公开(公告)号：WO2015171267A2

公开(公告)日：2015-11-12

申请号：PCT/US2015025611

申请日：2015-04-13

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： PARKS PAUL ARGUS ,  LIGHT NILE ALEXANDER ,  BATHURST STEPHEN P ,  HIGGINSON JOHN A ,  BIBL ANDREAS

IPC: B25J7/00

CPC classification number: B25J7/00 ,  B25J9/0015 ,  B25J18/007 ,  Y10T74/20354

Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

Abstract translation: 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。

公开(公告)号：EP2780953A4

公开(公告)日：2015-07-22

申请号：EP12849007

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L33/36 ,  H01L25/075 ,  H01L33/00 ,  H01L33/20

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：MX336453B

公开(公告)日：2016-01-20

申请号：MX2014006031

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L33/36

Abstract: Se describe un método para fabricar y transferir un microdispositivo y un arreglo de microdispositivos a un sustrato receptor. En una modalidad, una capa eléctricamente aislante se utiliza como capa de detención de grabado durante el grabado al ácido de una capa de diodos p-n para formar una pluralidad de microdiodos p-n. En una modalidad, una capa de enlace intermedia eléctricamente conductora se utiliza durante la formación y transferencia de los microdispositivos al sustrato receptor.

公开(公告)号：IN3711CHN2014A

公开(公告)日：2015-10-09

申请号：IN3711CHN2014

申请日：2014-05-16

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HU HSIN HUA ,  BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG FAI STEPHEN

IPC: H01L33/46 ,  H01L33/36 ,  H01L33/48

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment an electrically insulating layer is utilized as an etch stop layer during etching of a p n diode layer to form a plurality of micro p n diodes. In an embodiment an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

公开(公告)号：DE112013004389T5

公开(公告)日：2015-06-03

申请号：DE112013004389

申请日：2013-08-27

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HIGGINSON JOHN A ,  BIBL ANDREAS ,  ALBERTALLI DAVID

IPC: H01L21/677 ,  B25J9/04 ,  B65G49/07 ,  H01L21/68

Abstract: Es werden Systeme und Verfahren zum Transfer einer Mikrovorrichtung von einem Trägersubstrat offenbart. In einer Ausführungsform enthält ein Massentransferinstrument eine Gelenk-Transferkopf-Einheit, einen Trägersubstrathalter und eine Stellgerät-Einheit, um ein räumliches Verhältnis zwischen einer Gelenk-Transferkopf-Einheit und dem Trägersubstrathalter anzupassen. Die Gelenk-Transferkopf-Einheit kann eine Verbindung zu einer elektrostatischen Spannungsquelle und ein Substrat, das ein Array von elektrostatischen Transferköpfen trägt, enthalten.

公开(公告)号：EP2847789A4

公开(公告)日：2016-01-20

申请号：EP13788027

申请日：2013-05-01

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  HU HSIN-HUA

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/50 ,  H01L21/60 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/075

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

Abstract translation: 公开了一种兼容的微器件传送头和头阵列。 在一个实施例中，微器件转移头包括可偏转到基底基板和弹簧部分之间的空间中的弹簧部分。

公开(公告)号：MX2014006032A

公开(公告)日：2015-01-16

申请号：MX2014006032

申请日：2012-11-07

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L21/58 ,  H01L21/677 ,  H05K13/04

Abstract: Se describen un cabezal de transferencia del microdispositivo y un arreglo de cabezales. En una modalidad, el cabezal de transferencia del microdispositivo incluye un sustrato base, una estructura de mesa con paredes laterales, un electrodo formado sobre la estructura de mesa y una capa dieléctrica que cubre el electrodo. Se puede aplicar un voltaje al cabezal de transferencia del microdispositivo y al arreglo de cabezales para recoger un microdispositivo de un sustrato portador y liberar el microdispositivo sobre un sustrato receptor.

公开(公告)号：AU2012339941A1

公开(公告)日：2014-06-05

申请号：AU2012339941

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L21/677 ,  B65G47/91 ,  B65G49/07 ,  H05K13/02 ,  H05K13/04

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：AU2012339925A1

公开(公告)日：2014-06-05

申请号：AU2012339925

申请日：2012-11-07

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L21/58 ,  H01L21/677 ,  H05K13/04

Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

公开(公告)号：IN3734CHN2014A

公开(公告)日：2015-09-04

申请号：IN3734CHN2014

申请日：2014-05-16

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG FAI STEPHEN ,  HU HSIN HUA

IPC: H01L21/58 ,  H01L21/677 ,  H05K13/04

Abstract: A micro device transfer head and head array are disclosed. In an embodiment the micro device transfer head includes a base substrate a mesa structure with sidewalls an electrode formed over the mesa structure and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.