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    POLYIMIDE RESIN MOLDING MATERIAL
    22.
    发明专利
    POLYIMIDE RESIN MOLDING MATERIAL 失效

    公开(公告)号：JPH01146954A

    公开(公告)日：1989-06-08

    申请号：JP30330587

    申请日：1987-12-02

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TSUTSUMI TOSHIHIKO ,  GOTO YOSHIHISA ,  MORIKAWA SHUICHI ,  KOGA NOBUSHI

    IPC: C08L79/08 ,  C08K5/09 ,  C08K5/20

    Abstract: PURPOSE:To make it possible to form a polyimide resin molding material giving a molding excellent in appearance, mechanical properties, thermal properties, mold release and moldability, by mixing a specified polyimide resin with a metallic soap, a fatty acid amide or a fatty acid bisamide. CONSTITUTION:This polyimide resin molding material is formed by melt- kneading 100 pts.wt. polyimide resin having repeating units of formula I with 0.02-5 pts.wt. at least one member selected from the group consisting of a metallic soap, a fatty acid amide and a fatty bisamide. In formula I, X is a direct bond, a 1-10C bivalent hydrocarbon group, a hexafluorinated isopropylidene group, a carbonyl group or the like, Y1-Y4 are each a hydrogen atom, a lower alkyl group or the like, R is a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group or the like. As said metallic soap, a magnesium, aluminum, calcium, lithium, zinc or barium salt of a 10-30C fatty acid or a mixture of at least two of them is desirable. As said fatty acid amide or said fatty acid bisamide, one having 10-30 carbon atoms is desirable.

    THERMAL TREATMENT OF POLYIMIDE MOLDED PRODUCT
    23.
    发明专利
    THERMAL TREATMENT OF POLYIMIDE MOLDED PRODUCT 失效

    公开(公告)号：JPH01110538A

    公开(公告)日：1989-04-27

    申请号：JP26820687

    申请日：1987-10-26

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： NAGAHIRO TAIZO ,  MORIKAWA SHUICHI ,  KOGA NOBUSHI

    IPC: C08J7/00 ,  C08G73/10

    Abstract: PURPOSE:To contrive the improvement of the flexural strength, flexural modulus of elasticity, thermal deformation temperature, abrasion resistance, etc., of the molded product of a polyimide having a specific structure, by heat-treating the polyimide molded product under a specified condition. CONSTITUTION:A polyimide molded product suitable for driving parts, etc., is produced by treating the molded product of a polyimide having repeating units of the formula [e.g. a molded product produced by molding a polyimide raw material obtained by subjecting 4,4'-bis(3-aminophenoxy)biphenyl and anhydrous pyromellitic dianhydride to an imidation reaction] at 250-340 deg.C, preferably 270-330 deg.C for a time when the density of the product increases by 1.5%, preferably 2%, preferably 2min-12hr.

    POLYIMIDE
    24.
    发明专利
    POLYIMIDE 失效

    公开(公告)号：JPS63128025A

    公开(公告)日：1988-05-31

    申请号：JP27420686

    申请日：1986-11-19

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  IIYAMA KATSUAKI ,  KOGA NOBUSHI ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  OTA MASAHIRO ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10

    Abstract: PURPOSE:To obtain a polyimide, having excellent heat resistance and molding processability as well as high total light transmittance and suitable as electric and electronic equipment, aerospace materials, heat-resistant adhesives, etc., by reacting a specific tetracarboxylic acid dianhydride with an ether diamine. CONSTITUTION:A polyimide, obtained by dissolving (A) 4,4'-(p-phenylenedioxy) diphthalic acid dianhydride with (B) an ether diamine expressed by formula I (X is 1-10C chain hydrocarbon, carbonyl, etc.), e.g. bis[4-(3-aminophenoxy) phenyl]methane, etc., in an organic solvent, e.g. DMF, etc., and reacting both, e.g. at

    THERMOSETTING RESIN COMPOSITION
    25.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPS6354435A

    公开(公告)日：1988-03-08

    申请号：JP16466886

    申请日：1986-07-15

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  OOTA MASAHIRO ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/12

    Abstract: PURPOSE:To form a thermosetting resin composition which retains inherent heat resistance and has toughness excellent in impact resistance and flexibility, by mixing a specified bismaleimide compound with a diamine compound. CONSTITUTION:This thermosetting resin composition comprises a bismaleimide compound [A] of formula I (wherein R is a bivalent group of formula II or III, X is a direct bond or a group selected from among a 1-10C bivalent hydrocarbon, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl or oxide group and a diamine compound [B] of formula IV (wherein R is as defined in formula I). The mixing ratio of A to B is preferably 1:0.1-1:1.2 (by mole).

