Abstract:
A paper-retaining mechanism (100) is disclosed as including a base (102), two posts (104) secured to the base, two arches (106) joined with each other for simultaneous movement, and the arches are movable relative to the posts between a closed position in which the arches are in contact with the posts to form two closed rings and an open position in which the arches are out of contact with the posts in which the rings are open, and a lever assembly operable to cause a rotatable member (138) to rotate to move the arches between the closed position and the open position, and the lever assembly is engaged with the rotatable member via an intermediate claw ring (140), and the lever assembly includes an operating link (114), an intermediate link (116) and a coupling link (118), and a first end (116a) of the intermediate link is pivotably engaged with the operating link, and a second end (116b) of the intermediate link is pivotably engaged with the coupling link, and the rotatable member rotates in a first direct ion (R) upon rotation of the coupling link in the first direction, and the rotatable member remains stationary upon rotation of the coupling link in an opposite second direction.
Abstract:
A paper-retaining mechanism (10,100) includes a base (12,102), two posts (16,106) secured to the base, two arches (18,108) joined with each other via an intermediate portion (20,110) for simultaneous movement, a support plate (14,104) joined with and extending from the base, and a lever assembly including an arm (26,116) and a link (30,120). The arches are movable relative to the posts between a closed position wherein the arches are in contact with the posts to form two closed rings and an open position wherein the arches are out of contact with the posts thereby the rings are open. The lever assembly is operable to move the arches between the closed and open positions. The arm is engaged with the support plate for relative pivotal movement about a first axis (A-A, R-R). The link is engaged with the support plate for relative pivotal movement about a second axis (C-C, T-T), and is engaged with a roller (42,132) received within a slot (40,130) of the arm for relative sliding movement. When the arches are in the closed position, the arm is pivotable in a first direction and away from the base to cause the link to pivot in the first direction thus allowing the arches to pivot to the open position. When the arches are in the open position, the arm is pivotable in a second direction which is opposite to the first direction to cause the link to pivot in the second direction thereby causing the arches to pivot to the closed position.
Abstract:
A paper-retaining mechanism (100, 200, 300, 400) comprises a base (104, 204, 304, 404), at least two post members (102, 202) secured to said base, a pair of arch members (106, 206) joined with each other for simultaneous movement, wherein the arch members are movable relative to the post members between a closed position in which the arch members are in contact with the post members to form two closed rings and an open position in which the arch members are out of contact with the post members to open the rings; and a lever assembly operable to move the arch members between the closed position and the open position. The lever assembly includes a lever member (124, 224, 324, 424), a clutch assembly (120, 122; 220 222) and a rotatable member (118, 218, 318, 418). The lever member has a slot (152, 252, 352, 452). The clutch assembly is engaged with the lever member by engagement means (150, 154; 250, 254) at least partly received through the slot of said lever member. The engagement means is slidably movable within and relative to the slot during operation of the lever assembly.
Abstract:
A method for manufacturing a color filter array having hybrid color filters includes providing a high-grade photoresist and a low-grade photoresist, forming a plurality of first color filters on a substrate, and forming a plurality of second color filters and a plurality of third color filters on the substrate. The first color filters include the high-grade photoresist, and the second color filters and the third color filters include the low-grade photoresist. The high-grade photoresist of the first color filters includes a first amount of large size pigments in one unit area and the low-grade photoresists of the second color filters and the third color filters include a second amount of large size pigments in one unit area. A ratio of the second amount to the first amount is equal to or larger than
Abstract:
An image sensor is disclosed. The image sensor includes a substrate, at least a color filter, and a microlens disposed on the color filter. The substrate includes a passivation layer thereon, and the color filter is disposed on the passivation layer, in which the color filter is truncated.
Abstract:
A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.
Abstract:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
Abstract:
A method for fabricating an image sensor, which includes the following steps, is provided. A semiconductor substrate including a sensor array, a pad and a passivation layer is provided, and the passivation layer covers the sensor array and the pad. An opening, which comprises tapered sidewalls not perpendicular to a bared surface of the pad, is formed in the semiconductor substrate to expose the pad. An under layer is formed on the semiconductor substrate, and covers the pad and the passivation layer. A color filter array is formed on the under layer and over the corresponding sensor array. A planar layer is formed on the color filter array. A portion of the under layer is removed to expose the pad. A plurality of U-lenses is formed on the planar layer.
Abstract:
A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.
Abstract:
A selective metal surface treatment process of a circuit board, which has a solder mask and a multiple of selective metal treatment surface areas, wherein the solder mask covers the surface of the circuit board but exposes the selective metal surface treatment areas, is provided. The selective metal surface treatment process includes using a printhead to selectively print a resist on a selective metal surface treatment area, performing a surface treatment of the other selective metal surface treatment areas, and removing the resist. A selective metal surface treatment apparatus used for performing the selective metal surface treatment process of the circuit board is also provided. Through the present invention, unnecessary waste of the materials in the process is reduced and the processing time is shortened.