公开(公告)号：WO2018004869A1

公开(公告)日：2018-01-04

申请号：PCT/US2017/033385

申请日：2017-05-18

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  EID, Feras ,  YOUNG, Ian A.

IPC: G01R33/00

CPC classification number: G01R23/02 ,  G01D5/00 ,  G01D18/006 ,  G01P15/097 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments of the invention include a resonant sensing system comprising driving circuitry to generate a drive signal during excitation time periods, a first switch coupled to the driving circuitry, and a sensing device coupled to the driving circuitry via the first switch during the excitation time periods. The sensing device includes beams to receive the drive signal during a first excitation time period that causes the beams to mechanically oscillate and generate a first induced electromotive force (emf) in response to the drive signal. The first switch decouples the sensing device and the driving circuitry during measurement time periods for measurement of the induced emf.

Abstract translation: 本发明的实施例包括谐振感测系统，该谐振感测系统包括用于在激励时间段期间产生驱动信号的驱动电路，耦合到驱动电路的第一开关以及经由驱动电路耦合到驱动电路的感测设备 在激励时间段内第一次切换。 感测装置包括用于在第一激励时间段期间接收驱动信号的波束，该第一激励时间段使波束机械地振荡并响应于驱动信号产生第一感应电动势（emf）。 第一个开关在测量时间段内将感测装置和驱动电路分开，以测量感应电动势。

公开(公告)号：WO2018004688A1

公开(公告)日：2018-01-04

申请号：PCT/US2016/040843

申请日：2016-07-01

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  EID, Feras ,  ELSHERBINI, Adel A. ,  SWAN, Johanna ,  LIFF, Shawna M. ,  SOUNART, Thomas L. ,  OSTER, Sasha N.

IPC: H04R17/00 ,  B06B1/06

CPC classification number: H04R17/005 ,  B06B1/0622 ,  B06B1/0625 ,  B06B1/0644 ,  H04R2201/028

Abstract: Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.

Abstract translation: 本发明的实施例包括声换能器装置，该声换能器装置具有定位在有机基板的空腔附近的基部结构，与基部结构的第一电极接触的压电材料以及 第二电极与压电材料接触。 在一个示例中，对于发射模式，在第一电极和第二电极之间施加电压信号，并且这导致压电材料中的应力，这导致与第一电极，压电材料和第二电极一起形成的叠层成为 振动并因此基础结构振动并产生声波。

公开(公告)号：WO2017111920A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/067190

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

IPC: H01Q3/34 ,  H01Q21/06

CPC classification number: H01Q3/36 ,  H01Q21/06 ,  H01Q23/00

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

Abstract translation: 本发明的实施例包括通信模块，该通信模块包括具有收发器和耦合到管芯的移相器管芯的管芯。 移相器包括一个功率合成器和分配器。 通信模块还包括耦合到移相器管芯的衬底。 基片包括一个天线单元，具有可控波束形成能力，用于发送和接收通信。

公开(公告)号：WO2017052651A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052472

申请日：2015-09-25

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  RAWLINGS, Brandon M. ,  DOGIAMIS, Georgios C.

IPC: H04B1/00 ,  G06F13/14

CPC classification number: H04B1/00 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.

Abstract translation: 在使用毫米波无线电布的集成电路封装之间描述了通信。 在一个示例中，第一包装具有无线电收发器以与第二包装的无线电收发器进行通信。 第二包装具有无线电收发器以与第一包装的无线电收发器进行通信。 交换机与第一包装和第二包装件通信，以在第一包装和第二包装之间通过相应的无线电收发器建立连接。 系统板承载第一包装，第二包装和开关。

公开(公告)号：WO2022265714A1

公开(公告)日：2022-12-22

申请号：PCT/US2022/022329

申请日：2022-03-29

Applicant: INTEL CORPORATION

Inventor： ALEKSOV, Aleksandar ,  KAMGAING, Telesphor ,  PRABHU GAUNKAR, Neelam ,  DOGIAMIS, Georgios C. ,  STRONG, Veronica

IPC: H01L23/498 ,  H01L23/492 ,  H01L23/15

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.

公开(公告)号：WO2022265708A1

公开(公告)日：2022-12-22

申请号：PCT/US2022/021728

申请日：2022-03-24

Applicant: INTEL CORPORATION

Inventor： ALEKSOV, Aleksandar ,  KAMGAING, Telesphor ,  STRONG, Veronica ,  DOGIAMIS, Georgios C. ,  PRABHU GAUNKAR, Neelam

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/15

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnect (FLI) pads are on a topmost buildup layer, and the FLI pads have a pitch. In an embodiment, a plurality of vertically oriented planes are embedded in the core, and the vertically oriented planes are spaced at the pitch.

公开(公告)号：WO2018125479A1

公开(公告)日：2018-07-05

申请号：PCT/US2017/063600

申请日：2017-11-29

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N.

IPC: H01P3/08

Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.

公开(公告)号：WO2018125183A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069376

申请日：2016-12-30

Applicant: INTEL CORPORATION ,  NAIR, Viyay K. ,  OSTER, Sasha N. ,  SWAN, Johanna M. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  ELSHERBINI, Adel A.

Inventor： NAIR, Viyay K. ,  OSTER, Sasha N. ,  SWAN, Johanna M. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  ELSHERBINI, Adel A.

IPC: H01L23/66 ,  H01L23/522

Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.

公开(公告)号：WO2018118338A1

公开(公告)日：2018-06-28

申请号：PCT/US2017/063119

申请日：2017-11-22

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  COHEN, Emanuel ,  OSTER, Sasha N. ,  KAMGAING, Telesphor

IPC: H04B10/2507 ,  H04B10/2575 ,  H04B3/52

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：WO2018111268A1

公开(公告)日：2018-06-21

申请号：PCT/US2016/066717

申请日：2016-12-14

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  ALEKSOV, Aleksandar

IPC: H01L23/66 ,  H01L23/522 ,  H01L25/04 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H01Q9/04

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.