公开(公告)号：AU2003233619A8

公开(公告)日：2003-12-12

申请号：AU2003233619

申请日：2003-05-21

Applicant: INTEL CORP

Inventor： ROTH WESTON ,  JACKSON JAMES ,  SEARLS DAMION

IPC: H01L21/60 ,  H01L23/64 ,  H05K1/02 ,  H05K1/14

公开(公告)号：HK1050104A1

公开(公告)日：2003-06-06

申请号：HK03102282

申请日：2003-03-31

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: F16F15/02 ,  F16F20060101 ,  H05K20060101 ,  F16F15/00 ,  G05D19/02 ,  H05K1/02 ,  H05K1/18

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

公开(公告)号：HK1077700B

公开(公告)日：2012-12-07

申请号：HK05112068

申请日：2005-12-29

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  RUTTAN THOMAS ,  MANIK JITEENDER

IPC: H05K20060101 ,  H01R12/51 ,  H05K7/10

公开(公告)号：DE112009002155T5

公开(公告)日：2012-01-12

申请号：DE112009002155

申请日：2009-08-27

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES A

IPC: H01L23/50 ,  H01L23/12

Abstract: Es werden Ausführungsformen einer Baugruppe auf Systemebene offenbart, die einen Integrierten-Schaltkreis(IC)-Chip enthält, der direkt auf einer Hauptplatine angebracht ist. Ein IC-Chip, der direkt auf einer Hauptplatine oder einer anderen Leiterplatte angebracht ist, kann als ein Direct Chip Attach(DCA)-Chip bezeichnet werden. Ein Gehäuse ist über mindestens einem Abschnitt des DCA-Chips angeordnet und mit der Hauptplatine gekoppelt. Das Gehäuse enthält einen oder mehrere weitere IC-Chip, die auf einem Substrat angeordnet sind. Es werden noch weitere Ausführungsformen beschrieben und beansprucht.

公开(公告)号：AT403956T

公开(公告)日：2008-08-15

申请号：AT01979711

申请日：2001-10-12

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01R4/02 ,  H01R12/57 ,  H01R12/70 ,  H05K3/34

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

公开(公告)号：DE60130450D1

公开(公告)日：2007-10-25

申请号：DE60130450

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: F16F15/02 ,  H05K1/02 ,  F16F15/00 ,  G05D19/02 ,  H05K1/18

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

公开(公告)号：AT373943T

公开(公告)日：2007-10-15

申请号：AT01923364

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: G01K1/14 ,  H05K1/02 ,  H05K1/18

Abstract: Piezoelectric material is embedded in epoxy layers of circuit cards to control thermal expansion and contraction as a function of temperature changes. A temperature sensor and thermostat generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material or different thermostats. Piezoelectric blocks can be arranged in regular patterns or can be randomly or pseudo-randomly placed.

公开(公告)号：HK1077700A1

公开(公告)日：2006-02-17

申请号：HK05112068

申请日：2005-12-29

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  RUTTAN THOMAS ,  MANIK JITEENDER

IPC: H01R12/51 ,  H05K20060101 ,  H05K7/10

Abstract: A conventional land grid array (LGA) socket assembly uses the same socket contact in the power delivery area and the signal delivery area. Using low current socket contacts in the power delivery area may create self-heating and limit power delivery from a printed circuit board (PCB) to an IC package mounted in the socket. Embodiments of the present invention are directed to an LGA socket assembly that has a separate power delivery contact, which includes contact pins and contacts pads that are ganged using a cross beam to form a comb-shaped contact. In an alternative embodiment of the present invention, an LGA socket assembly has a shorter channel in the power delivery area than in known LGA socket assemblies. In still another embodiment, an LGA socket assembly has a shorter channel in the power delivery area in the signal delivery area.

公开(公告)号：AU4793701A

公开(公告)日：2001-11-12

申请号：AU4793701

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: F16F15/02 ,  F16F15/00 ,  G05D19/02 ,  H05K1/02 ,  H05K1/18

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.