Abstract:
A composition for film formation which can form a film suitable for use as an interlayer dielectric in a semiconductor device, etc. and having an appropriate even thickness and can give a film having excellent characteristics including permittivity and Young's modulus; and a dielectric film obtained from the film-forming composition. The composition contains a compound (X) having a functional group which is partly eliminated by heating, irradiation with light, irradiation with radiation, or a combination thereof to generate volatile matter and yield an unsaturated group in the remaining part of the functional group.
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive composition and a pattern forming material that can give a patterned film with high resolution, the film having a good coating surface state, a low refractive index, and little change in the refractive index even under a high temperature condition (performances suitable, for example, for an antireflection film in an optical device) and the film having a low dielectric constant and a high Young's modulus (performances suitable, for example, for an interlayer insulating film in a semiconductor element device or the like), to provide a photosensitive film, a pattern forming method and a patterned film using the composition, and further, to provide an antireflection film and an insulating film produced by using the photosensitive composition, and an optical device and electronic device using these films.SOLUTION: The photosensitive composition or the pattern forming material contains: (A) a polymer obtained from silsesquioxanes composed of one or more cage type silsesquioxane compounds expressed by formula (1):(RSiO); and (B) a photopolymerization initiator. The present invention also discloses a photosensitive film, patterned film, antireflection film, insulating film, optical device and electronic device using the composition. In formula (1), R each independently represents an organic group, and at least two of R represent polymerizable groups; a represents an integer of 8 to 16; and the plurality of R may be identical to or different from one another. However, the polymer includes a polymerizable group derived from the cage type silsesquioxane compound remaining therein.
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming an insulating film which can form a film having a low dielectric constant and high heat-resistance, the insulating film obtained by using the composition for forming the insulating film, a method for manufacturing the insulating film using the composition for forming the insulating film, and an electronic device having the insulating film as a layer-constituting layer. SOLUTION: The composition for forming the insulating film contains a polymer having a repeating unit expressed by general formula (1) (wherein, X expresses a cage structure, Y expresses an aromatic hydrocarbon group, R 1 expresses an alkyl group, R 2 expresses a substituent, (a) expresses an integer of 1-18, b expresses an integer of 0-6, and * expresses a bonding position). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive composition excellent in sensitivity, forming a good pattern profile and causing few development defects, a pattern forming method using the photosensitive composition and a compound in the photosensitive composition, and to provide a photosensitive composition suitable for immersion exposure because the above properties are good even in immersion exposure, a pattern forming method using the photosensitive composition and a compound in the photosensitive composition. SOLUTION: The photosensitive composition includes (A) a resin of which solubility in an alkali developer increases under the action of an acid and (A') a resin which includes a repeating unit (a0) having a triphenylsulfonium structure represented by a specific general formula, wherein the resin (A) and/or the resin (A') is a resin which includes a repeating unit (a1) having a lactone structure and a cyano group. The pattern forming method using the photosensitive composition and the compound in the photosensitive composition are also provided. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide: a positive resist composition excellent in sensitivity, resolution, roughness, pattern profile and outgassing property; a compound for use in the positive resist composition; and a pattern-forming method using the positive resist composition, with respect to a positive resist composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes and a pattern-forming method using the positive resist composition. SOLUTION: The compound is a triarylsulfonium compound which has a sulfonium cation having a substituent containing an alcoholic hydroxyl group and an anion containing a proton acceptor functional group. The positive resist composition includes the compound. The pattern-forming method uses the positive resist composition. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition which is applicable even to a multiple exposure process in which exposure is performed two or more times on the same resist film, and which ensures a fine pattern profile, and to provide a pattern forming method. SOLUTION: The positive resist composition includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid; (C) a compound capable of decomposing under an action of an acid to generate an acid; and (D) a compound which itself acts as a base for the acids generated from the component (A) and the component (C) but decomposes upon irradiation with actinic rays or radiation to lose a basicity for the acids generated from the component (A) and the component (C). The pattern forming method uses the positive resist composition. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method using a positive resist composition with a favorable pattern resolution property and line width roughness, and suiting multiple exposure, in a multiple exposure process carrying out exposure a plurality of times on the same resist film. SOLUTION: The positive resist composition contains (A) a compound generating acid by irradiation of an active light ray or radiation, and (B) 80 mol.% or more of a copolymerization component not having an aromatic base. It contains resin with solubility with respect to an alkali developing solution increased by action of the acid, and (C) a compound decomposed by the action of the acid and generating an acid. An absolute value of a difference of pKa of the acid generated from the (A) component and the acid generated from the (C) component is 2 or less, and an absolute value of a difference of molecular weights is 50 or less. In the pattern forming method, by using the composition, exposure is carried out plural times with respect to the same resist film, and it has a process of heating the resist film at least once between exposure and exposure. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for stably forming a high-accuracy fine pattern to be used in the production process of a semiconductor such as IC, in the production of a circuit board of liquid crystal, thermal head and the like or in other photofabrication processes, a resist composition to be used in the method, a developing solution to be used in the method and a rinsing solution to be used in the method. SOLUTION: The pattern forming method includes: (1) coating a resist composition including a resin that includes a specific repeating unit and increases the polarity by the action of an acid, wherein the composition decreases the solubility in a negative developing solution upon irradiation with actinic rays or radiation; (2) exposing; and (3) developing with a negative developing solution. There are also provided the resist composition to be used in the method, the developing solution to be used in the method and the rinsing solution to be used in the method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative resist composition ensuring good resolution and reduced collapse of a fine line pattern not only in normal exposure (dry exposure) but in immersion exposure, and to provide a pattern forming method using the above composition. SOLUTION: The negative resist composition includes: (A) a compound having at least one episulfide structure (a three-membered ring structure comprising two carbon atoms and one sulfur atom); (B) an alkali-soluble resin; and (C) a compound generating an acid upon irradiation with actinic rays or radiation. The composition is used for the pattern forming method. COPYRIGHT: (C)2009,JPO&INPIT