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    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS
    1.
    发明专利
    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：AU8102887A

    公开(公告)日：1988-06-01

    申请号：AU8102887

    申请日：1987-09-10

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  CASTALDI STEVEN A ,  GALLEGOS DANIEL ,  LARSON GARY B ,  FERRIER DONALD R

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    Abstract: Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper such that the unreduced cuprous oxide in resin serves as a dielectric layer. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

    MELAMINE-FORMALDEHYDE POST-DIP COMPOSITION FOR IMPROVING ADHESION OF METAL TO POLYMER
    2.
    发明申请
    MELAMINE-FORMALDEHYDE POST-DIP COMPOSITION FOR IMPROVING ADHESION OF METAL TO POLYMER 审中-公开
    用于改善金属与聚合物粘合的三聚氰胺 - 甲醛后加料组合物

    公开(公告)号：WO2006038951A3

    公开(公告)日：2006-08-31

    申请号：PCT/US2005025259

    申请日：2005-07-18

    Applicant: MACDERMID INC

    Inventor： FERRIER DONALD R

    IPC: C23C28/00 ,  C09J5/00

    CPC classification number: C23F1/18 ,  C08G12/32 ,  C08G12/427 ,  C09D5/12 ,  C23C22/52 ,  C23C22/83 ,  H05K3/383 ,  H05K2203/122

    Abstract: The present invention is directed to a process for increasing the adhesion of a polymeric material to a metal surface, especially during the manufacture of printed circuit boards. The metal surface is contacted with an adhesion promoting composition to form a micro-roughened surface and is then contacted with an aqueous amine-formaldehyde post-dip polymer composition. The amine is preferably melamine. Thereafter polymeric material may be bonded to the treated metal surface. The amine formaldehyde polymer post-dip composition comprises an acid, a pH adjuster, and an effective amount of an amine-formaldehyde reaction product polymer. The amine-formaldehyde reaction product polymer is formed by dissolving amine in an aqueous formaldehyde solution, adding an additive selected from the group consisting of triethanolamine, ethylene glycol, and methanol, adding an acid selected from the group consisting of acetic acid and sulfuric acid, diluting the solution with water, and adjusting the pH of the solution with a pH adjuster.

    Abstract translation: 本发明涉及一种提高聚合物材料对金属表面的粘附性的方法，特别是在制造印刷电路板期间。 金属表面与粘合促进组合物接触以形成微粗糙表面，然后与含水胺 - 甲醛后浸渍聚合物组合物接触。 该胺优选是三聚氰胺。 此后，聚合物材料可以结合到处理的金属表面。 胺甲醛聚合物浸渍后组合物包含酸，pH调节剂和有效量的胺 - 甲醛反应产物聚合物。 胺 - 甲醛反应产物聚合物通过将胺溶解在甲醛水溶液中，加入选自三乙醇胺，乙二醇和甲醇的添加剂，加入选自乙酸和硫酸的酸， 用水稀释溶液，并用pH调节剂调节溶液的pH值。

    ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT
    6.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT 未知

    公开(公告)号：CA1130952A

    公开(公告)日：1982-09-07

    申请号：CA325487

    申请日：1979-04-12

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

    IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a suitably catalysed and generally non-conductive workpiece surface using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with solution. The reducing agent is a soluble source of hypophosphite ions and the complexing agent is selected to be effective at pH level between 5 and 13 for complexing cupric ions and the solution pH is coordinated within the pH range for the complexer selected to give a deposited conductive copper film.

    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS
    10.
    发明专利
    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：CA1262577A

    公开(公告)日：1989-10-31

    申请号：CA547294

    申请日：1987-09-18

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  LARSON GARY B ,  FERRIER DONALD R ,  GALLEGOS DANIEL ,  CASTALDI STEVEN A

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    Abstract: PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

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