Abstract:
An electrical assembly, including an electrical device; and at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.
Abstract:
An electrical assembly (400), including an electrical device (405); and at least one self-contained phase change package (430) in thermal contact with the electrical device, the self-contained phase change package including an enclosure (435)and a phase change material (440) arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit module based on a new package concept which is applicable to either a high-power application or low-power application at a low cost. SOLUTION: A semiconductor device module 60 comprises a flat heat- conductive substrate 22 where, connected to a heat sink 1 for heat-conduction, a semiconductor device 23 is provided on the side opposite to the heat sink 21, a circuit board 27 where, being directly placed on the heat sink 21 while above the upper surface of heat-conductive 22, an opening 10 through which the semiconductor device 23 is exposed is formed, and another device which is, provided on the circuit board 27, electrically connected to the semiconductor device 23 on the heat-conductive substrate 22.
Abstract:
PROBLEM TO BE SOLVED: To reduce transmission and radiation EMI in a motor drive application by inserting an inductor into the ground line of a motor drive circuit. SOLUTION: In a motor drive circuit 40, inductors 42 and 44 are inserted into a ground line 46. High frequency current flowing in the loop is reduced, a ground loop area on a printed board is narrowed, and therefore radiation EMI is reduced. A power device is capacitively coupled to a heat sink and current generated by capacitive coupling flows and is returned to a heat sink connection. Thus, transmission and radiation EMI in a motor drive application can be reduced.
Abstract:
PROBLEM TO BE SOLVED: To minimize a power consumption in a resistor, and to maintain a charging operation in a bootstrap capacitor by a method wherein a shunt resistor is arranged to a load such as a motor or like from the connection point of a high-voltage side to a low-voltage side in a half bridge circuit. SOLUTION: A voltage across both ends of a shunt resistor Rshunt regulates the signal of an IC 42 at its signal regulating block 44. The regulating signal is supplied to a high-voltage analog level shifting circuit 46. The high-voltage analog level shifting circuit 46 generates a current Ifb, to be controlled, which is passed through a resistor Rp arranged at the outside of a chip, and it generates a voltage which is proportional to the regulated signal. At this time, the current Ifb to be controlled is passed successively through a resistance R having a stable value so as to generate a voltage Vfb. The voltage Vfb is postprocessed by a processing block 48, and a signal having a prescribed parameter (e.g. a central voltage at about 25V) is generated. The signal which is obtained as a result expressed a current which flows into a motor, and it is output from the IC 42 after that.
Abstract:
PROBLEM TO BE SOLVED: To eliminate the need of auxiliary design of an insulation/drive circuit by housing a semiconductor chip comprising an integrated drive circuit having current limit and current trip function in the housing of a power module along with a photocoupling element for electrically insulating a drive signal being applied externally. SOLUTION: The power module comprises power semiconductor dies, i.e., two IGBTs(insulated gate bipolar transistors) 40, 41 arranged in a half-wave bridge module circuit. Power diodes i.e., free wheel diodes 42, 43, are connected in parallel and thermally coupled with a heat sink having the IGBTs 40, 41 in the form of die while being supported. Control drive chips 44, 45 constituting an integrated circuit semiconductor device for driving and controlling the IGBTs 40, 41 in response to the state of output current enhance the short-circuiting capability of the IGBTs 40, 41 using a current sensor and comprise photocoupler elements 46, 47. Power is fed from a local power supply element comprising a Zener diode 51.
Abstract:
PROBLEM TO BE SOLVED: To obtain a driver circuit protected against an uncontrollable current in an integrated circuit, causing breakdown of a switching transistor by providing a switching transistor on the bottom rail with a discrete Kelvin emitter, for decreasing the parasitic inductance. SOLUTION: Each switching transistor Q2 , Q4 , Q6 on the bottom rail is provided with a discrete Kelvin emitter to the COM terminal of an integrated circuit. Consequently, the parasitic inductances L2 , L4 , L6 of an emitter lead are significantly decreased (typically, on the order of subnano H). In practice, this is achieved through discrete connection from a common point or the anode of a diode. More specifically, a first reference is present in the connection with each of three IGBTs on the low side. Parasitic inductance in the high current path of driver circuits A-D can be decreased by connecting a trace as close to the element as possible.
Abstract:
A control circuit for a MOSFET in a synchronous rectifier unit comprises a comparator (8) to obtain a measured voltage along with the MOSFET (4), a reference potential (10), a MOSFET driver (2) to control channel switching, a coupled control signal and output for the comparator circuit to switch the channel in relation to the measured voltage. Independent claims are also included for the following: (A) control processes for the MOSFET; (B) a low voltage motor feed unit; (C) and a half-bridge driver for the above.
Abstract:
Conductive EMI in motor drive circuits is reduced by interposing inductors in the ground line. The common mode current enters the motor drive circuit through the two supply leads and leaves the system through the ground lead. The ground current typically is very high frequency but very low in rms amperage. Interposing an induction (low current, very high L) in the ground line advantageously reduces EMI. The inventive method reduces.or eliminates the need for filtering capacitors across the rectifier of the motor drive circuit. In addition, the inventive method minimizes the common mode choke to merely a wraparound ferrite core over the input wires. EMI emissions are reduced further by sandwiching ground traces along with power traces and connecting to.the heat sink with the shortest possible route. This reduces the ground loop area, which consequently reduces emissions.
Abstract:
A circuit for recovering a signal of interest which is offset by a common mode displacement, such as is the case when the signal is the voltage across a current sense resistor located on the high side bus or between the switches of a motor controller circuit. The circuit of the present invention converts the voltage across the resistor into a pulse code modulated data, then downshifts the voltage, and then recovers the signal of interest at the lower voltage by demodulating the signal. The recovered signal is then processed, either with a synchronized sample and hold circuit to provide an analog output, or with a counter and latch to provide a digital output.