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公开(公告)号：US20150249042A1
公开(公告)日：2015-09-03
申请号：US14193437
申请日：2014-02-28
Applicant: Raytheon Company
Inventor： Roland Gooch , Adam M. Kennedy , Stephen H. Black , Thomas Allan Kocian , Buu Diep
CPC classification number: C23C14/28 , B32B3/10 , B32B15/04 , B32B2255/205 , B32B2457/00 , C23C14/06 , G01J5/045 , H01L23/26 , H01L2924/0002 , Y10T428/24802 , H01L2924/00
Abstract: A getter structure and method wherein a layer of seed material is deposited on a predetermined region of a surface of a structure under conditions to form a plurality of nucleation sites on a surface of the structure. The nucleation sites have an average height over the surface area of the predetermined region of less than one molecule thick. Subsequently a getter material is deposited over the surface to form a plurality of getter material members projecting outwardly from the nucleation sites.
Abstract translation: 一种吸气剂结构和方法，其中在结构的表面上形成多个成核位置的条件下，将种子材料层沉积在结构的表面的预定区域上。 成核位置具有小于一分子厚的预定区域的表面积的平均高度。 随后，吸气剂材料沉积在表面上以形成从成核位置向外突出的多个吸气材料构件。
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22.发明申请WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER 有权WAVER LEVEL PACKAGE SOLDER BARRIER用作真空灭火器公开(公告)号：US20150014854A1
公开(公告)日：2015-01-15
申请号：US13939400
申请日：2013-07-11
Applicant: Raytheon Company
Inventor： Roland W. Gooch , Buu Q. Diep , Adam M. Kennedy , Stephen H. Black , Thomas Allan Kocian
IPC: H01L23/498 , H01L21/768
CPC classification number: H01L23/10 , B81B7/0038 , B81B2201/0207 , B81C1/00269 , B81C2203/035 , H01L21/52 , H01L21/76841 , H01L23/26 , H01L23/49866 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14683 , H01L27/1469 , H01L2224/16 , H01L2924/0002 , H01L2924/00
Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.
Abstract translation: 电子装置及其制造方法。 一种或多种方法可以包括提供具有空腔和围绕空腔的表面的盖晶片和具有检测器装置和参考装置的装置晶片。 在某些实例中，可以将钛材料的阻焊层沉积到盖晶片的表面上。 可以进一步激活钛材料的阻焊层作为吸气剂。 在各种示例中，盖晶片和器件晶片可以使用焊料接合在一起，并且钛材料的阻焊层可以防止焊料接触盖晶片的表面。
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公开(公告)号：US20250151444A1
公开(公告)日：2025-05-08
申请号：US19015141
申请日：2025-01-09
Applicant: Raytheon Company
Inventor： David J. Gulbransen , Sean P. Kilcoyne , Eric R. Miller , Matthew D. Chambers , Eric J. Beuville , Andrew E. Gin , Adam M. Kennedy
Abstract: A focal plane array includes a mosaic integrated circuit device having a plurality of discrete integrated circuit tiles mounted on a motherboard. The focal plane array includes an optically continuous detector array electrically connected to the mosaic integrated circuit device with an interposer disposed therebetween. The interposer is configured to adjust a pitch of the continuous detector array to match a pitch of each of the plurality of discrete integrated circuit tiles so that the optical gaps between each of the plurality of integrated circuit tiles on the motherboard are minimized and the detector array is optically continuous, having high yield over the large format focal plane array.
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公开(公告)号：US11750945B2
公开(公告)日：2023-09-05
申请号：US16749004
申请日：2020-01-22
Applicant: RAYTHEON COMPANY
Inventor： Adam M. Kennedy , Michael J. Batinica , Scott M. Taylor , Sean P. Kilcoyne , Paul Bryant
IPC: G01J1/44 , H04N25/702 , H04N25/75
CPC classification number: H04N25/702 , G01J1/44 , H04N25/75
Abstract: An imaging and asynchronous laser pulse detector (ALPD) device, imaging cell of the imaging and ALPD device and method of use is disclosed. A detector generates an electrical signal in response to receiving an optical signal, wherein a frequency of the electrical signal is indicative of a frequency of the optical signal. A first detection/readout circuit is sensitive to a first frequency range, and a second detection/readout circuit is sensitive to a second frequency range. The first detection/readout circuit allows the electrical signal to pass from the first detection/readout circuit to the second detection/readout circuit.
