-
21.
公开(公告)号:WO2018072980A1
公开(公告)日:2018-04-26
申请号:PCT/EP2017/074643
申请日:2017-09-28
Applicant: ASML NETHERLANDS B.V.
Inventor: KOU, Weitian , YPMA, Alexander , HAUPTMANN, Marc , KUPERS, Michiel , VERGAIJ-HUIZER, Lydia, Marianna , WALLERBOS, Erik, Johannes, Maria , DELVIGNE, Erik, Henri, Adriaan , ROELOFS, Willem, Seine, Christian , CEKLI, Hakki, Ergun , VAN DER SANDEN, Stefan, Cornelis, Theodorus , GROUWSTRA, Cédric, Désiré , DECKERS, David, Frans, Simon , GIOLLO, Manuel , DOVBUSH, Iryna
Abstract: Disclosed is a method of determining a correction for a process parameter related to a lithographic process on a substrate and associated apparatuses. The lithographic process comprises a plurality of runs during each one of which a pattern is applied to one or more substrates. The method comprises obtaining pre-exposure metrology data describing a property of the substrate; obtaining post- exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning to the substrate, a group membership status from a one or more groups, based on said pre-exposure metrology data; and determining the correction for the process parameter based on said group membership status and said post-exposure metrology data.
Abstract translation: 公开了一种确定与衬底和相关装置上的光刻过程有关的过程参数的校正的方法。 光刻过程包括在其中每一个过程中将图案施加到一个或多个衬底的多次运行。 该方法包括获得描述衬底特性的预曝光度量数据; 获得曝光后测量数据,所述曝光后测量数据包括已经在一个或多个先前曝光的基板上执行的所述过程参数的一个或多个测量值; 基于所述预曝光度量数据向所述衬底分配来自一个或多个组的组成员身份状态; 以及基于所述组成员状态和所述曝光后测量数据确定对所述过程参数的校正。 p>
-
22.
公开(公告)号:WO2017060080A1
公开(公告)日:2017-04-13
申请号:PCT/EP2016/072363
申请日:2016-09-21
Applicant: ASML NETHERLANDS B.V.
Inventor: YPMA, Alexander , DECKERS, David, Frans, Simon , BIJNEN, Franciscus, Godefridus, Casper , VAN HAREN, Richard, Johannes, Franciscus , KOU, Weitian
IPC: G05B19/418 , G03F7/20
CPC classification number: G05B19/41875 , G03F7/70508 , G03F7/70525 , G03F7/70616 , G03F7/70625 , G03F7/70633 , G03F7/70641 , G03F9/7092 , G05B2219/45031 , Y02P90/22
Abstract: In a lithographic process in which a series of wafers (W(i)) are processed in different contexts. Object data (ODAT/PDAT) is received which may be for example performance data (PDAT) representing overlay measured on a set of wafers that have been processed previously. Context data (CDAT) represents a parameters of the lithographic process that vary between wafers within the set. By principal component analysis or other statistical analysis of the performance data (410), the set of wafers into two or more subsets (412). The first partitioning of the wafers and the context data are used (414) to identify one or more relevant context parameters (418), being parameters of the lithographic process that are observed to correlate most strongly with the first partitioning. The lithographic apparatus is controlled (400) for new wafers by reference to the identified relevant context parameters. Embodiments with feedback control and feedforward control are described.
Abstract translation: 在其中在不同上下文中处理一系列晶片(W(i))的光刻工艺中。 接收到对象数据(ODAT / PDAT),其可以例如表示在先前已经处理的一组晶片上测量的覆盖层的性能数据(PDAT)。 上下文数据(CDAT)表示在组内的晶片之间变化的光刻过程的参数。 通过主成分分析或性能数据(410)的其他统计分析,将该组晶片分成两个或多个子集(412)。 使用晶片和上下文数据的第一分区(414)来识别一个或多个相关的上下文参数(418),其是观察到与第一分区最强相关的光刻处理的参数。 通过参考所识别的相关上下文参数,光刻设备被控制(400)用于新的晶片。 描述了具有反馈控制和前馈控制的实施例。
-
公开(公告)号:EP3712817A1
公开(公告)日:2020-09-23
申请号:EP19164072.1
申请日:2019-03-20
Applicant: ASML Netherlands B.V.
Inventor: HASIBI, Faegheh , VAN DIJK, Leon, Paul , LARRANAGA, Maialen , YPMA, Alexander , VAN HAREN, Richard Johannes Franciscus
Abstract: According to an aspect of the disclosure there is provided a method for predicting a property associated with a product unit. The method may comprise obtaining a plurality of data sets, wherein each of the plurality of data sets comprises data associated with a spatial distribution of a parameter across the product unit, representing each of the plurality of data sets as a multidimensional object, obtaining a convolutional neural network model trained with previously obtained multidimensional objects and properties of previous product units, and applying the convolutional neural network model to the plurality of multidimensional objects representing the plurality of data sets, to predict the property associated with the product unit.
-
公开(公告)号:EP3529667A1
公开(公告)日:2019-08-28
申请号:EP17781433.2
申请日:2017-09-28
Applicant: ASML Netherlands B.V.
Inventor: KOU, Weitian , YPMA, Alexander , HAUPTMANN, Marc , KUPERS, Michiel , VERGAIJ-HUIZER, Lydia, Marianna , WALLERBOS, Erik, Johannes, Maria , DELVIGNE, Erik, Henri, Adriaan , ROELOFS, Willem, Seine, Christian , CEKLI, Hakki, Ergun , VAN DER SANDEN, Stefan, Cornelis, Theodorus , GROUWSTRA, Cédric, Désiré , DECKERS, David, Frans, Simon , GIOLLO, Manuel , DOVBUSH, Iryna
IPC: G03F7/20
-
公开(公告)号:EP3392711A1
公开(公告)日:2018-10-24
申请号:EP17167117.5
申请日:2017-04-19
Applicant: ASML Netherlands B.V.
