21.
    发明专利
    未知

    公开(公告)号:FR2568060B1

    公开(公告)日:1989-01-13

    申请号:FR8511018

    申请日:1985-07-18

    Applicant: CANON KK

    Abstract: There is a photosensor comprising: a photoconductive layer containing amorphous silicon provided on a substrate in which this photoconductive layer consists of laminated films of two or more layers having different refractive indexes and the refractive index of the lowest layer of the laminated films is not larger than 3.2 for the incident light of a wavelength of 6328 ANGSTROM ; a pair of electrodes provided in electrical contact with the photoconductive layer; and a photo sensing section. A long size image sensor unit is constituted by a plurality of such photosensors arranged like an array, a matrix drive circuit to matrix-drive each photosensor, and a light source such as light emitting diodes or a fluorescent lamp to illuminate an original to be read. With this image sensor unit, it is possible to provide a low-cost image reading apparatus which can read an image on the original at a high speed in which: the uniformity of the characteristic of each photosensor is improved; a variation in signal between the bits is reduced; a correction circuit for such a variation is unnecessary; and the peel-off of the photoconductive layer does not occur. A method of manufacturing such photosensors is also disclosed.

    23.
    发明专利
    未知

    公开(公告)号:FR2568060A1

    公开(公告)日:1986-01-24

    申请号:FR8511018

    申请日:1985-07-18

    Applicant: CANON KK

    Abstract: There is a photosensor comprising: a photoconductive layer containing amorphous silicon provided on a substrate in which this photoconductive layer consists of laminated films of two or more layers having different refractive indexes and the refractive index of the lowest layer of the laminated films is not larger than 3.2 for the incident light of a wavelength of 6328 ANGSTROM ; a pair of electrodes provided in electrical contact with the photoconductive layer; and a photo sensing section. A long size image sensor unit is constituted by a plurality of such photosensors arranged like an array, a matrix drive circuit to matrix-drive each photosensor, and a light source such as light emitting diodes or a fluorescent lamp to illuminate an original to be read. With this image sensor unit, it is possible to provide a low-cost image reading apparatus which can read an image on the original at a high speed in which: the uniformity of the characteristic of each photosensor is improved; a variation in signal between the bits is reduced; a correction circuit for such a variation is unnecessary; and the peel-off of the photoconductive layer does not occur. A method of manufacturing such photosensors is also disclosed.

    MANUFACTURE OF LIQUID CRYSTAL ELEMENT

    公开(公告)号:JPH1090707A

    公开(公告)日:1998-04-10

    申请号:JP24082596

    申请日:1996-09-11

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To manufacture a liquid crystal panel which has small delay of a voltage waveform and to prevent the manufacture yield from decreasing and the manufacture cost from increasing when the liquid crystal panel is manufactured. SOLUTION: On the surface of a smooth plate 21, a metallic electrode 12 is formed, and the united body of the smooth plate 21, a resin monomer 13L, and a glass substrate 35 is pressed (e); and then the resin monomer 13L is hardened (f), and the smooth plate 21 is peeled. Consequently, the resin 13S and metallic electrode 12 are left on the side of the glass substrate 25, but the surface 12a of the metallic electrode 12 is the surface which is exposed by peeling the smooth plate 21 and none of the resin 13S is stuck on the surface 12. Therefore, when transparent electrodes are formed on this surface 12a to manufacture a liquid crystal panel, those electrodes are brought into excellent contact and the liquid crystal panel has small delay of a voltage waveform and adaptive to high definition, etc. Further, a contact layer 35a is formed on the surface of the glass substrate 35, so the contact between the resin 13S and glass substrate 35 is secured. Consequently, a decrease in the manufacture yield and an increase in the manufacture cost are prevented.

    LIQUID CRYSTAL ELEMENT AND PRODUCTION OF LIQUID CRYSTAL ELEMENT

    公开(公告)号:JPH1082984A

    公开(公告)日:1998-03-31

    申请号:JP17884997

    申请日:1997-06-18

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To prevent the delay of voltage waveforms, deterioration of display quality, etc., and to reduce the production cost. SOLUTION: Since auxiliary electrodes 32b are arranged on the side nearer to a translucent base material 31b than to a main electrode 36a, the flatness of an oriented film 11b is maintained even if these auxiliary electrodes 32b are formed thick. Then, the delay of the voltage waveforms is prevented by thickly forming the auxiliary electrodes 32b and the deterioration of the display quality, etc., are prevented by maintaining the flatness of the oriented film 11b. Further, the auxiliary electrodes 32b are held exposed (not coated by a polymer material 35b) in the state that the polymer material 35b is cured. The good continuity with the main electrodes 36b to be formed afterward is thus improved. Since there is no need removal of the polymer material 35b, etc., after the curing, the production stages are simplified and the production cost is reduced.

