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公开(公告)号:AT25528T
公开(公告)日:1987-03-15
申请号:AT83107942
申请日:1983-08-11
Applicant: BASF AG
Inventor: STUTZ HERBERT DR , ECKERT GUENTER DR
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公开(公告)号:DE3523318A1
公开(公告)日:1987-01-08
申请号:DE3523318
申请日:1985-06-29
Applicant: BASF AG
Inventor: STUTZ HERBERT DR , TESCH HELMUT DR , NEUMANN PETER DR , SCHAEFER GERHARD DR
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公开(公告)号:DE3514347A1
公开(公告)日:1986-10-23
申请号:DE3514347
申请日:1985-04-20
Applicant: BASF AG
Inventor: TESCH HELMUT DR , PORTUGALL MICHAEL DR , STUTZ HERBERT DR , HEINZ GERHARD DR
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公开(公告)号:DE3424700A1
公开(公告)日:1986-02-06
申请号:DE3424700
申请日:1984-07-05
Applicant: BASF AG
Inventor: TESCH HELMUT DR , HEYM MANFRED DR , DOERFLINGER WALTER , STUTZ HERBERT DR , NEUMANN PETER DR , NISSEN DIETMAR DR , SCHAEFER GERHARD DR
IPC: C08G59/00 , C08G59/18 , C08G59/50 , C08J3/24 , C08J5/24 , C09D163/00 , C09J163/00 , C08L63/00 , C08J5/04 , C08K5/29 , C08K5/18
Abstract: A solvent-free curable composition has a long shelf life and consists of A 100 parts by weight of an epoxy resin and B from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 mu m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.
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