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    Apparatus for on-line cleaning a wafer chuck with laser
    22.
    发明授权
    Apparatus for on-line cleaning a wafer chuck with laser 有权
    用于用激光在线清洁晶片卡盘的装置

    公开(公告)号：US06635844B2

    公开(公告)日：2003-10-21

    申请号：US09683467

    申请日：2002-01-03

    Applicant: Cheng-Hung Yu

    Inventor： Cheng-Hung Yu

    IPC: B23K2600

    CPC classification number: B23K26/128 ,  B08B7/0042 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/12 ,  B23K26/123 ,  B23K26/127 ,  B23K26/142

    Abstract: A stepper system, having an apparatus for on-line cleaning a wafer chuck by utilizing laser, has a wafer stage capable of moving horizontally along x-y directions and vertically along z direction, the wafer chuck, having a top surface contaminated by organic materials, fixed on the wafer stage, a laminar flow chamber used to isolate the wafer chuck during the cleaning of the wafer chuck, an excimer laser generation module, a laser beam delivery system and a projection lens system both for guiding the pulse laser to the contaminated top surface of the wafer chuck to decompose the organic materials thereon, and an inert gas supply for providing an inert gas flow to remove the decomposed organic materials from the top surface of the wafer chuck. A control system is further used to control the global or local cleaning of the contaminated top surface.

    Abstract translation: 具有通过利用激光在线清洗晶片卡盘的装置的步进系统具有能够沿xy方向水平移动并且沿z方向垂直移动的晶片载台，具有被有机材料污染的顶面的晶片卡盘固定 在晶片台上，用于在清洁晶片卡盘期间隔离晶片卡盘的层流室，准分子激光产生模块，激光束传输系统和投影透镜系统，用于将脉冲激光引导到受污染的顶表面 的晶片卡盘以分解其上的有机材料，以及用于提供惰性气流以从晶片卡盘的顶表面去除分解的有机材料的惰性气体供应。 进一步使用控制系统来控制污染的顶部表面的全局或局部清洁。

    Structure of printhead
    23.
    发明授权
    Structure of printhead 有权

    公开(公告)号：US06623109B2

    公开(公告)日：2003-09-23

    申请号：US10171284

    申请日：2002-06-13

    Applicant: Tse-Chi Mou ,  Ying-Lun Chang ,  Cheng-Hung Yu ,  Chin-Yi Chou

    Inventor： Tse-Chi Mou ,  Ying-Lun Chang ,  Cheng-Hung Yu ,  Chin-Yi Chou

    IPC: B41J205

    CPC classification number: B41J2/14072 ,  B41J2/14129 ,  B41J2202/03

    Abstract: A structure of a printhead for raising its product acceptance rate and improving its quality is provided. The structure of a printhead includes a base layer, a pattern layer disposed on the base layer, a channel barrier layer having a dry film, an ink channel, a flow channel and plural ink cavities on the pattern layer, and a nozzle plate adhered to the dry film of the channel barrier layer by thermal compression. The pattern layer further includes a flow pattern and a base pattern surrounding a central location for forming thereabove the ink channel.

    COLOR FILTER ARRAY HAVING HYBRID COLOR FILTERS AND MANUFACTURING METHOD THEREOF
    24.
    发明申请
    COLOR FILTER ARRAY HAVING HYBRID COLOR FILTERS AND MANUFACTURING METHOD THEREOF 有权
    具有混合色彩过滤器的彩色滤镜阵列及其制造方法

    公开(公告)号：US20140027682A1

    公开(公告)日：2014-01-30

    申请号：US13561103

    申请日：2012-07-30

    Applicant: Cheng-Hung Yu

    Inventor： Cheng-Hung Yu

    IPC: G02B5/23 ,  B05D5/06

    CPC classification number: G02B5/201 ,  G03F7/0007

    Abstract: A method for manufacturing a color filter array having hybrid color filters includes providing a high-grade photoresist and a low-grade photoresist, forming a plurality of first color filters on a substrate, and forming a plurality of second color filters and a plurality of third color filters on the substrate. The first color filters include the high-grade photoresist, and the second color filters and the third color filters include the low-grade photoresist. The high-grade photoresist of the first color filters includes a first amount of large size pigments in one unit area and the low-grade photoresists of the second color filters and the third color filters include a second amount of large size pigments in one unit area. A ratio of the second amount to the first amount is equal to or larger than

    Abstract translation: 一种制造具有混合滤色器的滤色器阵列的方法，包括提供高级光致抗蚀剂和低等级光致抗蚀剂，在衬底上形成多个第一滤色器，以及形成多个第二滤色器和多个第三滤色器 基底上的滤色器。 第一滤色器包括高级光致抗蚀剂，第二滤色器和第三滤色器包括低等级光致抗蚀剂。 第一滤色器的高级光致抗蚀剂包括在一个单位面积中的第一量的大尺寸颜料和第二滤色器的低等级光致抗蚀剂和第三滤色器在一个单位面积中包括第二量的大尺寸颜料 。 第二量与第一量的比例等于或大于

    IMAGE SENSOR
    25.
    发明申请
    IMAGE SENSOR 审中-公开
    图像传感器

    公开(公告)号：US20120261731A1

    公开(公告)日：2012-10-18

    申请号：US13084558

    申请日：2011-04-12

    Applicant: Cheng-Hung Yu

    Inventor： Cheng-Hung Yu

    IPC: H01L27/146

    CPC classification number: H01L27/14627 ,  H01L27/14621 ,  H01L27/14685

    Abstract: An image sensor is disclosed. The image sensor includes a substrate, at least a color filter, and a microlens disposed on the color filter. The substrate includes a passivation layer thereon, and the color filter is disposed on the passivation layer, in which the color filter is truncated.

