Abstract:
A portable energy collection and storage device includes an electrically and thermally insulating substrate. At least one energy collection device is integrated into the electrically and thermally insulating substrate. At least one energy storage device is integrated into the electrically and thermally insulating substrate and is electrically coupled to the at least one energy collection device. A set of electrical contacts is integrated into the electrically and thermally insulating substrate and electrically coupled to the at least one energy storage device. The electrically and thermally insulating substrate has a thickness less than or equal to 1 mm.
Abstract:
A capacitive sensor includes a sensor body having a cavity. The sensor body is non-electrically conductive. The sensor also includes a first diaphragm having a metallic conductor layer. The first diaphragm is arranged on the sensor body on a first side of the cavity. The sensor further includes a second diaphragm having a metallic conductor layer. The second diaphragm is arranged on the sensor body on a second side of the cavity. An air gap is formed in the cavity between the first and second diaphragms, the air gap having a height equal to a height of the sensor body.
Abstract:
A memory cell includes a substrate and a body including plural layers. The body has an inner body and an outer body, and the body is formed on top of the substrate. A nanotube trench is formed vertically in the body and extends to the substrate. A nanotube structure is formed in the nanotube trench. The nanotube trench divides the body into the inner body and the outer body and the nanotube structure is mechanically separated from the inner body and the outer body by a tunnel oxide layer, a charge trapping layer, and a blocking oxide layer.
Abstract:
A multi-sensor system (300) for monitoring water parameters, the system including a first metallic layer (324); a dielectric layer (326) formed on the first metallic layer (324); a second metallic layer (330) formed on the dielectric layer (326); a power source (314) electrically connected to the second metallic layer (330); a computing device (318) electrically connected to the second metallic layer (330); and a stretchable outer layer (310) that encapsulates the first metallic layer (324), the dielectric layer (326), the second metallic layer (330), the power source (314) and the computing device (318). The multi-sensor system is stretchable and flexible.
Abstract:
A three-dimensional structure may be obtained from a two-dimensional thin film by applying a stressor layer to the two-dimensional thin film and releasing the thin film from a support substrate. Such a three-dimensional structure may include a thermoelectric responsive material for forming a thermoelectric generator (TEG). A manufacturing process for the transformation from 2-D to 3-D may use a polymer stressor layer deposited on the thermoelectric responsive thin film. The combination thermoelectric responsive layer and stressor layer can be released from a carrier, after which the stressor layer causes the thermoelectric responsive layer to curl. The curl can cause the thermoelectric responsive layer to roll up during the release from the carrier to form a tubular structure.
Abstract:
High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.
Abstract:
A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.
Abstract:
A flexible and non-functionalized low cost paper-based electronic system platform fabricated from common paper, such as paper based sensors, and methods of producing paper based sensors, and methods of sensing using the paper based sensors are provided. A method of producing a paper based sensor can include the steps of: a) providing a conventional paper product to serve as a substrate for the sensor or as an active material for the sensor or both, the paper product not further treated or functionalized; and b) applying a sensing element to the paper substrate, the sensing element selected from the group consisting of a conductive material, the conductive material providing contacts and interconnects, sensitive material film that exhibits sensitivity to pH levels, a compressible and/or porous material disposed between a pair of opposed conductive elements, or a combination of two of more said sensing elements. The method of sensing can further include measuring, using the sensing element, a change in resistance, a change in voltage, a change in current, a change in capacitance, or a combination of any two or more thereof.