    WIRING BOARD, PRODUCTION OF WIRING BOARD, LIQUID CRYSTAL ELEMENT USING THIS WIRING BOARD AND PRODUCTION OF LIQUID CRYSTAL ELEMENT

    公开(公告)号:JPH1049080A

    公开(公告)日:1998-02-20

    申请号:JP20261996

    申请日:1996-07-31

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To obtain a wiring board, etc., which are not affected by the deposits sticking to a glass substrate by crushing the deposits of dust, etc., which stick to the surface of this glass substrate and project from the front surface of auxiliary electrodes by pressurizing by a crushing means after formation of the auxiliary electrodes. SOLUTION: After the glass substrate 6 is set in the crushing means 20 before flattening using a UV curing resin, a pressure is applied thereon by the crushing means 20a to crush the deposits 21 of metals, etc., which are hardly removable by washing, by which the deposits are flattened, i.e., are put into the state lower than at least the metallic electrodes 20. The crushed deposits 21 flatly spread into pixels but even if the deposits crushed in such a manner spread, the number of the pixels difficult to be displayed is about several pixels at max. and is confined within the range much smaller than the influence by the display defect by the build-ups of the resins. In addition, the deposits are easily removable by executing washing in succession in case the deposits lose the adhesion when crushed.

    PRODUCTION OF LIQUID CRYSTAL ELEMENT

    公开(公告)号:JPH09269494A

    公开(公告)日:1997-10-14

    申请号:JP7771096

    申请日:1996-03-29

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To make the orientation of liquid crystals uniform by preventing the occurrence of wrinkle-like shrinks in a UV curing resin and forming a smooth surface by this UV curing resin and metallic electrodes. SOLUTION: An elastic film 32 is formed on the surface of a smooth plate 31 to form a pressurizing member 30. The UV curing resin 13L is dropped onto the surface of this pressurizing member 30 and is stuck to a wiring board A1 , by which a body B2 to be pressurized is formed. Further, this body B2 to be pressurized is set in a pressing machine 25 and is pressurized; thereafter, the resin 13L is irradiated with UV light 1 and is cured. The elastic film 32 follows up the shrinkage of the UV curing resin 13L and the tight contact state of both is maintained and, therefore, the extreme progression of the partial shrinkage does not arise and the occurrence of the wrinkle-like shrinks is prevented. The pressurizing member 30 is peeled from the wiring board A1 . Finally, transparent electrodes, etc., are formed on the surface of the wiring board A1 , by which a liquid crystal panel is formed.

    WIRING BOARD, ITS PRODUCTION AND LIQUID CRYSTAL ELEMENT HAVING THIS WIRING BOARD

    公开(公告)号:JPH09230318A

    公开(公告)日:1997-09-05

    申请号:JP3243196

    申请日:1996-02-20

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To obtain a wiring board with which the curing of the surface of the resin packed between metallic wirings to a smooth surface is possible by arranging spacers in at least part of the boundary surface of the metallic wirings and transparent electrodes. SOLUTION: An Al film is formed by a sputtering method on a glass substrate 6 to form the metallic wirings 8. Further, the spacers 11 of a silica glass system are dispersed into a solvent and the soln. prepd. in such a manner is applied on the surface of the metallic wirings 8 and is then cured. The UV curing resin 7 is dropped in a prescribed amt. between the respective metallic wirings 8 on this glass substrate 6 and thereafter, a mold plate having the smooth surface through which UV light passes is brought into contact with the UV curing resin 7. Next, a prescribed pressure is applied on the integral assembly of the glass substrate 6 and the mold plate holding the UV curing resin 7 to bring both into tight contact with each other. Next, the integral assembly of the glass substrate 6 and the UV curing resin 7 is peeled from the mold plate and transparent electrodes 9 are formed on the UV curing resin 7 in compliance with the wiring patterns of the metallic wirings 8. An alignment layer is formed thereon, by which the wiring board 3 is obtd.

    WIRING BOARD
    30.
    发明专利

    公开(公告)号:JPH0961837A

    公开(公告)日:1997-03-07

    申请号:JP22087195

    申请日:1995-08-29

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To eliminate the build-up parts of the resins in pixel areas and to obtain a wiring board flat in the pixel area. SOLUTION: This wiring board is formed with electrode patterns consisting of metallic wirings 502 and is formed by packing a curable resin between these metallic wirings by press forming. Dummy wirings 503 are formed adjacently on the outer side of the metallic wirings existing at the extreme ends of the electrode patterns. The thickness of the dummy wirings 502 is set nearly at the thickness of the metallic wirings 502.

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