公开(公告)号：DE19910755B4

公开(公告)日：2007-04-26

申请号：DE19910755

申请日：1999-03-11

Applicant: INT RECTIFIER CORP

Inventor： TAKAHASHI TOSHIO ,  TAM DAVID C ,  PARRY JOHN ,  TCHAMDSOU ARISTIDE ,  CHEY CHRISTOPHER C ,  DUBHASHI AJIT

IPC: H03K7/08 ,  G01R19/25 ,  H02P20060101 ,  H02P7/00 ,  H02P23/00 ,  H03F3/387 ,  H03M1/60

公开(公告)号：FR2861915A1

公开(公告)日：2005-05-06

申请号：FR0312669

申请日：2003-10-29

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT

IPC: H02M1/08 ,  H02M3/145 ,  H02M7/217 ,  H02P7/00

Abstract: The circuit has a comparator (8) to receive filtered detected voltage across a MOSFET (4) and including a voltage input for producing a comparison result with the voltage. The comparators output is applied to a MOSFET driving circuit. The output provides a signal that indicates conduction state of the MOSFET, to close channel of the MOSFET. The signal indicates to the driving circuit to open the channel. An independent claim is also included for a method of controlling a MOSFET operating in a synchronous rectifier mode for low voltage motor supply.

公开(公告)号：FR2809231A1

公开(公告)日：2001-11-23

申请号：FR0105872

申请日：2001-05-02

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT ,  SIU STEPHEN NICHOLAS ,  LIN HENY W ,  VAYSSE BERTRAND P ,  CORFIELD MICHAEL A

IPC: H01L23/24 ,  H01L23/40 ,  H01L25/16 ,  H01L25/07 ,  H01L25/18 ,  H05K7/14 ,  H05K7/20 ,  H01L23/34 ,  H01L23/32 ,  H01L23/52

Abstract: A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board that is mounted above and spaced from the top side of the IMS. There are provided devices that are mounted on the circuit board which are electrically connected to the power semiconductor devices. There may be a cavity in the circuit board allowing the top of the IMS to be exposed, and optionally providing access for bonding wires to the top of the circuit. Bonding pads may be provided on the circuit board for electrical connection with the bonding wires. A cover may be optionally provided to enclose a space over the cavity. Potting compound may be contained in the space created by the cavity.

公开(公告)号：GB2320762B

公开(公告)日：2001-06-27

申请号：GB9723677

申请日：1997-11-07

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT ,  CLEMENTE STEFANO ,  CHEY CHRISTOPHER

IPC: H02P6/18 ,  G01R19/00 ,  H02P6/00

Abstract: A current sensing circuit including a shunt resistor coupled, at one end, to the low-side transistor of a half bridge circuit and, at its other end, to a load. The voltage sensed across the shunt resistor is proportional to the current delivered to the load. A level shifting circuit is provided to transpose the sensed voltage to a low voltage signal which can be fed back to control commutation of the transistors in the half bridge circuit.

公开(公告)号：DE19910755A1

公开(公告)日：1999-10-28

申请号：DE19910755

申请日：1999-03-11

Applicant: INT RECTIFIER CORP

Inventor： TAKAHASHI TOSHIO ,  TAM DAVID C ,  PARRY JOHN ,  TCHAMDSOU ARISTIDE ,  CHEY CHRISTOPHER C ,  DUBHASHI AJIT

IPC: G01R19/25 ,  H02P20060101 ,  H02P7/00 ,  H02P23/00 ,  H03F3/387 ,  H03K7/08 ,  H03M1/60

Abstract: The circuit converts an analog current sense signal, in a motor drive controller circuit, from a high side reference potential to a low side reference potential for measurement and processing. The circuit comprises a section for converting the input signal, at a first potential, into a pulse width modulated (PWM) signal. A further circuit section is provided for level shifting the pulse width modulated signal from the first potential to a second potential.

公开(公告)号：GB2238167B

公开(公告)日：1993-06-09

申请号：GB9023303

申请日：1990-10-25

Applicant: INT RECTIFIER CORP

Inventor： PELLY BRIAN R ,  DUBHASHI AJIT ,  EWER PETER RICHARD

IPC: H01L25/16 ,  H01L25/18 ,  H01L25/07 ,  H02M7/00 ,  H02M7/538 ,  H03K17/082 ,  H03K17/12

Abstract: A power module contains IGBT die along with integrated circuit driver chips and opto isolators or isolation transformers within the same module housing. Output terminals are provided which can be interfaced directly to control logic or microprocessors for operating the module. The IGBTs may have current-sensing electrodes to simplify current measurement and control functions.

公开(公告)号：IT9021891A1

公开(公告)日：1992-04-26

申请号：IT2189190

申请日：1990-10-26

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT ,  EWER PETER RICHARD ,  PELLY BRIAN R

IPC: H01L20060101 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H02M7/00 ,  H02M7/538 ,  H03K17/082 ,  H03K17/12

公开(公告)号：FR2801725B1

公开(公告)日：2007-06-29

申请号：FR0014866

申请日：2000-11-17

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT ,  SIU STEPHEN NICHOLAS ,  LIN HENY W ,  VAYSSE BERTRAND P ,  CORFIELD MICHAEL A

IPC: H01L23/34 ,  H01L23/24 ,  H01L25/07 ,  H01L23/32 ,  H01L23/40 ,  H01L23/52 ,  H01L25/16 ,  H01L25/18 ,  H05K7/14 ,  H05K7/20

Abstract: A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board that is mounted above and spaced from the top side of the IMS. There are provided devices that are mounted on the circuit board which are electrically connected to the power semiconductor devices. There may be a cavity in the circuit board allowing the top of the IMS to be exposed, and optionally providing access for bonding wires to the top of the circuit. Bonding pads may be provided on the circuit board for electrical connection with the bonding wires. A cover may be optionally provided to enclose a space over the cavity. Potting compound may be contained in the space created by the cavity.

公开(公告)号：DE10019696B4

公开(公告)日：2007-06-06

申请号：DE10019696

申请日：2000-04-20

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT ,  VAYSSE BERTRAND

IPC: H02M1/12 ,  H02M1/14 ,  H02M1/44 ,  H02M5/45 ,  H02M7/00 ,  H02P23/00

Abstract: Conductive EMI in motor drive circuits is reduced by interposing inductors in the ground line. The common mode current enters the motor drive circuit through the two supply leads and leaves the system through the ground lead. The ground current typically is very high frequency but very low in rms amperage. Interposing an induction (low current, very high L) in the ground line advantageously reduces EMI. The inventive method reduces.or eliminates the need for filtering capacitors across the rectifier of the motor drive circuit. In addition, the inventive method minimizes the common mode choke to merely a wraparound ferrite core over the input wires. EMI emissions are reduced further by sandwiching ground traces along with power traces and connecting to.the heat sink with the shortest possible route. This reduces the ground loop area, which consequently reduces emissions.

公开(公告)号：AU2003212411A1

公开(公告)日：2003-09-09

申请号：AU2003212411

申请日：2003-02-26

Applicant: INT RECTIFIER CORP

Inventor： DUBHASHI AJIT

IPC: H01L23/427 ,  H05K1/02 ,  H05K1/18

Abstract: An electrical assembly, including an electrical device; and at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.