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公开(公告)号:WO2018057146A1
公开(公告)日:2018-03-29
申请号:PCT/US2017/046536
申请日:2017-08-11
Applicant: APPLE INC.
Inventor: STANLEY, Craig M. , PORTER, Simon K. , SHEERIN, John H. , TRAINER, Glenn K. , DELLA ROSA, Jason C. , HUWE, Ethan L. , MCINTOSH, Sean T. , WANG, Erik L. , STRINGER, Christopher J. , ANDERSON, Molly J. , PARKER, Samuel G. , WU, Meiting , MENDEZ, Javier , LIU, Rong , COUSINS, Benjamin A. , SUN, Yupin , QI, Jun , BRINSFIELD, Jason W.
IPC: H04R1/02 , G06F3/01 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/12 , H04R5/02 , H04R31/00
Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
Abstract translation: 本公开涉及扬声器,并且更具体地涉及用于在房间中均匀分配音乐的阵列扬声器。 多个音频驱动器可以径向分布在扬声器外壳内,使得驱动器的输出均匀分布在整个房间内。 在一些实施例中,音频驱动器的出口几何形状可以被配置为从支撑阵列扬声器的表面弹回,以改善整个房间内的音乐分布。 阵列扬声器可以包括分布在阵列扬声器的壳体内的多个振动隔离元件。 隔振元件可以配置成减小阵列扬声器超低音扬声器产生的力量。 p>
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公开(公告)号:WO2020069374A1
公开(公告)日:2020-04-02
申请号:PCT/US2019/053547
申请日:2019-09-27
Applicant: APPLE INC.
Inventor: MCINTOSH, Sean T. , DELLA ROSA, Jason C. , PARKER, Samuel G. , COUSINS, Benjamin A. , HUWE, Ethan L. , STANLEY, Craig M. , TWEHUES, Brian R. , GHAHRI SARABI, Mohammad Soroush , GRINKER, Scott C. , ANDERSEN, Esge , SIAHAAN, Edward , JUHNKE, Ethan W. , ZHANG, Mei , HUA, Thanh P. , JI, Qigen , ZHU, Hao , SANG, Haochuan , CHAWAN, Arun D. , PANECKI, Lee M. , LEBLANC, Jason J. , WU, Meiting
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:WO2014039116A1
公开(公告)日:2014-03-13
申请号:PCT/US2013/038008
申请日:2013-04-24
Applicant: APPLE INC.
Inventor: GOLKO, Albert J. , STANLEY, Craig M. , THOMPSON, Paul J. , JONES, Warren Z. , KAMEI, Ibuki
IPC: H01R13/648
CPC classification number: H01R13/648 , H01R13/6594 , H01R13/6658 , H01R24/60 , H01R29/00 , H01R43/24
Abstract: A plug connector module that includes a metal frame having a base portion, an insertion end and a cavity that extends from the base portion into the insertion end. The insertion end is configured to be inserted into a cavity of a corresponding receptacle connector. A substrate extends through the base portion of the frame and into the insertion end and has a plurality of contact bonding pads at one end positioned within the frame, a plurality of conductor bonding pads at the opposing end and at least one ground pad contact between the contact bonding pads and conductor bonding pads. A first plurality of external contacts is positioned in a first opening and bonded to some of the plurality of contact bonding pads on the substrate and a second plurality of contacts positioned within a second opening and bonded to some of the contact bonding pads on the substrate.
Abstract translation: 一种插头连接器模块,其包括金属框架,所述金属框架具有基部,插入端和从基部延伸到插入端的空腔。 插入端构造成插入到相应的插座连接器的空腔中。 衬底延伸穿过框架的基部并进入插入端,并且在位于框架内的一端具有多个接触焊盘,在相对端处具有多个导体接合焊盘,以及至少一个接地焊盘接触点 接触焊盘和导体接合焊盘。 第一多个外部触头位于第一开口中并且接合到衬底上的多个接触焊盘中的一些,以及位于第二开口内的第二多个触点并且接合到衬底上的一些接触焊盘。
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公开(公告)号:WO2013177089A3
公开(公告)日:2013-11-28
申请号:PCT/US2013/041913
申请日:2013-05-20
Applicant: APPLE INC.
Inventor: STANLEY, Craig M. , STIEHL, Kurt R. , WEBB, Michael J.