    Abstract translation: 公开了一种图像传感器。 图像传感器包括基板，至少滤色器和布置在滤色器上的微透镜。 衬底上包括钝化层，并且滤色器设置在钝化层上，滤色器被截断。

    Method of fabricating image sensor and reworking method thereof
    26.
    发明授权
    Method of fabricating image sensor and reworking method thereof 有权
    图像传感器的制作方法及其返工方法

    公开(公告)号：US08084289B2

    公开(公告)日：2011-12-27

    申请号：US12714093

    申请日：2010-02-26

    Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

    Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

    IPC: H01L21/00

    CPC classification number: H01L27/14687 ,  H01L27/14636 ,  H01L27/14685

    Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.

    Abstract translation: 提供一种制造图像传感器装置的方法。 首先，提供包括像素阵列区域和衬垫区域的衬底。 图案化金属层和具有露出焊盘区域中的图案化金属层的开口的第一平坦化层依次形成在基板上。 在像素阵列区域中的第一平坦化层上形成滤色器阵列。 形成第二平坦化层以覆盖滤色器阵列并填充到开口中。 在第二平坦化层上的滤色器阵列上方形成多个微透镜。 覆盖层保形地形成在微透镜和第二平坦化层上。 执行蚀刻步骤以去除开口中的覆盖层和第二平坦化层，以暴露焊盘区域中的图案化金属层。

    Image sensor and fabricating method thereof
    28.
    发明授权
    Image sensor and fabricating method thereof 有权
    图像传感器及其制造方法

    公开(公告)号：US07723150B2

    公开(公告)日：2010-05-25

    申请号：US12147940

    申请日：2008-06-27

    Applicant: Cheng-Hung Yu

    Inventor： Cheng-Hung Yu

    IPC: H01L21/00

    CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14632

    Abstract: A method for fabricating an image sensor, which includes the following steps, is provided. A semiconductor substrate including a sensor array, a pad and a passivation layer is provided, and the passivation layer covers the sensor array and the pad. An opening, which comprises tapered sidewalls not perpendicular to a bared surface of the pad, is formed in the semiconductor substrate to expose the pad. An under layer is formed on the semiconductor substrate, and covers the pad and the passivation layer. A color filter array is formed on the under layer and over the corresponding sensor array. A planar layer is formed on the color filter array. A portion of the under layer is removed to expose the pad. A plurality of U-lenses is formed on the planar layer.

    Abstract translation: 提供了一种制造图像传感器的方法，其包括以下步骤。 提供了包括传感器阵列，焊盘和钝化层的半导体衬底，并且钝化层覆盖传感器阵列和衬垫。 在半导体衬底中形成包括不垂直于衬垫的裸露表面的锥形侧壁的开口以露出衬垫。 在半导体衬底上形成底层，覆盖衬垫和钝化层。 在下层和相应的传感器阵列上形成滤色器阵列。 平面层形成在滤色器阵列上。 下层的一部分被去除以暴露垫。 在平面层上形成多个U型透镜。

    SELECTIVE METAL SURFACE TREATMENT PROCESS AND APPARATUS FOR CIRCUIT BOARD AND RESIST USED IN THE PROCESS
    30.
    发明申请
    SELECTIVE METAL SURFACE TREATMENT PROCESS AND APPARATUS FOR CIRCUIT BOARD AND RESIST USED IN THE PROCESS 审中-公开
    选择性金属表面处理工艺和电路板的使用方法

    公开(公告)号：US20070281388A1

    公开(公告)日：2007-12-06

    申请号：US11456213

    申请日：2006-07-10

    Applicant: Cheng-Po Yu ,  Cheng-Hung Yu ,  Chi-Min Chang

    Inventor： Cheng-Po Yu ,  Cheng-Hung Yu ,  Chi-Min Chang

    IPC: H01L21/00 ,  H01L21/4763

    CPC classification number: H05K3/243 ,  H01L21/6715 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/28 ,  H05K2201/0391 ,  H05K2203/013 ,  H05K2203/058

    Abstract: A selective metal surface treatment process of a circuit board, which has a solder mask and a multiple of selective metal treatment surface areas, wherein the solder mask covers the surface of the circuit board but exposes the selective metal surface treatment areas, is provided. The selective metal surface treatment process includes using a printhead to selectively print a resist on a selective metal surface treatment area, performing a surface treatment of the other selective metal surface treatment areas, and removing the resist. A selective metal surface treatment apparatus used for performing the selective metal surface treatment process of the circuit board is also provided. Through the present invention, unnecessary waste of the materials in the process is reduced and the processing time is shortened.

    Abstract translation: 提供具有焊接掩模和多个选择性金属处理表面积的电路板的选择性金属表面处理工艺，其中焊接掩模覆盖电路板的表面，但暴露选择性金属表面处理区域。 选择性金属表面处理方法包括使用打印头选择性地在选择性金属表面处理区域上印刷抗蚀剂，对其它选择性金属表面处理区域进行表面处理，并除去抗蚀剂。 还提供了用于执行电路板的选择性金属表面处理工艺的选择性金属表面处理装置。 通过本发明，可以减少处理过程中不必要的材料浪费，缩短处理时间。

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