Abstract:
According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
Abstract:
A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; heating a reducing agent solution that includes a reducing agent, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N'-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100° C. to about 200° C. A surfactant system for the stabilizing copper nanoparticles includes an N,N'-dialkylethylenediamine and a C6-C18 alkylamine.
Abstract:
The present application relates to an article comprising a matrix material; and a plurality of copper nanoparticles in the matrix material that have been partially fused together; wherein the plurality of copper nanoparticles are less than about 20 nm in size, and the plurality of copper nanoparticles comprise a surfactant system comprising a bidentate diamine and one or more C6 - C18 alkylamines, wherein the article comprises about 10% to about 99.9% copper nanoparticles of the article by weight. The present application further relates to a method of joining two articles.
Abstract:
Un conjunto del dispositivo que comprende: un componente generador de calor electrónico (12) en comunicación térmica con un disipador de calor metálico (16) a través de una capa de interfaz térmica metálica (22), estando dispuesta la capa de interfaz térmica metálica (22) entre el componente electrónico generador de calor (12) y el disipador de calor metálico (16) y estado formada la capa de interfaz térmica metálica a partir de una composición que comprende una pluralidad de nanopartículas metálicas que se fusionan al menos parcialmente entre sí, caracterizado porque el disipador de calor metálico (16) comprende una capa superficial de óxido metálico pasivante (18) y la composición comprende adicionalmente un reactivo para el grabado capaz de grabar un óxido metálico.
Abstract:
Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200°C or lower.
Abstract:
Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.
Abstract:
Nanoparticle Composition And Methods Of Making The Same Abstract A method of fabricating copper nanoparticies includes heating a copper salt solution that includes a copper salt, an N.N'-diaikylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30°C to about 50°C; heating a reducing agent solution that includes a reducing agent, an N,N'-dialkyiethylenediamine, and a C6-C18 alkylamine in an organic solvent to temperature between a about 30°C to about 50°C; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticies. A composition includes copper nanoparticies, a C6-C18 alkylamine and an N.N'-diaikyiethylenediamine iigand. Such copper nanoparticies in this composition have a fusion temperature between about 100°C to about 200°C. A surfactant system for the stabilizing copper nanoparticies includes an N.N'-dialkylethylenediamine and a C6-C18 alkylamine. Fig. 1 -16-