Abstract: An accessory may be provided with a button controller (22) having a microphone and switches (40). Plastic structures (38) for the accessory may be formed by injection molding. Plastic structures may be molded around a printed circuit (56) and wiring. The wiring may have a plastic jacket. The molded plastic structures may bond with the plastic jacket to retain the wiring. The molded plastic structures may be molded directly to the printed circuit board. Protrusions on the molded plastic structures may mate with openings in a metal clip (36). Housing structures may be mounted to the metal clip. The metal clip may be provided with a spring (48) to short the metal clip to a trace on the printed circuit. The metal clip may also have a portion that receives electrostatic charge during electrostatic discharge events and that discharges the charge through the spring to the trace on the printed circuit.
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公开(公告)号:WO2018048721A1
公开(公告)日:2018-03-15
申请号:PCT/US2017/049649
申请日:2017-08-31
Applicant: APPLE INC.
Inventor: KASAR, Darshan R. , STANLEY, Craig M. , FLAMHOLZ, David B. , QIAN, Phillip , VAN NORTWICK, Nathan A. , LANG, Matthew E. , TOTING, Ferdinand S. , JOL, Eric S. , HUO, Edward S. , DO, Trent K. , YAMASAKI, Joel C. , ESMAEILI, Hani , BLANCO, Richard J. , LORMAN, Jonathan C. , WAGMAN, Daniel C.
CPC classification number: H01R13/5219 , H01R13/521 , H01R13/5227 , H01R13/631 , H01R13/6683 , H01R13/6691 , H01R13/717 , H01R24/00 , H01R24/28 , H01R24/60 , H01R24/62 , H01R24/76 , H01R2107/00
Abstract: A plug connector for an electronic device has a deformable seal positioned on it such that when the plug connector is mated to the electronic device a liquid-tight seal is formed between the plug connector and the electronic device. A seal may also be positioned within a receptacle connector cavity of the electronic device such that it forms a liquid-tight seal to a plug connector when the plug connector is mated to the electronic device.
Abstract translation: 用于电子设备的插头连接器具有位于其上的可变形密封件,使得当插头连接器与电子设备配合时,在插头连接器和电子设备之间形成液密密封。 密封件也可以定位在电子设备的插座连接器空腔内,使得当插头连接器与电子设备配合时,密封件形成对插头连接器的液密密封。 p>
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公开(公告)号:WO2014004129A1
公开(公告)日:2014-01-03
申请号:PCT/US2013/045934
申请日:2013-06-14
Applicant: APPLE INC.
Inventor: WHITLEY, Crenshaw , STANLEY, Craig M. , ROHRBACH, Matthew , WEBER, Trent , MERRIT, Robert , WANG, Eric L.
CPC classification number: A45F5/02 , A45F5/00 , A45F2005/006 , A45F2200/0508 , A45F2200/0516 , A45F2200/0525 , A45F2200/0533 , A45F2200/055 , A45F2200/0558 , B32B5/028 , B32B5/26 , B32B7/12 , B32B2262/0269 , B32B2262/0284 , B32B2262/103 , B32B2519/00 , Y10T428/31504 , Y10T428/31678 , Y10T428/31725 , Y10T428/31786 , Y10T442/10
Abstract: Laminate lanyards and methods for making the same are disclosed. The laminate lanyards may include a head formed from a reinforcing loop of yarn incorporated within a scrim. The head can be coupled to the head section of a body, which also includes a main section that forms the loop of the laminate lanyard. A gusset can be coupled to ends of the main section of the body to couple the two ends of the body together and facilitate opening and closing of the loop of the laminate lanyard. A slider may also be included in laminate lanyard for adjusting the size of the loop.
Abstract translation: 公开了层压系绳及其制造方法。 叠层系绳可以包括由加入松节织物的纱线的加强环形成的头部。 头部可以联接到主体的头部,其还包括形成层压制品系绳的环的主要部分。 角撑板可以联接到主体的主体部分的端部,以将身体的两端连接在一起,并且有助于打开和关闭层压体系索的环。 滑块还可以包括在层压系绳中,用于调节环的尺寸。
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公开(公告)号:EP3072315A1
公开(公告)日:2016-09-28
申请号:EP14784165.4
申请日:2014-09-25
Applicant: Apple Inc.
Inventor: BAKER, John J. , JOHNSON, Martin E. , FAMILY, Afrooz , HOWES, Michael B. , BOOZER, Brad G. , STANLEY, Craig M.
