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公开(公告)号：JPH1139628A
公开(公告)日：1999-02-12
申请号：JP16460498
申请日：1998-06-12
Applicant: IBM
Inventor： SIMMONS RANDALL GEORGE , VICTOR WIN SHUN SHUM
Abstract: PROBLEM TO BE SOLVED: To provide a transducer suspension system provided with stuck electric leads. SOLUTION: This transducer suspension system has a transducer head, a lamination member and a load beam. The lamination member 112 is consisting of one support layer 158, at least two electric insulating layers 152, 156 and at least two conductive layers 150, 154. Respective electric leads are directly formed on the lamination layer so that they become directly above or under at least other one electric lead. Electric leads being at upper sides can perform the same noise cancellation as that of twisted pair lines. Moreover, it is possible to accommodate more numerous electric leads by the same suspension width by sticking the electric leads while providing spparations equivalent to a thickness D2 with respect to the minimum distance D1 to be needed in an etching processing. The insulating layer includes, for example, polyimide and the conductive layer can include, for example, copper. Further, a pattern can be formed by coating photoresist on the upper surface of the layer 150 and by exposing it with a light.
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2.发明专利
公开(公告)号：JPH1055511A
公开(公告)日：1998-02-24
申请号：JP9909197
申请日：1997-04-16
Applicant: IBM
Inventor： ERPELDING A DAVID , PATTANAIK SURYA , SIMMONS RANDALL GEORGE
Abstract: PROBLEM TO BE SOLVED: To protect an MR head having an MR sensor against the damage generated by the presence of an electric field having static electricity by discharge. SOLUTION: The MR head is provided with shunts in the positions immediate near the terminals of adjacent conductive leads 18, 19 heading toward the MR sensor on the MR head across these leads. Solder overhanging parts of at least one of selected shapes are arranged adjacently to the leads in order to facilitate the removal of the shunts by causing the reflow of solder. These overhanging parts include limitation overhanging parts 30, 32 which play the role of limiting the solder within the shunt regions when the shunts are formed and an assignment part 32 which acts to transfer the solder from the shunt regions to an assigned position at the time of the next reflow of the solder and to give rise to physical breakdown in the shunt accordingly. The need for the physical removal of the solder material is eliminated.
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公开(公告)号：DE69012259T2
公开(公告)日：1995-03-30
申请号：DE69012259
申请日：1990-06-21
Applicant: IBM
Inventor： HOWARD JAMES KENT , SIMMONS RANDALL GEORGE , YOGI TADASHI
IPC: C23C14/14 , G11B5/64 , G11B5/65 , G11B5/66 , G11B5/73 , G11B5/738 , G11B5/85 , G11B5/851 , H01F10/16 , H01F41/18
Abstract: An improved CoPt alloy magnetic recording disk for horizontal recording has a magnetic recording layer which includes oxygen, the oxygen being present preferably in the range of approximately 5 to 30 atomic percent. The resulting disk structure has substantially decreased intrinsic media noise at high linear recording density.
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4.发明专利
公开(公告)号：SG48522A1
公开(公告)日：1998-04-17
申请号：SG1997000892
申请日：1997-03-22
Applicant: IBM
Inventor： ERPELDING A DAVID , PATTANAIK SURYA , SIMMONS RANDALL GEORGE
Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.
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公开(公告)号：DE69012259D1
公开(公告)日：1994-10-13
申请号：DE69012259
申请日：1990-06-21
Applicant: IBM
Inventor： HOWARD JAMES KENT , SIMMONS RANDALL GEORGE , YOGI TADASHI
IPC: C23C14/14 , G11B5/64 , G11B5/65 , G11B5/66 , G11B5/73 , G11B5/738 , G11B5/85 , G11B5/851 , H01F10/16 , H01F41/18
Abstract: An improved CoPt alloy magnetic recording disk for horizontal recording has a magnetic recording layer which includes oxygen, the oxygen being present preferably in the range of approximately 5 to 30 atomic percent. The resulting disk structure has substantially decreased intrinsic media noise at high linear recording density.
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Patent Agency Ranking
公开(公告)号：HU221357B1
公开(公告)日：2002-09-28
申请号：HU9902493
申请日：1997-02-24
Applicant: IBM
Inventor： ERPELDING DAVID , PATTANAIK SURYA , SIMMONS RANDALL GEORGE
Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.
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公开(公告)号：ES2145579T3
公开(公告)日：2000-07-01
申请号：ES97905249
申请日：1997-02-24
Applicant: IBM
Inventor： BROOKS WILLIAM WOODROW JR , HILLMAN WESLEY LEROY , PALMER DARRELL DEAN , SIMMONS RANDALL GEORGE , VOSS STEVEN HARRY , SHUM WING CHUN
Abstract: An integrated suspension for a slider in a magnetic storage system has a simplified structure that is relatively easy to manufacture. The novel integrated suspension may be assembled from separate pieces, including a load beam, a flexure and a mounting plate. The load beam provides rigid structural support of the flexure. The flexure includes a flexible member and leads integrally formed thereon. A section of the flexible member is fixedly attached to the load member, and another section having the slider mounted thereon presses against a pivot projection in the load beam for gimbal motions. An interlocking structure is provided to limit the extent of gimbal motions of the flexible member, comprising a tab extending from the flexible member into an aperture in the load beam. Alternatively, a tang is formed in the flexible member which is used to form a clip which serves to limit gimbal motions as it interacts with the load beam.
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公开(公告)号：HU9902493A2
公开(公告)日：1999-11-29
申请号：HU9902493
申请日：1997-02-24
Applicant: IBM
Inventor： ERPELDING DAVID , PATTANAIK SURYA , SIMMONS RANDALL GEORGE
Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.
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公开(公告)号：AT192601T
公开(公告)日：2000-05-15
申请号：AT97905249
申请日：1997-02-24
Applicant: IBM
Inventor： BROOKS WILLIAM WOODROW JR , HILLMAN WESLEY LEROY , PALMER DARRELL DEAN , SIMMONS RANDALL GEORGE , VOSS STEVEN HARRY , SHUM WING CHUN
Abstract: An integrated suspension for a slider in a magnetic storage system has a simplified structure that is relatively easy to manufacture. The novel integrated suspension may be assembled from separate pieces, including a load beam, a flexure and a mounting plate. The load beam provides rigid structural support of the flexure. The flexure includes a flexible member and leads integrally formed thereon. A section of the flexible member is fixedly attached to the load member, and another section having the slider mounted thereon presses against a pivot projection in the load beam for gimbal motions. An interlocking structure is provided to limit the extent of gimbal motions of the flexible member, comprising a tab extending from the flexible member into an aperture in the load beam. Alternatively, a tang is formed in the flexible member which is used to form a clip which serves to limit gimbal motions as it interacts with the load beam.
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公开(公告)号：SG66488A1
公开(公告)日：1999-07-20
申请号：SG1998001727
申请日：1998-07-06
Applicant: IBM
Inventor： SIMMONS RANDALL GEORGE , SHUM VICTOR WING CHUN
IPC: G11B5/48 , G11B21/00 , G11B21/16 , G11B21/21 , H05K1/02 , G11B5/60 , H05K1/05 , G11B5/53 , G11B33/12
Abstract: A transducer suspension system has a transducer head, laminated member and a load beam. The laminated member is comprised of a support layer, at least two electrically insulating layers, and at least two electrically conducting layers. The electrical leads are formed directly into the laminated member such that each electrical lead is directly above or below at least one other electrical lead. The overlying leads have noise cancellation similar to that for twisted wire pairs. In addition, by stacking the electrical leads, more electrical leads can be accommodated in the same suspension width.
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