PROCESS FOR CREATING A PATTERN ON A COPPER SURFACE
    2.
    发明申请
    PROCESS FOR CREATING A PATTERN ON A COPPER SURFACE 审中-公开
    在铜表面上形成图案的方法

    公开(公告)号:WO2007126516A3

    公开(公告)日:2008-01-10

    申请号:PCT/US2007005105

    申请日:2007-02-27

    Applicant: MACDERMID INC

    Abstract: A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.

    Abstract translation: 描述了使用液滴喷射印刷机构将印刷油墨或有机抗蚀剂印刷到铜或铜合金表面上的分辨率提高的方法。 通过首先优选对表面进行微蚀刻,然后用能够降低铜表面的能量或能够使铜表面在其上印刷之前更具疏水性的有机物质来处理铜表面来实现增加的分辨率。 该方法在电子电路的制造中是有用的。

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