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    23.
    发明专利
    未知

    公开(公告)号：DE69329249D1

    公开(公告)日：2000-09-21

    申请号：DE69329249

    申请日：1993-11-15

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    24.
    发明专利
    未知

    公开(公告)号：DE69125233T2

    公开(公告)日：1997-08-14

    申请号：DE69125233

    申请日：1991-07-17

    Applicant: MACDERMID INC

    Inventor： BENGSTON JON E ,  LARSON GARY B

    IPC: H05K1/09 ,  H05K3/24 ,  H05K3/34

    Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.

    25.
    发明专利
    未知

    公开(公告)号：DE69125233D1

    公开(公告)日：1997-04-24

    申请号：DE69125233

    申请日：1991-07-17

    Applicant: MACDERMID INC

    Inventor： BENGSTON JON E ,  LARSON GARY B

    IPC: H05K1/09 ,  H05K3/24 ,  H05K3/34

    Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.

    28.
    发明专利
    未知

    公开(公告)号：FI953377A0

    公开(公告)日：1995-07-10

    申请号：FI953377

    申请日：1995-07-10

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: C23C22/07 ,  G03F7/09 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23C

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

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