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    CAPACITIVE SENSOR
    22.
    发明申请
    CAPACITIVE SENSOR 审中-公开

    公开(公告)号：WO2019197972A1

    公开(公告)日：2019-10-17

    申请号：PCT/IB2019/052882

    申请日：2019-04-08

    Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： HUSSAIN, Muhammad Mustafa ,  KHAN, Sherjeel Munsif

    IPC: G01L9/00 ,  G01L19/06 ,  H04R19/04

    Abstract: A capacitive sensor includes a sensor body having a cavity. The sensor body is non-electrically conductive. The sensor also includes a first diaphragm having a metallic conductor layer. The first diaphragm is arranged on the sensor body on a first side of the cavity. The sensor further includes a second diaphragm having a metallic conductor layer. The second diaphragm is arranged on the sensor body on a second side of the cavity. An air gap is formed in the cavity between the first and second diaphragms, the air gap having a height equal to a height of the sensor body.

    STRAIN-INDUCED TOPOLOGICAL TRANSFORMATION OF THERMOELECTRIC RESPONSIVE THIN FILMS
    25.
    发明申请
    STRAIN-INDUCED TOPOLOGICAL TRANSFORMATION OF THERMOELECTRIC RESPONSIVE THIN FILMS 审中-公开

    公开(公告)号：WO2018100496A1

    公开(公告)日：2018-06-07

    申请号：PCT/IB2017/057467

    申请日：2017-11-28

    Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： SINGH, Devendra ,  HUSSAIN, Muhammad Mustafa

    IPC: H01L35/34 ,  H01L35/32

    Abstract: A three-dimensional structure may be obtained from a two-dimensional thin film by applying a stressor layer to the two-dimensional thin film and releasing the thin film from a support substrate. Such a three-dimensional structure may include a thermoelectric responsive material for forming a thermoelectric generator (TEG). A manufacturing process for the transformation from 2-D to 3-D may use a polymer stressor layer deposited on the thermoelectric responsive thin film. The combination thermoelectric responsive layer and stressor layer can be released from a carrier, after which the stressor layer causes the thermoelectric responsive layer to curl. The curl can cause the thermoelectric responsive layer to roll up during the release from the carrier to form a tubular structure.

    DECAL ELECTRONICS FOR PRINTED HIGH PERFORMANCE CMOS ELECTRONIC SYSTEMS
    26.
    发明申请
    DECAL ELECTRONICS FOR PRINTED HIGH PERFORMANCE CMOS ELECTRONIC SYSTEMS 审中-公开
    印花高性能CMOS电子系统的DECAL ELECTRONICS

    公开(公告)号：WO2017199148A1

    公开(公告)日：2017-11-23

    申请号：PCT/IB2017/052816

    申请日：2017-05-12

    Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： HUSSAIN, Muhammad Mustafa ,  SEVILLA, Galo Torres ,  CORDERO, Marlon Diaz ,  KUTBEE, Arwa T.

    IPC: H01L21/48 ,  H01L23/538

    Abstract: High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

    Abstract translation: 高性能互补金属氧化物半导体（CMOS）电子元件对于任何成熟的电子系统都是至关重要的。 然而，最先进的CMOS电子设备刚性大，使其无法用于柔性电子应用。 尽管存在用于弯曲它们的散装材料减少方法，但是这种减薄的CMOS电子器件易碎并且容易受到高吞吐量制造的处理。 在这里，我们展示了用于柔性CMOS电子器件的CMOS技术兼容制造工艺的融合，其中基于喷墨和导电纤维素的互连，随后是增材制造（即，基于3D打印的封装）以及最终卷对卷印刷封装贴花电子器件 基于薄膜晶体管的电路元件和传感器），专注于印刷高性能柔性电子系统。 这项工作为包装灵活的电子系统提供了最实用的途径，适用于广泛的应用。

    EMBEDDING COMPLEX OBJECTS WITH 3D PRINTING
    27.
    发明申请
    EMBEDDING COMPLEX OBJECTS WITH 3D PRINTING 审中-公开
    用3D打印嵌入复杂对象

    公开(公告)号：WO2017175159A1

    公开(公告)日：2017-10-12

    申请号：PCT/IB2017/051966

    申请日：2017-04-05

    Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： HUSSAIN, Muhammad Mustafa ,  DIAZ CORDERO, Marlon Steven

    IPC: H01L33/48

    Abstract: A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.

    Abstract translation: 用于在增材制造（即3D打印）期间嵌入的用于柔性CMOS电子器件的CMOS技术兼容制造工艺。 用于这样的过程的方法可以包括：打印3D结构的第一部分; 暂停印刷3D结构以嵌入柔性硅衬底的步骤; 将柔性硅衬底放置在3D结构的第一部分的空腔中以将柔性硅衬底嵌入3D结构中; 并恢复打印3D结构以形成3D结构的第二部分的步骤。

    PAPER BASED ELECTRONICS PLATFORM
    28.
    发明申请
    PAPER BASED ELECTRONICS PLATFORM 审中-公开
    基于纸张的电子平台

    公开(公告)号：WO2017122178A1

    公开(公告)日：2017-07-20

    申请号：PCT/IB2017/050202

    申请日：2017-01-13

    Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： NASSAR, Joanna Mohammad ,  SEVILLA, Galo Andres Torres ,  HUSSAIN, Muhammad Mustafa

    IPC: A61B5/01 ,  B81C1/00 ,  G01P15/08

    CPC classification number: A61B5/01 ,  A61B2562/0219 ,  A61B2562/0247 ,  A61B2562/0257 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/029 ,  A61B2562/125 ,  B01L3/502707 ,  B01L2300/0663 ,  B01L2300/126 ,  B01L2400/0406 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81C1/00166 ,  G01D21/00 ,  G01L1/142 ,  G01N27/12 ,  G01N27/223 ,  H03K17/955 ,  H03K17/962 ,  H03K2217/960755

    Abstract: A flexible and non-functionalized low cost paper-based electronic system platform fabricated from common paper, such as paper based sensors, and methods of producing paper based sensors, and methods of sensing using the paper based sensors are provided. A method of producing a paper based sensor can include the steps of: a) providing a conventional paper product to serve as a substrate for the sensor or as an active material for the sensor or both, the paper product not further treated or functionalized; and b) applying a sensing element to the paper substrate, the sensing element selected from the group consisting of a conductive material, the conductive material providing contacts and interconnects, sensitive material film that exhibits sensitivity to pH levels, a compressible and/or porous material disposed between a pair of opposed conductive elements, or a combination of two of more said sensing elements. The method of sensing can further include measuring, using the sensing element, a change in resistance, a change in voltage, a change in current, a change in capacitance, or a combination of any two or more thereof.

    Abstract translation: 使用普通纸张（例如基于纸张的传感器）制造的灵活且非功能化的低成本纸基电子系统平台以及生产纸基传感器的方法以及使用纸基传感器进行感测的方法 被提供。 一种生产纸基传感器的方法可以包括以下步骤：a）提供常规纸产品作为传感器的基底或作为传感器的活性材料或两者，纸产品不被进一步处理或功能化; 和b）将感测元件施加到纸基体上，所述感测元件选自由导电材料，提供接触和互连的导电材料，表现出对pH水平敏感的敏感材料膜，可压缩和/或多孔材料 设置在一对相对的导电元件之间，或者两个或更多个所述感测元件的组合。 感测方法还可以包括使用感测元件测量电阻的变化，电压的变化，电流的变化，电容的变化或者其中任意两个或更多个的组合。

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