公开(公告)号：DE69606201D1

公开(公告)日：2000-02-17

申请号：DE69606201

申请日：1996-06-19

Applicant: IBM ,  PATTANAIK SURYA ,  RUIZ OSCAR JAIME ,  SHUM WING C

Inventor： FRATER KERMIT ,  PATTANAIK SURYA ,  RUIZ JAIME ,  SHUM C

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  G11B21/10

Abstract: Disc file data read/write head assembly has a slider (56) having an air bearing surface facing the data surface of the disc and a back surface which is attached to a suspension (42) which biases the slider in close proximity to the disc surface, in which the spacing between the slider (56) and suspension (42) is maintained by at least one solder bump (66). Also claimed is the method of controlling the spacing between the suspension and slider as described above and in which the slider is attached to the suspension by adhesive surrounding the solder bumps, and such a slider suspension arrangement in a magnetic disc data storage system.

公开(公告)号：HU9902493A2

公开(公告)日：1999-11-29

申请号：HU9902493

申请日：1997-02-24

Applicant: IBM

Inventor： ERPELDING DAVID ,  PATTANAIK SURYA ,  SIMMONS RANDALL GEORGE

IPC: G11B5/39 ,  G11B5/40 ,  G11B5/48 ,  H05K1/00 ,  H05K1/02

Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.

公开(公告)号：SG50798A1

公开(公告)日：1998-07-20

申请号：SG1997000433

申请日：1997-02-19

Applicant: IBM

Inventor： FRATER NORMAN KERMIT ,  PATTANAIK SURYA ,  RUIZ OSCAR JAIME ,  SHUM WING C

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  G11B5/53 ,  G11B5/102

Abstract: Disc file data read/write head assembly has a slider (56) having an air bearing surface facing the data surface of the disc and a back surface which is attached to a suspension (42) which biases the slider in close proximity to the disc surface, in which the spacing between the slider (56) and suspension (42) is maintained by at least one solder bump (66). Also claimed is the method of controlling the spacing between the suspension and slider as described above and in which the slider is attached to the suspension by adhesive surrounding the solder bumps, and such a slider suspension arrangement in a magnetic disc data storage system.

公开(公告)号：AU6284696A

公开(公告)日：1997-10-10

申请号：AU6284696

申请日：1996-06-19

Applicant: IBM ,  PELDING A DAVID ,  PALMER DARRELL DEAN ,  PATTANAIK SURYA ,  RUIZ OSCAR JAIME

Inventor： ERPELDING A DAVID ,  PALMER DARRELL DEAN ,  PATTANAIK SURYA ,  RUIZ OSCAR JAIME

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  G11B5/54 ,  G11B5/596 ,  G11B21/02 ,  G11B21/04

公开(公告)号：DE3778290D1

公开(公告)日：1992-05-21

申请号：DE3778290

申请日：1987-10-06

Applicant: IBM

Inventor： AINSLIE NORMAN G ,  BREDE DWIGHT W ,  ERPELDING A DAVID ,  PATTANAIK SURYA

IPC: G11B5/60 ,  G11B5/11 ,  G11B5/31 ,  G11B5/40 ,  G11B5/48 ,  G11B21/16 ,  H01R4/02 ,  G11B5/17

Abstract: In a data recording disk file a slider (16) is mechanically attached to the suspension (40) by means of reflowed solder balls (80). A pattern of solder contact pads (70) is formed on the back side of the slider and a similar pattern of solder-wettable regions (60,61,63) is formed on the suspension. Solder balls are formed on either the solder contact pads or the solder-wettable regions, the slider is located on the suspension so that the solder balls are in registration between the solder contact pads and solder-wettable regions, and the solder is heated to reflow, thereby forming solder joints (80,86) as a mechanical connection between the slider and suspension. When a thin film transducer (11,13) is formed on the slider trailing edge (26) and the suspension is a laminated type with patterned conductors (46,55), solder balls are also formed on the transducer lead terminations (19,21; 27,29) on the trailing edge and on a row of solder-wettable regions (61,63) on the suspension near the location where the trailing edge of the slider is to be located. In this embodiment, when the slider with thin film transducer, with solder balls on the lead terminations, is located over the suspension then all of the solder balls are heated. The solder balls for providing mechanical connection collapse during reflow, thereby causing the solder balls on the transducer lead terminations to come in contact with and flow together with the solder balls formed on the row of solder-wettable regions on the suspension. Thus the mechanical attachment of the slider is made simultaneously with the electrical connection of the transducer leads to the disk file read/write electronics.