Lamination adhesives
    22.
    发明专利

    公开(公告)号:AU5483398A

    公开(公告)日:1998-06-22

    申请号:AU5483398

    申请日:1997-11-18

    Applicant: BASF AG

    Abstract: A polymer composed offrom 5 to 95% by weight of a mixture of at least one C2-C4-alkyl acrylate and at least one C6-C12-alkyl acrylate (monomers a),from 5 to 30% by weight of ethylenically unsaturated compounds having a glass transition temperature of above 0° C. and containing no functional groups other than the ethylenically unsaturated group (monomers b),from 0 to 10% by weight of ethylenically unsaturated compounds having at least one acid group or acid anhydride group (monomers c), andfrom 0 to 60% by weight of further ethylenically unsaturated compounds (monomers d),the amounts by weight being based on the emulsion polymer.

    23.
    发明专利
    未知

    公开(公告)号:TR9700630A2

    公开(公告)日:1998-01-21

    申请号:TR9700630

    申请日:1997-07-11

    Applicant: BASF AG

    Abstract: This is a process in order to prepare a dilute polymer dispersion by the emulsion polymerisation of the compositions that able to polymerise as free radically (monomers); contains addition of a mini emulsion prepared from dilute, surfactant containing a compound (common regulator) dissolved into drop monomers having emulsified drops between 10 and 500nm before or during the polymerisation of the monomers and its solubility inside the monomers is at least twice the solubility inside the water.

    ANTISTATIC POLYOXYMETHYLENE MOLDING COMPOUNDS

    公开(公告)号:PL359156A1

    公开(公告)日:2004-08-23

    申请号:PL35915601

    申请日:2001-06-22

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.-% of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.-% of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.-% of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.-% of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100%.

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