FLEXIBLE POWER DEVICE
    3.
    发明专利

    公开(公告)号:JP2001210784A

    公开(公告)日:2001-08-03

    申请号:JP2000350726

    申请日:2000-11-17

    Abstract: PROBLEM TO BE SOLVED: To provide a circuit module based on a new package concept which is applicable to either a high-power application or low-power application at a low cost. SOLUTION: A semiconductor device module 60 comprises a flat heat- conductive substrate 22 where, connected to a heat sink 1 for heat-conduction, a semiconductor device 23 is provided on the side opposite to the heat sink 21, a circuit board 27 where, being directly placed on the heat sink 21 while above the upper surface of heat-conductive 22, an opening 10 through which the semiconductor device 23 is exposed is formed, and another device which is, provided on the circuit board 27, electrically connected to the semiconductor device 23 on the heat-conductive substrate 22.

    METHOD FOR REDUCING EMI EMISSION IN MOTOR DRIVEN

    公开(公告)号:JP2001008495A

    公开(公告)日:2001-01-12

    申请号:JP2000123299

    申请日:2000-04-24

    Abstract: PROBLEM TO BE SOLVED: To reduce transmission and radiation EMI in a motor drive application by inserting an inductor into the ground line of a motor drive circuit. SOLUTION: In a motor drive circuit 40, inductors 42 and 44 are inserted into a ground line 46. High frequency current flowing in the loop is reduced, a ground loop area on a printed board is narrowed, and therefore radiation EMI is reduced. A power device is capacitively coupled to a heat sink and current generated by capacitive coupling flows and is returned to a heat sink connection. Thus, transmission and radiation EMI in a motor drive application can be reduced.

    DETECTION CIRCUIT FOR LOAD CURRENT OF MOTOR

    公开(公告)号:JPH10191683A

    公开(公告)日:1998-07-21

    申请号:JP34695297

    申请日:1997-11-10

    Abstract: PROBLEM TO BE SOLVED: To minimize a power consumption in a resistor, and to maintain a charging operation in a bootstrap capacitor by a method wherein a shunt resistor is arranged to a load such as a motor or like from the connection point of a high-voltage side to a low-voltage side in a half bridge circuit. SOLUTION: A voltage across both ends of a shunt resistor Rshunt regulates the signal of an IC 42 at its signal regulating block 44. The regulating signal is supplied to a high-voltage analog level shifting circuit 46. The high-voltage analog level shifting circuit 46 generates a current Ifb, to be controlled, which is passed through a resistor Rp arranged at the outside of a chip, and it generates a voltage which is proportional to the regulated signal. At this time, the current Ifb to be controlled is passed successively through a resistance R having a stable value so as to generate a voltage Vfb. The voltage Vfb is postprocessed by a processing block 48, and a signal having a prescribed parameter (e.g. a central voltage at about 25V) is generated. The signal which is obtained as a result expressed a current which flows into a motor, and it is output from the IC 42 after that.

    POWER MODULE
    6.
    发明专利

    公开(公告)号:JPH10144863A

    公开(公告)日:1998-05-29

    申请号:JP20586397

    申请日:1997-07-31

    Abstract: PROBLEM TO BE SOLVED: To eliminate the need of auxiliary design of an insulation/drive circuit by housing a semiconductor chip comprising an integrated drive circuit having current limit and current trip function in the housing of a power module along with a photocoupling element for electrically insulating a drive signal being applied externally. SOLUTION: The power module comprises power semiconductor dies, i.e., two IGBTs(insulated gate bipolar transistors) 40, 41 arranged in a half-wave bridge module circuit. Power diodes i.e., free wheel diodes 42, 43, are connected in parallel and thermally coupled with a heat sink having the IGBTs 40, 41 in the form of die while being supported. Control drive chips 44, 45 constituting an integrated circuit semiconductor device for driving and controlling the IGBTs 40, 41 in response to the state of output current enhance the short-circuiting capability of the IGBTs 40, 41 using a current sensor and comprise photocoupler elements 46, 47. Power is fed from a local power supply element comprising a Zener diode 51.

    MULTIPLEX DISCRETE KELVIN EMITTER CONNECTION FOR REDUCING CURRENT FLOW THROUGH PARASITIC DIODE

    公开(公告)号:JPH1014250A

    公开(公告)日:1998-01-16

    申请号:JP7136897

    申请日:1997-03-25

    Abstract: PROBLEM TO BE SOLVED: To obtain a driver circuit protected against an uncontrollable current in an integrated circuit, causing breakdown of a switching transistor by providing a switching transistor on the bottom rail with a discrete Kelvin emitter, for decreasing the parasitic inductance. SOLUTION: Each switching transistor Q2 , Q4 , Q6 on the bottom rail is provided with a discrete Kelvin emitter to the COM terminal of an integrated circuit. Consequently, the parasitic inductances L2 , L4 , L6 of an emitter lead are significantly decreased (typically, on the order of subnano H). In practice, this is achieved through discrete connection from a common point or the anode of a diode. More specifically, a first reference is present in the connection with each of three IGBTs on the low side. Parasitic inductance in the high current path of driver circuits A-D can be decreased by connecting a trace as close to the element as possible.

    9.
    发明专利
    未知

    公开(公告)号:DE10019696A1

    公开(公告)日:2001-10-04

    申请号:DE10019696

    申请日:2000-04-20

    Abstract: Conductive EMI in motor drive circuits is reduced by interposing inductors in the ground line. The common mode current enters the motor drive circuit through the two supply leads and leaves the system through the ground lead. The ground current typically is very high frequency but very low in rms amperage. Interposing an induction (low current, very high L) in the ground line advantageously reduces EMI. The inventive method reduces.or eliminates the need for filtering capacitors across the rectifier of the motor drive circuit. In addition, the inventive method minimizes the common mode choke to merely a wraparound ferrite core over the input wires. EMI emissions are reduced further by sandwiching ground traces along with power traces and connecting to.the heat sink with the shortest possible route. This reduces the ground loop area, which consequently reduces emissions.

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