公开(公告)号：US20190126428A1

公开(公告)日：2019-05-02

申请号：US16173937

申请日：2018-10-29

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Yasuyuki MOTOSHIMA ,  Hisanori MATSUO ,  Masashi KABASAWA

IPC: B24B37/015 ,  B24B37/04 ,  H01L21/306 ,  F28F19/04 ,  F28G1/16

Abstract: A heat exchanger capable of preventing sticking of slurry is disclosed. The heat exchanger includes: a flow passage structure having a heating flow passage and a cooling flow passage formed therein; and a water-repellent material covering a side surface of the flow passage structure. A side surface of the heat exchanger is constituted by the water-repellent material.

公开(公告)号：US20150079881A1

公开(公告)日：2015-03-19

申请号：US14465792

申请日：2014-08-21

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA

IPC: B24B37/015 ,  G01J5/02 ,  B24B49/14

CPC classification number: B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/025 ,  G01J2005/0085

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract translation: 公开了一种抛光方法和抛光装置，其可以通过调整抛光垫的表面温度来提高抛光速率并且可以控制待抛光的基板的抛光轮廓。 通过将基板压在研磨台上的抛光垫上来研磨基板的抛光方法包括调整抛光垫的表面温度的焊盘温度调节步骤和通过将衬底压在抛光物上来研磨衬底的抛光步骤 垫具有调整的表面温度。 在焊盘温度调节步骤中，在抛光步骤期间调整研磨垫的与衬底接触的区域的一部分区域的表面温度，使得温度曲线的温度变化率 在抛光垫的表面的径向上在抛光垫的径向方向上变得恒定。