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公开(公告)号：US20210227158A1
公开(公告)日：2021-07-22
申请号：US16749004
申请日：2020-01-22
Applicant: RAYTHEON COMPANY
Inventor： Adam M. Kennedy , Michael J. Batinica , Scott M. Taylor , Sean P. Kilcoyne , Paul Bryant
Abstract: An imaging and asynchronous laser pulse detector (ALPD) device, imaging cell of the imaging and ALPD device and method of use is disclosed. A detector generates an electrical signal in response to receiving an optical signal, wherein a frequency of the electrical signal is indicative of a frequency of the optical signal. A first detection/readout circuit is sensitive to a first frequency range, and a second detection/readout circuit is sensitive to a second frequency range. The first detection/readout circuit allows the electrical signal to pass from the first detection/readout circuit to the second detection/readout circuit.
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Patent Agency Ranking
公开(公告)号：US10267997B2
公开(公告)日：2019-04-23
申请号：US14938361
申请日：2015-11-11
Applicant: RAYTHEON COMPANY
Abstract: A scene projector including an array of light emitting pixels, a tunable filter element, and a spatial light modulator. The tunable filter element is optically coupled to the array of light emitting pixels such that light emitted from the array of light emitting pixels is passed through the tunable filter element as filtered light. The spatial light modulator is optically coupled to the array of light emitting pixels and is configured to generate transmitted light by interacting with the filtered light to control at least one of an amplitude, a phase, and a polarization of the filtered light.
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公开(公告)号：US09969610B2
公开(公告)日：2018-05-15
申请号：US15416206
申请日：2017-01-26
Applicant: Raytheon Company
Inventor： Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
IPC: H01L31/0203 , B81B7/00 , B81C1/00
CPC classification number: B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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公开(公告)号：US09771258B2
公开(公告)日：2017-09-26
申请号：US14748482
申请日：2015-06-24
Applicant: Raytheon Company
Inventor： Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
IPC: H01L23/498 , B81C1/00 , B81B7/00
CPC classification number: B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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29.发明授权Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays 有权用于晶圆级封装的红外焦平面阵列的抗反射涂层盖晶片中的应力消除方法公开(公告)号：US09427776B2
公开(公告)日：2016-08-30
申请号：US13688714
申请日：2012-11-29
Applicant: Raytheon Company
Inventor： Roland W. Gooch , Buu Q. Diep , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy
CPC classification number: B81C1/00325 , B05D5/061 , B81B7/0067 , B81B2201/0207 , B81C2203/0118
Abstract: Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
Abstract translation: 提供了通过盖晶片的抗反射涂层引起的减少晶片弓的方法。 该方法可以利用其中具有至少一个开口的荫罩，其位于帽晶片中的相对凹陷区域。 该方法还可以包括将至少一层抗反射涂层材料通过荫罩沉积到盖晶片的平面侧上，以在平面侧上提供不连续的涂层。
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30.发明申请WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING 有权WAFER LEVEL包装红外（IR）FOCAL PLANE ARRAY（FPA）与EVANESCENT WAVE COUPLING公开(公告)号：US20150321905A1
公开(公告)日：2015-11-12
申请号：US14270945
申请日：2014-05-06
Applicant: Raytheon Company
Inventor： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy , Buu Q. Diep
CPC classification number: B81B7/0067 , B81B7/0035 , B81B2201/0207 , B81C1/00317 , G01J5/045 , G01J5/08 , G01J5/20 , H01L37/00
Abstract: A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when. the cover wafer is bonded to the device wafer.
Abstract translation: 一种用于检测具有预定波长的电磁辐射的结构。 该结构包括具有传感元件的器件晶片，其响应于电磁辐射而设置在器件晶片的表面的预定区域上。 提供了覆盖晶片，其具有对电磁辐射透明的区域，以将电磁辐射穿过透明区域传递到感测元件的表面上。 提供了一种键间隔结构，用于当从盖玻片的透明区域的相对表面以小于预定波长的一小部分的距离来支撑感测元件的表面时。 盖晶片被结合到器件晶片。
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