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公开(公告)号：US20250051955A1
公开(公告)日：2025-02-13
申请号：US18929090
申请日：2024-10-28
Applicant: EBARA CORPORATION
Inventor： Yasuyuki MASUDA , Ryosuke HIWATASHI , Masashi SHIMOYAMA
Abstract: There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
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公开(公告)号：US20240218553A1
公开(公告)日：2024-07-04
申请号：US17923080
申请日：2021-06-04
Applicant: EBARA CORPORATION
Inventor： Masashi SHIMOYAMA , Yasuyuki MASUDA , Kazuhito TSUJI , Ryosuke HIWATASHI
CPC classification number: C25D21/12 , C25D5/022 , C25D17/008 , C25D17/06 , C25D21/10
Abstract: An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, an anode disposed, in the plating tank, facing the substrate held by the substrate holder, and a film thickness measuring module including a sensor that detects a parameter related to a plating film formed on a surface to be plated of the substrate, the film thickness measuring module measuring a film thickness of the plating film based on a detection value of the sensor during a plating treatment.
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公开(公告)号：US20240183059A1
公开(公告)日：2024-06-06
申请号：US17781363
申请日：2021-03-05
Applicant: EBARA CORPORATION
Inventor： Yasuyuki MASUDA , Ryosuke HIWATASHI , Masashi SHIMOYAMA
CPC classification number: C25D21/12 , C25D17/008 , C25D17/08 , C25D21/10
Abstract: There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
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4.发明公开公开(公告)号：US20230383431A1
公开(公告)日：2023-11-30
申请号：US18027588
申请日：2021-03-03
Applicant: EBARA CORPORATION
Inventor： Yasuyuki MASUDA , Ryosuke HIWATASHI , Masashi SHIMOYAMA
IPC: C25D17/06
CPC classification number: C25D17/06
Abstract: There is provided a substrate holder configured to hold a substrate in an apparatus for plating. The substrate holder comprises a seal configured to seal an outer peripheral part of the substrate and provided with a first opening which a surface to be plated or a plating surface of the substrate is exposed on; and a seal ring holder configured to hold the seal and provided with a second opening which the plating surface of the substrate is exposed on, wherein an opening diameter ratio that is a ratio of an opening diameter of the second opening to an opening diameter of the first opening is in a range of not lower than 99.32% and not higher than 99.80%.
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公开(公告)号：US20250146167A1
公开(公告)日：2025-05-08
申请号：US18557536
申请日：2022-12-16
Applicant: EBARA CORPORATION
Inventor： Ryosuke HIWATASHI , Tsubasa ISHII , Yasuyuki MASUDA , Masashi SHIMOYAMA
Abstract: Proposed is a plating apparatus capable of detecting a film thickness of a plating film formed on a substrate during a plating process. The plating apparatus includes a plating tank, a substrate holder configured to hold a substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate and the anode to adjust an electric field, a first detection electrode disposed in a region between a surface to be plated of the substrate and the anode and having an electrode end disposed at a first position inside the resistor, a second detection electrode disposed at a second position where there is less change in potential as compared with the first position in the plating tank, and a controller that measures a potential difference between the first detection electrode and the second detection electrode, to estimate a thickness of a plating film on the substrate based on the potential difference.
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Patent Agency Ranking
公开(公告)号：US20240279837A1
公开(公告)日：2024-08-22
申请号：US17790381
申请日：2021-06-17
Applicant: EBARA CORPORATION
Inventor： Ryosuke HIWATASHI , Masashi SHIMOYAMA , Yasuyuki MASUDA
CPC classification number: C25D17/007 , C25D17/06 , C25D21/10
Abstract: Provided is a resistor or the like that can improve uniformity of a plating film formed on a substrate. A resistor disposed between a substrate and an anode in a plating tank is provided. The resistor includes a first plurality of holes each formed on three or more reference circles being concentric and having different diameters and a second plurality of holes formed on an outer circumferential reference line surrounding the three or more reference circles, at least a part of the outer circumferential reference line being a trochoid curve.
