公开(公告)号：EP1018092B1

公开(公告)日：2010-12-22

申请号：EP98946510.9

申请日：1998-09-23

Applicant: Gemalto SA

Inventor： ELBAZ, Didier ,  FIDALGO, Jean-Christophe

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/07718 ,  G06K19/07743 ,  G06K19/07769 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The invention concerns a method for making at least an electronic module or label with activable adhesiveness. The method comprises the following steps consisting in providing an insulating film comprising at least an interface with contacts and/or antenna, an adhesive tape (40; 56; 70; 80) comprising an activable adhesive material (44) and a protective sheet capable of being removed, said tape having at least a perforation corresponding to the resin zone on the module or label, placing the adhesive tape on the support film such that said perforation coincides with the resin zone and activating the adhesive material so that it fixes the tape on the film, depositing the coating resin on the zone provided at least inside the perforation and in contact with the perforation. The invention also concerns a method wherein the activable adhesive material is deposited without protective sheet.

公开(公告)号：EP1886264B1

公开(公告)日：2010-03-17

申请号：EP06755038.4

申请日：2006-05-05

Applicant: Gemalto SA

Inventor： FIDALGO, Jean-Christophe ,  MARTINENT, Jean-François ,  ALLEYSSON, Blandine

IPC: G06K19/077

CPC classification number: G06K19/07739 ,  G06K19/077 ,  Y10S439/945

Abstract: The invention relates to a format adapter comprising a storage device having: a front surface provided with electrical contact pads opposite a rear surface defining a lower peripheral border (2a); a body having a cavity (4) for receiving the device and opening on a front and rear side of the body, and; an adhesive film (8a), which is sensitive to pressure, adhered to the rear side of the body and which has at least one adhesive portion inside the cavity in order to hold the storage device. The adhesive film has an inner recess (10) essentially centered on the cavity and has at least one shoulder bordering on the cavity that assures a localized adhesion only on the lower peripheral border (2a) of the storage device. The invention also relates to a method for producing the adapter and to a use of the adapter for manufacturing and packaging the storage device.

公开(公告)号：EP3223199A2

公开(公告)日：2017-09-27

申请号：EP17165550.9

申请日：2011-05-24

Applicant: GEMALTO SA

Inventor： FIDALGO, Jean-Christophe ,  LEIBENGUTH, Joseph

IPC: G06K19/077 ,  G06K19/07

CPC classification number: H05K7/02 ,  G06K19/0718 ,  G06K19/07703 ,  G06K19/07745 ,  G06K19/07747 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/181 ,  H05K13/00 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: L'invention concerne un procédé de réalisation d'un dispositif multi-composant comprenant les étapes suivantes,
- réalisation d'un module (1) à structure multi couches comportant des composants électriques / électroniques (C10, C20) disposés sur au moins un substrat en couches superposées, les composants présentant chacun une face principale (F1, F2) exposée vers l'extérieur,
caractérisé en ce que les composants sont agencés de manière à présenter leur face principale respective (F1, F2) orientée dans des directions opposées l'une par rapport à l'autre.
L'invention concerne également le dispositif correspondant.

公开(公告)号：EP2218040A1

公开(公告)日：2010-08-18

申请号：EP08804931.7

申请日：2008-09-30

Applicant: Gemalto SA

Inventor： SEBAN, Frédérick ,  FIDALGO, Jean-Christophe ,  ZAFRANY, Michael

IPC: G06K19/073

CPC classification number: G06K19/07345 ,  H01H2203/038 ,  H01H2205/03 ,  H01H2215/034 ,  H01H2231/05

Abstract: The invention relates to an electronic radiofrequency-transaction device that comprises a first switch capable of providing a radiofrequency operation of the device upon actuation of the switch and an operation stop when the actuation is released. The device is characterised in that it comprises a timer circuit (7, 8, 20) capable of maintaining, after the actuation of the first switch (6), a continuous radiofrequency operation for a duration at least equal to the duration of a transaction to be carried out. The invention also relates to a smart card containing the device and to a module for an electronic radiofrequency-transaction device.

公开(公告)号：EP2926298A1

公开(公告)日：2015-10-07

申请号：EP13795493.9

申请日：2013-11-25

Applicant: Gemalto SA

Inventor： OTTOBON, Stéphane ,  FIDALGO, Jean-Christophe ,  AUDOUARD, Laurent ,  SEBAN, Frédérick

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07728 ,  G06K19/07775 ,  H01L31/18

Abstract: The invention relates to a method for making an electronic module (16) comprising an integrated circuit chip (7) connected to an antenna (2), wherein said method comprises the steps of: - producing a module comprising electrical interconnection areas (34A, 34B), a chip (7) connected to the interconnection areas and a protection element (12) covering at least the chip and in part said interconnection areas, a radio antenna (2) connected to the chip and arranged above the chip. The method differs in that it comprises a step of producing the entirety or part of the antenna (2), or the tracks (32, 33) thereof for coupling same with the interconnection areas (34A, 34B), in three dimensions directly on the protection element (12).

