公开(公告)号：US20230047496A1

公开(公告)日：2023-02-16

申请号：US17399940

申请日：2021-08-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.

Inventor： John Franz ,  Ernesto Ferrer ,  Tahir Cader

IPC: H05K7/20 ,  F28F9/02 ,  H05K1/02

Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

公开(公告)号：US11199192B1

公开(公告)日：2021-12-14

申请号：US16943069

申请日：2020-07-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader ,  Ernesto Ferrer Medina

IPC: F04D25/00 ,  F04D25/06 ,  G06F1/20 ,  F04D29/52 ,  F04D19/00 ,  H05K7/20

Abstract: Example implementations relate to a method and system for pumping fluid with a pump assembly to cool waste-heat producing system of an apparatus. The pump assembly includes a first housing, a rotor assembly, a stator assembly, a second housing, an outlet connection port coupled to the second housing, and a guide vane insert. The first housing includes a first bore and first inlet guide vanes (IGVs) coupled to inlet of the first bore. The rotor assembly including an impeller, is disposed in the first bore. The stator assembly including a coil, is mounted around a portion of the first housing. The second housing has a second bore fluidically coupled to the first bore, and first outlet guide vanes (OGVs) coupled at an entrance of the second bore. The guide vane insert including second OGVs, is disposed within the outlet connection port and fluidically coupled to outlet of the second bore.

公开(公告)号：US11157050B1

公开(公告)日：2021-10-26

申请号：US16860926

申请日：2020-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer Medina ,  Tahir Cader ,  Steven Dean

IPC: G06F1/20 ,  H05K7/20

Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.

公开(公告)号：US20210133369A1

公开(公告)日：2021-05-06

申请号：US16673243

申请日：2019-11-04

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Mehmet Kivanc Ozonat

IPC: G06F30/20

Abstract: In exemplary aspects of managing, monitoring and maintaining computing systems and devices such as edge data centers (EDCs), probabilistic models such as dynamic Bayesian networks (DBNs) are generated. The DBNs can define individual and collective systems such as EDCs. The DBNs are built by generating or estimating the model structure and model parameters. The model can be deployed, for instance, to identify actual or potentially anomalous behavior within the individual or collective systems defined by the model. The model can also be deployed to predict anomalous behavior. Based on the results of the model, corrective measures can be taken to remedy the anomalies, and/or to optimize the impact therefrom.

公开(公告)号：US20210092869A1

公开(公告)日：2021-03-25

申请号：US16580605

申请日：2019-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  F28F3/12 ,  F28F3/02

Abstract: Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.

公开(公告)号：US20200161214A1

公开(公告)日：2020-05-21

申请号：US16192576

申请日：2018-11-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey J. Lunsman ,  Tahir Cader

IPC: H01L23/473 ,  G06F1/20

Abstract: Systems and devices for cooling servers are provided. In one aspect, a cooling device includes a first axial pump including a body having an impeller, the first axial pump coupled to a first pump housing, the first axial pump housing coupled to a chassis, a rack, a row of racks, or one or more racks of the row of racks that are housing one or more servers. The cooling device also includes an inlet pipe coupled to an inlet of the first pump housing, the inlet pipe supplying cooling fluid to the first axial pump. The cooling device also includes an outlet pipe having an outlet coupled to the first pump housing, the outlet pipe receiving the cooling fluid from the first axial pump.

公开(公告)号：US10582640B2

公开(公告)日：2020-03-03

申请号：US15974798

申请日：2018-05-09

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Harvey Lunsman ,  Ernesto Ferrer Medina ,  John Franz

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  G06F1/20

Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.

公开(公告)号：US10571980B2

公开(公告)日：2020-02-25

申请号：US15560225

申请日：2015-04-07

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Zhikui Wang ,  Tuong Q. Tran ,  Tahir Cader ,  Chunjian Ni

IPC: G06F1/20 ,  G05D23/19 ,  H05K7/20

Abstract: In one implementation, a system for hybrid cooling control of a computing system includes a coordinated controller engine to: determine a number of liquid loop set-points and a number of air loop set-points, determine a number of system parameters corresponding to the number of liquid loop set-points and the number of air loop set-points, determine a correlation factor for the number of system parameters; and alter the number of liquid loop set-points and the number of air loop set-points based on the correlation factor to lower an energy consumption or to maximize energy reuse of a number of cooling resources associated with the number of system parameters.

公开(公告)号：US10561040B1

公开(公告)日：2020-02-11

申请号：US16154710

申请日：2018-10-08

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey Lunsman ,  Tahir Cader ,  Michael Scott

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.

公开(公告)号：US20180094875A1

公开(公告)日：2018-04-05

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H05K7/20 ,  H01L23/473

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.