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公开(公告)号：US20240209539A1
公开(公告)日：2024-06-27
申请号：US17911044
申请日：2021-10-28
Applicant: EBARA CORPORATION
Inventor： Masaki TOMITA , Ryosuke HIWATASHI
IPC: C25D17/06
CPC classification number: C25D17/06
Abstract: An occurrence of a varied power feeding to a contact member is suppressed.
A substrate holder includes: a frame-shaped supporting mechanism configured to be suspended and held by a plurality of support pillars and to support an outer peripheral portion of a surface to be plated of a substrate; a back plate assembly configured to be arranged on a back surface side of the surface to be plated of the substrate and to sandwich the substrate with the supporting mechanism; a contact member 468 arranged on the supporting mechanism; and a plurality of power source line members 461. The contact member 468 has a power feeding contact point in contact with the outer peripheral portion of the surface to be plated of the substrate and a plurality of power source connecting portions 469b connected to a power source. The plurality of power source line members 461 are connected from the power source to the plurality of power source connecting portions 469b through the plurality of support pillars, and are routed such that distances from the power source to the plurality of power source connecting portions 469b become equal.-
公开(公告)号：US20230340688A1
公开(公告)日：2023-10-26
申请号：US18168486
申请日：2023-02-13
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Masashi SHIMOYAMA , Masashi OBUCHI , Koichi MASUYA , Ryosuke HIWATASHI
Abstract: An object is to precisely grasping, in real time, film thickness of a plated film during a plating process. A plating apparatus comprises: a plating tank for storing plating liquid; a substrate holder for holding a substrate; an anode arranged in the plating tank in such a manner that it faces the substrate held by the substrate holder; an electric potential sensor constructed in such a manner that it is arranged in a position close to the substrate held by the substrate holder, and measures electric potential of the plating liquid; and a state space model constructed to estimate current density of current flowing through an outer edge part of the substrate, based on a measured value of electric potential of the plating liquid obtained by the electric potential sensor and by using a state equation and an observation equation.
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9.发明申请公开(公告)号：US20250146952A1
公开(公告)日：2025-05-08
申请号：US18557557
申请日：2022-08-26
Applicant: EBARA CORPORATION
Inventor： Masashi SHIMOYAMA , Yasuyuki MASUDA , Ryosuke HIWATASHI
Abstract: A state of a substrate as a plating target is measured. A substrate state measurement device includes: a stage configured to support a substrate such that the stage rotates the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage; and a state measurement module adapted to measure a state of a power supply member contact area on the basis of detection performed by the white confocal sensor on the power supply member contact area, the power supply member contact area being an area on the substrate which comes into contact with a power supply member.
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公开(公告)号：US20250116026A1
公开(公告)日：2025-04-10
申请号：US18726299
申请日：2022-12-20
Applicant: EBARA CORPORATION
Inventor： Ryosuke HIWATASHI , Masaki TOMITA , Yasuyuki MASUDA , Masashi SHIMOYAMA
IPC: C25D21/04
Abstract: To efficiently remove gas bubbles from an entire ionically resistive element. A plating apparatus includes a plating tank (410), a substrate holder (440), an anode (430), an ionically resistive element (450), an agitating member (480), and a driving mechanism (482). The plating tank (410) is configured to contain a plating solution. The substrate holder (440) is configured to hold a substrate (Wf) with a surface to be plated facing downward. The anode (430) is disposed in the plating tank (410). The ionically resistive element (450) is disposed between the substrate (Wf) and the anode (430). The agitating member (480) is disposed between the substrate (Wf) and the ionically resistive element (450). The driving mechanism (482) is configured to reciprocate the agitating member (480) along the surface to be plated of the substrate (Wf). The driving mechanism (482) is configured to perform a first gas-bubble removal operation to reciprocate the agitating member (480) around a first position and a second gas-bubble removal operation to reciprocate the agitating member (480) around a second position different from the first position, during a bubble removing process for removing gas bubbles attached to the ionically resistive element (450).
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