CPC classification number: H04S7/302 , G10L17/04 , G10L17/06 , H04R1/08 , H04R1/403 , H04R2203/12 , H04R2430/23
Abstract: An audio system that adjusts one or more beam patterns emitted by one or more loudspeaker arrays based on the preferences of users/listeners is described. The audio system includes an audio receiver that contains a listener location estimator, a listener identifier, and a voice command processor. Inputs from the listener location estimator, the listener identifier, and the voice command processor are fed into an array processor. The array processor drives the one or more loudspeaker arrays to emit beam patterns into the listening area based on inputs from each of these devices. By examining the location, preferred usage settings, and voice commands from listeners, the generated beam patterns are customized to the explicit and implicit preferences of the listeners with minimal direct input. Other embodiments are also described.
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公开(公告)号:EP4255125A3
公开(公告)日:2024-04-17
申请号:EP23187797.8
申请日:2017-08-11
Applicant: Apple Inc.
Inventor: STANLEY, Craig M. , PORTER, Simon K. , SHEERIN, John H. , TRAINER, Glenn K. , DELLA ROSA, Jason C. , HUWE, Ethan L. , MCINTOSH, Sean T. , WANG, Erik L. , STRINGER, Christopher J. , ANDERSON, Molly J. , PARKER, Samuel G. , WU, Meiting , MENDEZ, Javier , LIU, Rong , COUSINS, Benjamin A. , SUN, Yupin , QI, Jun , BRINSFIELD, Jason W.
IPC: H04R1/02 , G06F3/01 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/12 , H04R5/02 , H04R31/00 , H04R9/02
CPC classification number: H04R1/026 , H04R1/26 , H04R1/30 , H04R5/02 , H04R31/006 , H04R2201/40120130101 , H04R2400/1320130101 , H04R2420/0720130101 , H03K17/962 , H05K1/0274 , H05K1/141 , H05K2201/0906320130101 , H05K2201/1010620130101 , H05K2201/1037820130101 , G06F3/0202 , G06F3/041 , G06F3/03547 , H03K2217/96078520130101 , H04R1/025 , H04R1/403 , H04R3/12 , H04R2201/3420130101 , H04R1/2826 , G06F3/044 , H04R9/022 , H04R2201/02820130101
Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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公开(公告)号:EP4266837A3
公开(公告)日:2024-06-05
申请号:EP23187766.3
申请日:2017-08-11
Applicant: Apple Inc.
Inventor: STANLEY, Craig M. , PORTER, Simon K. , SHEERIN, John H. , TRAINER, Glenn K. , DELLA ROSA, Jason C. , HUWE, Ethan L. , MCINTOSH, Sean T. , WANG, Erik L. , STRINGER, Christopher J. , ANDERSON, Molly J. , PARKER, Samuel G. , WU, Meiting , MENDEZ, Javier , LIU, Rong , COUSINS, Benjamin A. , SUN, Yupin , QI, Jun , BRINSFIELD, Jason W.
IPC: H04R1/02 , G06F3/01 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/12 , H04R5/02 , H04R31/00 , H04R9/02
CPC classification number: H04R1/026 , H04R1/26 , H04R1/30 , H04R5/02 , H04R31/006 , H04R2201/40120130101 , H04R2400/1320130101 , H04R2420/0720130101 , H03K17/962 , H05K1/0274 , H05K1/141 , H05K2201/0906320130101 , H05K2201/1010620130101 , H05K2201/1037820130101 , G06F3/0202 , G06F3/041 , G06F3/03547 , H03K2217/96078520130101 , H04R1/025 , H04R1/403 , H04R3/12 , H04R2201/3420130101 , H04R1/2826 , G06F3/044 , H04R9/022 , H04R2201/02820130101
Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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公开(公告)号:EP4255125A2
公开(公告)日:2023-10-04
申请号:EP23187797.8
申请日:2017-08-11
Applicant: Apple Inc.
Inventor: STANLEY, Craig M. , PORTER, Simon K. , SHEERIN, John H. , TRAINER, Glenn K. , DELLA ROSA, Jason C. , HUWE, Ethan L. , MCINTOSH, Sean T. , WANG, Erik L. , STRINGER, Christopher J. , ANDERSON, Molly J. , PARKER, Samuel G. , WU, Meiting , MENDEZ, Javier , LIU, Rong , COUSINS, Benjamin A. , SUN, Yupin , QI, Jun , BRINSFIELD, Jason W.
IPC: H05K1/02
Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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