Inventor: YPMA, Alexander , BASTANI, Vahid , SONNTAG, DAG , NIJE, Jelle , CEKLI, Hakki, Ergun , TSIROGIANNIS, Georgios , VAN WIJK, Robert Jan
IPC: G03F7/20
CPC classification number: G03F7/70616 , G03F7/70491
Abstract: A method of maintaining a set of fingerprints (316) representing variation of one or more process parameters across wafers, has the steps: (a) receiving measurement data (324) of one or more parameters measured on wafers; (b) updating (320) the set of fingerprints based on an expected evolution (322) of the one or more process parameters; and (c) evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence (316), and the decomposition may involve: estimating, based the received measurement data (324), likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.
-
公开(公告)号:EP3382606A1
公开(公告)日:2018-10-03
申请号:EP17163147.6
申请日:2017-03-27
Applicant: ASML Netherlands B.V.
Inventor: NIJE, Jelle , YPMA, Alexander , GKOROU, Dimitra , TSIROGIANNIS, Georgios , VAN WIJK, Robert Jan , CHEN, Tzu-Chao , SPIERING, Frans Reinier
CPC classification number: G06K9/6247 , G03F7/70616 , G03F7/70633
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data 210, 230 representing one or more parameters measured 206, 208 across wafers 204, 224 and associated with different stages of processing of the wafers; (b) determining fingerprints 213, 234 of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing 212, 232 the object data into components using principal component analysis for each different respective stage; (c) analyzing 246 commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing 250-258 an apparatus for processing 262 product units based on the commonality results.
-
公开(公告)号:EP3944020A1
公开(公告)日:2022-01-26
申请号:EP20186710.8
申请日:2020-07-20
Applicant: ASML Netherlands B.V.
Inventor: KHEDEKAR, Satej, Subhash , GANTAPARA, Anjan Prasad , CASTELIJNS, Henricus, Jozef , BOND, Stephen Henry , MOSSAVAT, Seyed Iman , YPMA, Alexander , DICKER, Gerald , STEINMEIER, Ewout, Klaas , VAN BERKEL, Koos , BOLDER, Joost, Johan , GUO, Chaoqun , LIN, Chenxi , CHEN, Hongwei , LI, Zhaoze , ZOU, Yi , ZHANG, Youping
IPC: G03F7/20
Abstract: Generating a control output for a patterning process is described. A control input is received. The control input is for controlling the patterning process. The control input comprises one or more parameters used in the patterning process. The control output is generated with a trained machine learning model based on the control input. The control output comprises an adjustment of the one or more parameters. The machine learning model is trained with training data generated from simulation of the patterning process and/or actual process data. The training data comprises 1) a plurality of training control inputs corresponding to a plurality of operational conditions of the patterning process, where the plurality of operational conditions of the patterning process are associated with operational condition specific behavior of the patterning process over time, and 2) training control outputs generated using a physical model based on the training control inputs.
-
公开(公告)号:EP3935448A1
公开(公告)日:2022-01-12
申请号:EP20703998.3
申请日:2020-02-06
Applicant: ASML Netherlands B.V.
Inventor: LARRANAGA, Maialen , GKOROU, Dimitra , HASIBI, Faegheh , YPMA, Alexander
-
29.
公开(公告)号:EP3910417A1
公开(公告)日:2021-11-17
申请号:EP20174335.8
申请日:2020-05-13
Applicant: ASML Netherlands B.V.
IPC: G03F7/20
Abstract: Described is a method and associated computer program and apparatuses for method for making a decision as to whether to inspect a substrate from a group of substrates within a manufacturing process. The method comprises assigning to each substrate of the group of substrates, a probability value describing a probability of complying with a quality requirement, using a model trained to predict compliance with the quality requirement based on pre-processing data associated with the substrate; and deciding whether to inspect each substrate based on the probability value and one or both of: an expected cost of the inspection step and at least one objective value describing an expected value of inspecting the substrate in terms of at least one objective relating to the model.
-
公开(公告)号:EP3879345A1
公开(公告)日:2021-09-15
申请号:EP21167888.3
申请日:2017-09-28
Applicant: ASML Netherlands B.V.
Inventor: KOU, Weitian , YPMA, Alexander , HAUPTMANN, Marc , KUPERS, Michiel , VERGAIJ-HUIZER, Lydia, Marianna , WALLERBOS, Erik, Johannes, Maria , DELVIGNE, Erik, Henri, Adriaan , ROELOFS, Willem, Seine, Christian , CEKLI, Hakki, Ergun , VAN DER SANDEN, Stefan, Cornelis, Theodorus , GROUWSTRA, Cédric, Désiré , DECKERS, David, Frans, Simon , GIOLLO, Manuel , DOVBUSH, Iryna
IPC: G03F7/20
Abstract: Disclosed is a method of determining a correction for a process parameter related to a lithographic process on a substrate and associated apparatuses. The lithographic process comprises a plurality of runs during each one of which a pattern is applied to one or more substrates. The method comprises obtaining pre-exposure metrology data describing a property of the substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning to the substrate, a group membership status from a one or more groups, based on said pre-exposure metrology data; and determining the correction for the process parameter based on said group membership status and said post-exposure metrology data.
-
-
-
-
-
-
-
-
-