公开(公告)号：US20210040641A1

公开(公告)日：2021-02-11

申请号：US16081687

申请日：2017-03-02

Applicant: EBARA CORPORATION

Inventor： Mizuki NAGAI ,  Masashi SHIMOYAMA ,  Takashi KISHI ,  Fumitoshi NISHIURA

IPC: C25D17/06 ,  C25D7/12 ,  C25D5/34 ,  C25D17/00

Abstract: Provided is a plating apparatus for plating a substrate, which prevents deterioration of uniformity of plating film thickness caused by an oxide film created at an edge section of the substrate and/or an organic substance attached to the edge section of the substrate. The plating apparatus includes a plating bath for applying a voltage to the substrate set in a substrate holder to plate the substrate; and an edge section washing device that locally removes at least either of the organic substance and the oxide film present at the edge section of the substrate before the substrate is set in the substrate holder.

公开(公告)号：US20190226114A1

公开(公告)日：2019-07-25

申请号：US16373456

申请日：2019-04-02

Applicant: EBARA CORPORATION

Inventor： Jumpei FUJIKATA ,  Masashi SHIMOYAMA ,  Yoichi NAKAGAWA ,  Yoshitaka MUKAIYAMA ,  Yoshio MINAMI

IPC: C25D17/00 ,  C25D17/10 ,  C25D5/02 ,  C25D17/06

Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.

公开(公告)号：US20190127875A1

公开(公告)日：2019-05-02

申请号：US16174103

申请日：2018-10-29

Applicant: EBARA CORPORATION

Inventor： Shao Hua CHANG ,  Yasuyuki MASUDA ,  Jumpei FUJIKATA ,  Masashi SHIMOYAMA ,  Tsutomu NAKADA

IPC: C25D21/10

Abstract: A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.

公开(公告)号：US20180371636A1

公开(公告)日：2018-12-27

申请号：US16118978

申请日：2018-08-31

Applicant: EBARA CORPORATION

Inventor： Jumpei FUJIKATA ,  Masashi SHIMOYAMA ,  Yuji ARAKI ,  Mizuki NAGAI

IPC: C25D21/12 ,  C25D17/12 ,  C25D17/06 ,  C25D5/00 ,  C25D17/00 ,  C25D7/12

Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate. The method of adjusting the plating apparatus has the steps of: installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using a sensor included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation.

公开(公告)号：US20250146952A1

公开(公告)日：2025-05-08

申请号：US18557557

申请日：2022-08-26

Applicant: EBARA CORPORATION

Inventor： Masashi SHIMOYAMA ,  Yasuyuki MASUDA ,  Ryosuke HIWATASHI

IPC: G01N21/95 ,  C25D7/12 ,  C25D17/00 ,  C25D21/12

Abstract: A state of a substrate as a plating target is measured. A substrate state measurement device includes: a stage configured to support a substrate such that the stage rotates the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage; and a state measurement module adapted to measure a state of a power supply member contact area on the basis of detection performed by the white confocal sensor on the power supply member contact area, the power supply member contact area being an area on the substrate which comes into contact with a power supply member.

公开(公告)号：US20250116026A1

公开(公告)日：2025-04-10

申请号：US18726299

申请日：2022-12-20

Applicant: EBARA CORPORATION

Inventor： Ryosuke HIWATASHI ,  Masaki TOMITA ,  Yasuyuki MASUDA ,  Masashi SHIMOYAMA

IPC: C25D21/04

Abstract: To efficiently remove gas bubbles from an entire ionically resistive element. A plating apparatus includes a plating tank (410), a substrate holder (440), an anode (430), an ionically resistive element (450), an agitating member (480), and a driving mechanism (482). The plating tank (410) is configured to contain a plating solution. The substrate holder (440) is configured to hold a substrate (Wf) with a surface to be plated facing downward. The anode (430) is disposed in the plating tank (410). The ionically resistive element (450) is disposed between the substrate (Wf) and the anode (430). The agitating member (480) is disposed between the substrate (Wf) and the ionically resistive element (450). The driving mechanism (482) is configured to reciprocate the agitating member (480) along the surface to be plated of the substrate (Wf). The driving mechanism (482) is configured to perform a first gas-bubble removal operation to reciprocate the agitating member (480) around a first position and a second gas-bubble removal operation to reciprocate the agitating member (480) around a second position different from the first position, during a bubble removing process for removing gas bubbles attached to the ionically resistive element (450).

公开(公告)号：US20240247394A1

公开(公告)日：2024-07-25

申请号：US17923163

申请日：2022-01-31

Applicant: EBARA CORPORATION

Inventor： Masashi SHIMOYAMA ,  Yasuyuki MASUDA ,  Ryosuke HIWATASHI

IPC: C25D17/00 ,  C25D7/12

CPC classification number: C25D17/008 ,  C25D7/12 ,  C25D17/001

Abstract: A specific portion of a substrate is allowed to be shielded at a desired timing, and making a plating film-thickness uniform is improved.
A plating module includes: a plating tank 410 for housing a plating solution; an anode 430 disposed in the plating tank 410; a substrate holder 440 for holding a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 447 configured to rotate the substrate holder 440 in a first direction and a second direction opposite to the first direction; and a shielding mechanism 485 configured to move a shielding member 481 into between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

公开(公告)号：US20230366120A1

公开(公告)日：2023-11-16

申请号：US18140556

申请日：2023-04-27

Applicant: EBARA CORPORATION

Inventor： Masashi SHIMOYAMA ,  Ryosuke HIWATASHI

IPC: C25D21/12 ,  C25D17/00 ,  C25D5/02 ,  C25D17/06

CPC classification number: C25D21/12 ,  C25D17/008 ,  C25D5/022 ,  C25D17/06

Abstract: An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a first potential sensor disposed at a first position in a region between a substrate held by a substrate holder and an anode, a second potential sensor disposed at a second position outside the region between the substrate held by the substrate holder and the anode, and a third potential sensor disposed at a third position different from the second position and outside the region between the substrate held by the substrate holder and the anode. The plating apparatus measures a first potential difference that is a potential difference between the first position and the second position, and a second potential difference that is a potential difference between the second position and the third position and measures a film thickness of the plating film based on a difference between the first potential difference and the second potential difference.

公开(公告)号：US20200332433A1

公开(公告)日：2020-10-22

申请号：US16922669

申请日：2020-07-07

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MASUDA ,  Masashi SHIMOYAMA

IPC: C25D21/12 ,  C25D7/12

Abstract: A plating method for plating a substrate by increasing a current value from a predetermined current value to a first current value is provided. The plating method plates the substrate for a first predetermined period with the first current value when a first current density corresponding to the first current value is lower than a limiting current density. This plating method includes measuring a voltage value applied to the substrate, and when the current value is increased from the predetermined current value to the first current value, determining whether the first current density is equal to or more than the limiting current density or not based on an amount of change in the voltage value.

公开(公告)号：US20180105946A1

公开(公告)日：2018-04-19

申请号：US15728175

申请日：2017-10-09

Applicant: EBARA CORPORATION

Inventor： Masashi SHIMOYAMA ,  Jumpei FUJIKATA ,  Fumitoshi NISHIURA ,  Takashi KISHI

IPC: C25D3/28 ,  C25D17/02 ,  C25D17/10 ,  C25D21/12 ,  C01G3/02

CPC classification number: C25D3/28 ,  C01G3/02 ,  C01P2004/61 ,  C01P2006/80 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D17/02 ,  C25D17/10 ,  C25D21/12 ,  C25D21/14 ,  C25D21/18

Abstract: Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.