Abstract translation: 该方法包括将电子模块（16）的集成电路芯片（7）连接到互连区域（34A，34B）。 芯片和互连区域部分地被保护部件（12）覆盖。 射频天线（2）连接到芯片并放置在芯片上方。 天线的整个或一部分天线或连接轨道（32,33）以三维方式直接实现在保护部分上，其中连接轨道布置在互连区域处。 互连区域由电介质基板（3）承载。 无线电频率设备还包括独立权利要求。

公开(公告)号：EP2661790A1

公开(公告)日：2013-11-13

申请号：EP11804711.7

申请日：2011-12-29

Applicant: Gemalto SA

Inventor： GUIGNARD, Philippe ,  FIDALGO, Jean-Christophe

IPC: H01R12/71

CPC classification number: H01R13/6205

Abstract: The present invention relates to an electronic device (1A, 1B) comprising: connection means (2) for connecting or connecting a component (3) including an integrated circuit chip and/or ferromagnetic contact pads (16); and magnetic means (4) for holding the component in a connection position, said holding means (4) being adapted to apply a holding force (F) on said component. The device is characterized in that the holding means are adapted for applying said holding force on said pads or directly on said integrated circuit.

公开(公告)号：EP2537400A1

公开(公告)日：2012-12-26

申请号：EP11703690.5

申请日：2011-02-15

Applicant: Gemalto SA

Inventor： DOSSETTO, Lucile ,  FIDALGO, Jean-Christophe ,  DUBOIS, Béatrice

IPC: H05K1/18 ,  H01L21/56 ,  H01L23/00 ,  G06K19/077

CPC classification number: H05K1/185 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/92144 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: The method involves arranging (S1) a chip (1) on a trailed adhesive support (2), and molding (S2) resin (3) for coating the chip on the support. An island zone (10) is turned over (S3), so that the chip has exposed active face, where the island zone is formed by the assembly of the chip and resin. A conductive material is applied on the turned island zone for materializing a contact pad connecting a contact point (1a) of the chip to an exterior medium. Independent claims are also included for the following: (1) a system for manufacturing an electronic case, comprising an arranging unit (2) an electronic case comprising a chip.

Abstract translation: 该方法包括将芯片（1）布置在拖尾粘合剂支撑件（2）上，以及模制（S2）树脂（3）以将芯片涂覆在支撑件上。 岛状区域（10）翻转（S3），使得芯片具有暴露的活动面，其中通过芯片和树脂的组装形成岛区。 将导电材料施加在转岛区上，以实现将芯片的接触点（1a）连接到外部介质的接触垫。 还包括以下独立权利要求：（1）一种用于制造电子外壳的系统，包括布置单元（2）包括芯片的电子外壳。

公开(公告)号：EP2218040B1

公开(公告)日：2011-11-09

申请号：EP08804931.7

申请日：2008-09-30

Applicant: Gemalto SA

Inventor： SEBAN, Frédérick ,  FIDALGO, Jean-Christophe ,  ZAFRANY, Michael

IPC: G06K19/073

CPC classification number: G06K19/07345 ,  H01H2203/038 ,  H01H2205/03 ,  H01H2215/034 ,  H01H2231/05

Abstract: The invention relates to an electronic radiofrequency-transaction device that comprises a first switch capable of providing a radiofrequency operation of the device upon actuation of the switch and an operation stop when the actuation is released. The device is characterised in that it comprises a timer circuit (7, 8, 20) capable of maintaining, after the actuation of the first switch (6), a continuous radiofrequency operation for a duration at least equal to the duration of a transaction to be carried out. The invention also relates to a smart card containing the device and to a module for an electronic radiofrequency-transaction device.

公开(公告)号：EP2232963A1

公开(公告)日：2010-09-29

申请号：EP08862375.6

申请日：2008-12-04

Applicant: Gemalto SA

Inventor： SEBAN, Frédérick ,  FIDALGO, Jean-Christophe

IPC: H05K1/00 ,  H01Q1/27

CPC classification number: H05K3/103 ,  G06K19/027 ,  G06K19/07749 ,  H01L2224/16225 ,  H01Q1/2208 ,  H01Q1/27 ,  H05K1/0393 ,  H05K3/328 ,  H05K3/3494 ,  H05K3/4084 ,  H05K2201/10287 ,  H05K2203/0195 ,  H05K2203/1189 ,  Y10T29/49204

Abstract: Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device comprising at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method is noteworthy in that it comprises the following steps: creating the interconnecting wire (3) by depositing individual wires on the substrate (2, 2f, 2b) in a predefined interconnecting pattern, the said wire comprising at least one terminal connection portion (7, 8) which is exposed on the substrate, bringing at least one contact (5, 6) of a component (C1, C3) to face the terminal portion (7b, 8b) and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.

Abstract translation: 该方法包括形成由有线线路技术互连导体线或带（3）的，在基板上（2），即 刺绣，其中导线具有一组端子连接部分的露出做在衬底上。 触点（5,6）成分的E.G. 生物测定传感器（C1）和开关（C3）相对于传送到另一组端子部，并通过热压焊接或超声波焊接连接于集后期端子部。 因此独立claimsoft包括对于包括生物统计传感器和开关的触点的装置。

公开(公告)号：EP1794709B1

公开(公告)日：2010-08-11

申请号：EP05758459.1

申请日：2005-06-29

Applicant: Gemalto SA

Inventor： MARTINENT, Jean-François ,  FIDALGO, Jean-Christophe

IPC: G06K19/077 ,  G06K19/04

CPC classification number: G06K19/077 ,  G06K19/04 ,  G06K19/07739

Abstract: The invention concerns a chip card support comprising a frame-type support body, a cavity in the support body and branches of the frame delimiting said cavity, said branches being configured to maintain in place the chip card. It is distinct from the support body (1) and is adapted to open and close so as to enable the chip card (2) to be inserted or withdrawn. According to the inventive method the support is produced in open position.