公开(公告)号：EP2001603A4

公开(公告)日：2011-11-16

申请号：EP07751838

申请日：2007-02-27

Applicant: MACDERMID INC

Inventor： SAWOSKA DAVID ,  KROL ANDREW M ,  CASTALDI STEVEN A

IPC: B05D7/14 ,  B41M5/00 ,  H05K3/06

CPC classification number: H05K3/061 ,  B41M5/0047 ,  B41M5/0058 ,  C23F1/18 ,  H05K3/383 ,  H05K2203/013 ,  H05K2203/1173

公开(公告)号：EP1613440A4

公开(公告)日：2006-11-02

申请号：EP04720786

申请日：2004-03-15

Applicant: MACDERMID INC

Inventor： REDLINE RONALD ,  ANGELONE DAVID ,  CASTALDI STEVEN A ,  TOSCANO LENORA

IPC: B05D1/18 ,  B05D1/36 ,  B05D3/02 ,  B05D3/10 ,  B05D7/14 ,  C23C18/42 ,  C23C22/00 ,  H05K3/24 ,  H05K3/28

CPC classification number: C23C18/42 ,  B05D1/18 ,  B05D3/0254 ,  B05D7/14 ,  B05D2202/40 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/0769

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.

Abstract translation: 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸渍或无电镀银板，之后用含有乙烯基聚合物的水性丙烯酸聚合物的碱性聚合物涂层处理浸渍银板， 抗真菌剂和苯并三唑或苯并咪唑化合物，以产生耐电迁移的沉积物，并且在表面上提供抗晦暗和防腐蚀涂层。

公开(公告)号：EP0233201A4

公开(公告)日：1987-11-30

申请号：EP86904002

申请日：1986-06-09

Applicant: MACDERMID INC

Inventor： LARSON GARY B ,  RUSZCZYK STANLEY J ,  CASTALDI STEVEN A

IPC: H05K3/06 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/243 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/427 ,  H05K2201/09736 ,  H05K2203/043

Abstract: Printed circuit boards having solder coated pads and through-holes (140) and bare copper traces (160) protected by a directly applied solder mask (260) or by a coating of non-reflowable metal and a solder mask thereover, are manufactured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists (240) are applied to circuit boards having tin-lead (220) over copper plated holes (140) and pads so as to define and etch-protect bare copper traces (160) of desired pattern circuitry (as well as other desired configurations). Copper areas other than those protected by the etch-resist (240) and tin-lead plating (220) are etched away, the etch-resist (240) removed and solder mask (260) applied over the bare copper traces (160) or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating (220) is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.

Abstract translation: 具有焊料涂覆的焊盘和通孔（140）和由直接施加的焊接掩模（260）保护的裸露铜迹线（160）的印刷电路板或通过不可回流的金属和其上的焊料掩模的涂层通过 该方法避免了锡铅剥离的需要以及熔融焊料的分开施加和调平的需要。 在优选的工艺中，将液体抗蚀剂（240）施加到具有在镀铜孔（140）和焊盘上的锡铅（220）的电路板上，以限定和蚀刻所需图案电路的裸铜迹线（160） 以及其他所需的配置）。 除了由蚀刻抗蚀剂240和锡铅引线220保护的区域以外的铜区域被蚀刻掉，蚀刻抗蚀剂240被去除并且阻焊层260施加在裸铜迹线160上或 其他期望的裸露铜区域，或者可选地，首先涂覆不可回流的金属的裸铜。 锡铅镀层（220）然后优选地回流并固化以提供具有焊料涂层的焊盘和通孔。