公开(公告)号：JP2014030042A

公开(公告)日：2014-02-13

申请号：JP2013195262

申请日：2013-09-20

Applicant: Intel Corp ,  インテル・コーポレーション

Inventor： DAMION SEARLS ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JAMES D JACKSON ,  RAINER E THOMAS ,  CHARLES E GEALER

IPC: H05K1/18 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide a computing system, and more specifically, a system-level board structure.SOLUTION: Disclosed are embodiments of a system-level structure including an integrated circuit (IC) die 120 directly attached to a mainboard 110. The IC die directly attached to the mainboard 110 or other circuit board may be referred to as a direct-chip attach (DCA) die. A package 150a is disposed over at least a portion of the DCA die and coupled with the mainboard. The package 150a includes one or more other IC die disposed on a substrate. The mainboard has electrical paths to interconnect a plurality of components to form a computing system.

Abstract translation: 要解决的问题：提供一种计算系统，更具体地，提供一种系统级板结构。解决方案：公开了包括直接连接到主板110的集成电路（IC）芯片120的系统级结构的实施例。 直接连接到主板110或其他电路板的IC芯片可以被称为直接芯片连接（DCA）裸片。 封装150a设置在DCA管芯的至少一部分上并与主板耦合。 封装150a包括设置在基板上的一个或多个其它IC管芯。 主板具有用于互连多个组件以形成计算系统的电路径。

公开(公告)号：WO2010027890A2

公开(公告)日：2010-03-11

申请号：PCT/US2009055133

申请日：2009-08-27

Applicant: INTEL CORP ,  SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES E

Inventor： SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES E

IPC: H01L23/48 ,  H01L23/12

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

Abstract translation: 公开了包括直接附接到主板的集成电路（IC）裸片的系统级组件的实施例。 直接连接到主板或其他电路板的IC管芯可以被称为直接芯片连接（DCA）管芯。 封装设置在DCA管芯的至少一部分上并与主板耦合。 该封装包括设置在衬底上的一个或多个其他IC管芯。 描述并要求保护其他实施例。

公开(公告)号：GB2475658B

公开(公告)日：2012-11-28

申请号：GB201104809

申请日：2009-08-27

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES E

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/12 ,  H05K1/18

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

公开(公告)号：BRPI0913484A2

公开(公告)日：2016-08-30

申请号：BRPI0913484

申请日：2009-08-27

Applicant: INTEL CORP

Inventor： GEALER CHARLES E ,  SEARLS DAMION ,  JACKSON JAMES D ,  RAMIREZ MARGARET D ,  THOMAS RAINER E ,  ROTH WESTON C

IPC: H01L23/12 ,  H01L23/48

公开(公告)号：GB2475658A

公开(公告)日：2011-05-25

申请号：GB201104809

申请日：2009-08-27

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES E

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/12 ,  H05K1/18

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

公开(公告)号：RU2480862C2

公开(公告)日：2013-04-27

申请号：RU2011113546

申请日：2009-08-27

Applicant: INTEL CORP

Inventor： SIRLZ DEJMION ,  ROT UEHSTON K ,  RAMIREZ MARGARET D ,  DZHEKSON DZHEJMS D ,  TOMAS REJNER EH ,  DZHILER CHARL Z EH

IPC: H01L23/48 ,  H05K1/18

Abstract: Изобретениеотноситсяк вычислительнымсистемам, вчастностик системнойплате. Сущностьизобретения: вычислительнаясистемасодержитсистемнуюплату, кристаллинтегральнойсхемы, непосредственнозакрепленныйнасистемнойплате, модуль, закрепленныйнасистемнойплатеи перекрывающий, поменьшеймере, одинучастокнепосредственнозакрепляемогонасистемнойплатекристалла, атакже, поменьшеймере, одиндругойкомпонент, закрепленныйнасистемнойплате, котораявключает, поменьшеймере, одинэлектрическийканал, соединяющийнепосредственнозакрепляемыйнасистемнойплатекристаллс модулеми, поменьшеймере, одинэлектрическийканал, соединяющийнепосредственнозакрепляемыйнасистемнойплатекристаллс указаннымдругимкомпонентом. Изобретениепозволяетосуществитьэлектрическоесоединениедляобъединенияразличныхкомпонентовнасистемнойплатевычислительнойсистемы. 2 н. и 15 з.п. ф-лы, 3 ил.

公开(公告)号：DE112009002155T5

公开(公告)日：2012-01-12

申请号：DE112009002155

申请日：2009-08-27

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES A

IPC: H01L23/50 ,  H01L23/12

Abstract: Es werden Ausführungsformen einer Baugruppe auf Systemebene offenbart, die einen Integrierten-Schaltkreis(IC)-Chip enthält, der direkt auf einer Hauptplatine angebracht ist. Ein IC-Chip, der direkt auf einer Hauptplatine oder einer anderen Leiterplatte angebracht ist, kann als ein Direct Chip Attach(DCA)-Chip bezeichnet werden. Ein Gehäuse ist über mindestens einem Abschnitt des DCA-Chips angeordnet und mit der Hauptplatine gekoppelt. Das Gehäuse enthält einen oder mehrere weitere IC-Chip, die auf einem Substrat angeordnet sind. Es werden noch weitere Ausführungsformen beschrieben und beansprucht.