHANG, Mei ,  TWEHUES, Brian R. ,  HUA, Thanh P ,  SANG, Haochuan ,  CHAWAN, Arun D ,  PANECKI, Lee M ,  LEBLANC, Jason J. ,  JI, Qigen ,  GHAHRI SARABI, Mohammad Soroush ,  HAO, Zhu

IPC: H04R1/08 ,  H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.