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    CARBON-FIBER-REINFORCED POLYIMIDE RESIN COMPOSITIONS
    21.
    发明专利
    CARBON-FIBER-REINFORCED POLYIMIDE RESIN COMPOSITIONS 未知

    公开(公告)号：CA2010411C

    公开(公告)日：1995-04-11

    申请号：CA2010411

    申请日：1990-02-20

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TSUTSUMI TOSHIHIKO ,  NAKAKURA TOSHIYUKI ,  MORIKAWA SHUICHI ,  KOGA NOBUHITO

    IPC: C08J5/06 ,  C08L79/08 ,  C08L81/06

    Abstract: Provided are carbon-fiber-reinforced polyimide resin compositions having excellent mechanical strength. The compositions are formed of (a) 5-50 parts by weight of carbon fibers, which have been obtained by coating starting carbon fibers at surfaces thereof with an aromatic polysulfone resin and then heating the thus-coated carbon fibers at 300-400.degree.C, and (b) 95-50 parts by weight of a polyimide resin which preferably have recurring units of following formula: or wherein X represents a specific divalent radical and R represents a particular tetra-valent radical.

    22.
    发明专利
    未知

    公开(公告)号：DE3788937D1

    公开(公告)日：1994-03-10

    申请号：DE3788937

    申请日：1987-11-12

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  KOGA NOBUHITO ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10

    Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid. e

    23.
    发明专利
    未知

    公开(公告)号：DE3784842D1

    公开(公告)日：1993-04-22

    申请号：DE3784842

    申请日：1987-04-08

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  KOGA NOBUHITO ,  BABA KENICHI

    IPC: C08K7/02 ,  C08L79/08 ,  H01B3/30

    Abstract: New polyimide resin compsn. is composed of 100 pts. by wt. of a polyimide having repeat units represented by general formula (I) and 5 to 100 pts. by wt. of fibrous reinforcing material, where Y represents a direct bond, a divalent 1-10C hydrocarbyl gp., a hexafluoroisopropylidene gp., a carbonyl gp., or a oxido gp. R represents a tetravalent 2 or more C aliphatic gp., an alicyclic gp., a monocyclic aromatic gp., a fused polycyclic aromatic gp., or a non-fused cyclic aromatic gp. in which aromatic gps. are linked direct to each other or via a linking member. The polyimide can have an isopropylidene gp. for Y in general formula (1), it can have a direct bond for Y and (II) for R, it can have an isopropylidene gp. for Y and (III) for R, etc. The fibrous reinforcing material can be glass fibres, carbon fibres, potassium titanate fibres or aromatic polyamide fibres.

    24.
    发明专利
    未知

    公开(公告)号：DE3772280D1

    公开(公告)日：1991-09-26

    申请号：DE3772280

    申请日：1987-06-26

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  BABA KENICHI ,  KOGA NOBUHITO

    IPC: C08L27/12 ,  C08L79/08 ,  C08L87/00 ,  C08L27/18 ,  C08L27/16 ,  C08L27/20 ,  C08G73/10

    Abstract: This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula : (where Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetra-valent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc. Polyimide of this invention can be prepared from aromatic diamines and tetracarboxylic acid dianhydrides. Suitable aromatic diamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl] sulfide etc. Suitable tetracarboxylic acid dianhydrides are pyromellitic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride. Representative fluororesin which can be used in this invention is polytetrafluoroethylene.

    THERMOSETTING RESIN COMPOSITION
    25.
    发明专利
    THERMOSETTING RESIN COMPOSITION 未知

    公开(公告)号：CA1270998A

    公开(公告)日：1990-06-26

    申请号：CA541494

    申请日：1987-07-07

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  KOGA NOBUHITO ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/12

    Abstract: Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis¢4(3-maleimidephenoxy)phenyl!propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and hightemperature stability.

    POLYIMIDE
    26.
    发明专利
    POLYIMIDE 未知

    公开(公告)号：AU579777B2

    公开(公告)日：1988-12-08

    申请号：AU8124287

    申请日：1987-11-16

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  IIYAMA KATSUAKI ,  KOGA NOBUHITO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10 ,  C09J3/14

    Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid. e

    POLYIMIDE
    27.
    发明专利
    POLYIMIDE 未知

    公开(公告)号：AU8124287A

    公开(公告)日：1988-05-26

    申请号：AU8124287

    申请日：1987-11-16

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  IIYAMA KATSUAKI ,  KOGA NOBUHITO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10 ,  C09J3/14

    Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid. e

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