公开(公告)号：DE112013006000T5

公开(公告)日：2015-08-27

申请号：DE112013006000

申请日：2013-12-09

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： GOLDA DARIUSZ ,  HIGGINSON JOHN A ,  BIBL ANDREAS

IPC: H01L21/677 ,  B65G47/90 ,  B65G49/07

Abstract: Es werden Systeme und Verfahren zum Übertragen einer Mikrovorrichtung von einem Trägersubstrat offenbart. In einer Ausführungsform weist eine Mikroaufnahmegruppierungshalterung eine Schwenkplattform auf, um einer Mikroaufnahmegruppierung eine automatische Ausrichtung mit einem Trägersubstrat zu ermöglichen. Ablenkung der Schwenkplattform kann erkannt werden, um weitere Bewegung der Mikroaufnahmegruppierung zu steuern.

公开(公告)号：IN3732CHN2014A

公开(公告)日：2015-07-03

申请号：IN3732CHN2014

申请日：2014-05-16

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG FAI STEPHEN ,  HU HSIN HUA

IPC: H01L21/58 ,  H01L21/677 ,  H05K13/04

Abstract: A micro device transfer head and head array are disclosed. In an embodiment the micro device transfer head includes a base substrate a mesa structure with sidewalls an electrode formed over the mesa structure and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

公开(公告)号：AU2015200891A1

公开(公告)日：2015-03-12

申请号：AU2015200891

申请日：2015-02-20

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L33/36

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：EP2780954A4

公开(公告)日：2015-07-22

申请号：EP12849508

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HU HSIN-HUA ,  BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN

IPC: H01L33/46 ,  H01L33/00 ,  H01L33/20 ,  H01L33/36 ,  H01L33/48

CPC classification number: H01L33/20 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/405 ,  H01L2224/7598 ,  H01L2224/83191 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

公开(公告)号：EP2780936A4

公开(公告)日：2015-07-29

申请号：EP12849914

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L21/677 ,  B32B38/18 ,  B65G47/91 ,  B65G49/07 ,  H01L21/67 ,  H01L23/00 ,  H05K13/02 ,  H05K13/04

CPC classification number: H01L29/167 ,  B32B38/18 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2933/0066 ,  Y10T156/1153 ,  Y10T156/17 ,  Y10T156/1705 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  Y10T156/1911 ,  H01L2224/83 ,  H01L2924/00