    THERMOSETTING RESIN COMPOSITION
    26.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPS6348335A

    公开(公告)日：1988-03-01

    申请号：JP19056486

    申请日：1986-08-15

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  OOTA MASAHIRO ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/12

    Abstract: PURPOSE:To obtain a thermosetting resin composition excellent in heat resistance, impact resistance and flexibility and suitable for use in electronic components, etc., by reacting a specified bismaleimide compound with 4,4'- diaminodiphenylmethane. CONSTITUTION:A bismaleimide compound (A) of formula I (wherein R is a group of formula II or III, X is a direct bond, a 1-10C bivalent hydrocarbon, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl or oxide group), e.g., N,N'-1,3-bis(3-amino-phenoxy)benzenebismaleimide, is mixed with 4,4- diaminodiphenylmethane in a molar ratio of 10:1-1:1.2, and the mixture is reacted by heating to obtain the title thermosetting resin composition. Component A can be easily produced by condensing a diamine compound of formula IV with maleic anhydride.

    CURABLE RESIN COMPOSITION
    28.
    发明专利
    CURABLE RESIN COMPOSITION 失效

    公开(公告)号：JPS5670012A

    公开(公告)日：1981-06-11

    申请号：JP14605179

    申请日：1979-11-13

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TSUBOI HIKOTADA ,  KAWAMATA MOTOO ,  OOBA MASAYUKI ,  KOGA NOBUSHI

    IPC: C08F20/00 ,  C08F20/52 ,  C08F279/00 ,  C08F279/02 ,  C08K5/34 ,  C08L7/00 ,  C08L9/00 ,  C08L21/00 ,  C09J4/02

    Abstract: PURPOSE:To prepare the titled resin composition having excellent heat resistance, electrical properties, and adhesivity, soluble in general-purpose solvents, compoundable easily to prepare a prepreg, and suitable for a raw material of a copper- clad laminate board, by mixing an N-(alkenylphenyl)maleimide derivative and polybutadienes. CONSTITUTION:(A) A compound selected from an N-(alkenylphenyl)maleimide derivative of formula [R1-R6 are H, halogen, 1-10C alkyl, or (substituted) phenyl; X is H, halogen, carboxyl, alkoxy, cyano, etc.; m1+m2+m3=5] and its polymer is mixed with (B) polybutadienes having double bonds, pref. at a weight ratio of 95/5-5/95. If necessary, the reaction product of the component (A) with a primary amine compound is used together with or as a substitute for the component (A).

    PREPARATION OF BISIMIDE AND POLYIMIDE
    29.
    发明专利
    PREPARATION OF BISIMIDE AND POLYIMIDE 失效

    公开(公告)号：JPS5528937A

    公开(公告)日：1980-02-29

    申请号：JP10188978

    申请日：1978-08-23

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOBA MASAYUKI ,  KAWAMATA MOTOO ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C07D209/48 ,  C07D207/452

    Abstract: PURPOSE:To obtain the title compound useful as a raw material for high-quality thermosetting resins usable for varnishes, powder coatings, laminates, and molded articles, in high yield and purity, by reacting a bis- or poly-maleimide with a diene compound. CONSTITUTION:A bismaleimide, e.g. N,N'-(4,4'-diphenylmethane)bismaleimide, of formula I: {Z is formula II [D is CH2, SO2, O, C(CH3)2, or S;R1 is H or 1-4C alkyl group], or formula III (R2 is H or CH3)} or a poly(phenylmethylene) polymaleimide of formula IV: [l, m, and n are integers >=0; the average value of (l+m+n) is 0.1-5] is reacted with a diene compound, e.g. isoprene, in the presence of an organic solvent, preferably at 0-150 deg.C, to give a bis- or polyimide. The compound of formula I or II can be obtained by cyclization of the corresponding amine with maleic anhydride through dehydration.

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