公开(公告)号：DE3346935A1

公开(公告)日：1985-07-04

申请号：DE3346935

申请日：1983-12-24

Applicant: BASF AG

Inventor： MUENSTEDT HELMUT DR ,  NAARMANN HERBERT DR

IPC: C08G61/00 ,  C08F8/00 ,  C08G61/10 ,  C08G61/12 ,  C08L79/04 ,  H01B1/12 ,  C08F34/00 ,  C08F8/34 ,  C08F8/42

Abstract: The long-term stability of the electrical conductivity of pyrrole polymers is improved by a process in which the polymers are treated with an aqueous acid. Pyrrole polymers treated in this manner are used as conductor elements in the electrical industry.

公开(公告)号：DE3346934A1

公开(公告)日：1985-07-04

申请号：DE3346934

申请日：1983-12-24

Applicant: BASF AG

Inventor： MUENSTEDT HELMUT DR ,  NAARMANN HERBERT DR

IPC: C08G61/00 ,  C08F8/00 ,  C08G61/10 ,  C08G61/12 ,  C08L79/04 ,  H01B1/12 ,  C08F34/00 ,  C08F8/34 ,  C08F8/42

Abstract: The long-term stability of the electrical conductivity of pyrrole polymers is improved by a process in which the polymers are treated with an aqueous alkali metal hydroxide solution. Pyrrole polymers treated in this manner are used as electrical conductor elements or resistive films.

公开(公告)号：DE3877021D1

公开(公告)日：1993-02-11

申请号：DE3877021

申请日：1988-03-10

Applicant: BASF AG

Inventor： MUENSTEDT HELMUT DR ,  GEBHARD HELMUT ,  BLINNE GERD DR

IPC: B05D1/02 ,  C08J7/04 ,  C09D5/24

Abstract: A moulding based on a thermoplastic or duroplastic polymer, has a permanent anti-static finish, applied from a 1-20 wt.% soln. of the polymer, contg. 0.05-4 wt.% of a dissolved or dispersed, electrically conducting filler; the ratio by wt. of the polymer:filler in the soln. is 1-50 : 1.

公开(公告)号：DE3871722D1

公开(公告)日：1992-07-09

申请号：DE3871722

申请日：1988-10-31

Applicant: BASF AG

Inventor： BUCHERT HERMANN DR ,  GRIMM GERHARD ,  MUENSTEDT HELMUT DR

IPC: B32B15/08 ,  C08G75/00 ,  C08G75/23 ,  C08L71/00 ,  C08L71/12 ,  C08L79/08 ,  C08L81/00 ,  C08L81/06 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38

Abstract: Composite materials consist of thermoplastics (I) based on polyaryl ether sulphones, polyarylene ether ketones, polyether imides or thermotropic polymers, which are resistant to high temp., and a metal layer (II) applied directly to this, the surface area of which is increased by chemical or mechanical treatment. The novel features are that the enlarged surface area of (II) is towards (I); and the bond strength between (I) and (II) is min. 1.9 N/m, measured at a peel rate of 20 mm/min and angle of peel of 180 deg.C..

公开(公告)号：DE4028210A1

公开(公告)日：1992-03-12

申请号：DE4028210

申请日：1990-09-06

Applicant: BASF AG

Inventor： ROSENAU BERNHARD DR ,  HISGEN BERND DR ,  HEINZ GERHARD DR ,  MC KEE GRAHAM EDMUND DR ,  MUENSTEDT HELMUT DR ,  EBERLE WOLFGANG DR ,  ZEINER HARTMUT DR

IPC: C08J7/12 ,  C08J7/14 ,  H05K3/18 ,  H05K3/38

Abstract: In a process for the surface treatment of mouldings based on liquid-crystalline polymers with acidic or alkaline reagents, the acidic or alkaline reagents are employed in a solvent which comprises at least 60 % by weight of an organic solvent.

公开(公告)号：DE3737889A1

公开(公告)日：1989-05-18

申请号：DE3737889

申请日：1987-11-07

Applicant: BASF AG

Inventor： MUENSTEDT HELMUT DR

IPC: H05K1/02 ,  H05K1/03 ,  H05K7/20

Abstract: A circuit board substrate of good thermal conductivity comprises a composite formed from (A) an electrically and thermally insulating plastic and (B) a plastic incorporating a thermally highly conductive filler.

公开(公告)号：DE3545902A1

公开(公告)日：1987-06-25

申请号：DE3545902

申请日：1985-12-23

Applicant: BASF AG

Inventor： MUENSTEDT HELMUT DR ,  GEBHARD HELMUT

IPC: H01M4/58 ,  H01M4/587 ,  H01M4/60 ,  H01M10/052 ,  H01M10/36 ,  H01M4/00 ,  H01M6/14

公开(公告)号：DE3421296A1

公开(公告)日：1985-12-12

申请号：DE3421296

申请日：1984-06-08

Applicant: BASF AG

Inventor： NAARMANN HERBERT DR ,  MUENSTEDT HELMUT DR

IPC: C08G61/12 ,  C08G73/06 ,  H01B1/12 ,  C08F34/00

公开(公告)号：DE3410494A1

公开(公告)日：1985-10-03

申请号：DE3410494

申请日：1984-03-22

Applicant: BASF AG

Inventor： NAARMANN HERBERT DR ,  MUENSTEDT HELMUT DR ,  KOEHLER GERNOT DR

IPC: C08F269/00 ,  C08F271/02 ,  C08F283/00 ,  C08G65/04 ,  C08G73/06 ,  H01B1/12 ,  C08F277/00

公开(公告)号：DE3316183A1

公开(公告)日：1984-11-08

申请号：DE3316183

申请日：1983-05-04

Applicant: BASF AG

Inventor： MUENSTEDT HELMUT DR ,  NAARMANN HERBERT DR ,  PENZEL ERICH DR ,  SCHLAG JOHANNES DR

IPC: C08G61/12 ,  C08G73/06 ,  C08J7/04 ,  C08L79/04 ,  H01B1/12 ,  C08L45/00 ,  C08L27/08 ,  C08J5/18

Abstract: 1. Mouldings, prepared from conductive polymers of pyrrole and/or N-alkyl- or N-aryl-substituted or C-monoalkyl- or C-dialkyl-substituted or C-monohalogen- or C-dihalogen-substituted pyrrole and coated with an organic plastic, which have a permeability to oxygen of 0.1 to 0.5 cm**3 X 100 mu m/m**3 X day X bar