公开(公告)号：DE10196145T1

公开(公告)日：2003-04-17

申请号：DE10196145

申请日：2001-05-01

Applicant: ROSEMOUNT INC

Inventor： NORD CHRISTINA A ,  HORKY DAVID A ,  GUTTSEN KENNETH G ,  JOHNSON THOMAS E ,  SHERIN MATTHEW G ,  SZAFRANSKI KEVIN P ,  BALLOT WILLIAM J ,  PATRICK RENAE M ,  HARASYN DONALD E ,  EIDENSCHINK RYAN R ,  SCHANSBERG TODD W ,  ROMO MARK G ,  BEHM STEVEN M ,  LOUWAGIE BENNETT L ,  HEDTKE ROBERT C ,  RUD JUN STANLEY E ,  BREKKEN JEFFREY C

IPC: G01L19/06 ,  G01L19/00 ,  G01L9/00

Abstract: A pressure transmitter with a fluid isolator that includes a sensor tube and a fill tube that have "D" shaped ends that connect together in a port internal to the transmitter. The shaped ends can be brazed into the port for sealing. Fitting both the sensor tube and the fill tube in the same port provides a low cost isolator with reduced isolator liquid volume. The fluid isolator has an isolator diaphragm with a central diaphragm region overlying a central backing plate that includes a annular groove. The annular groove avoids slow response of the isolator after an overpressure condition.

公开(公告)号：AU2629901A

公开(公告)日：2001-07-16

申请号：AU2629901

申请日：2001-01-05

Applicant: ROSEMOUNT INC

Inventor： ROMO MARK G ,  RUD STANLEY E JR ,  LUTZ MARK A ,  SITTLER FRED C ,  TOY ADRIAN C

IPC: G01L9/12 ,  B81B3/00 ,  B81B7/00 ,  B81C99/00 ,  G01L9/00 ,  H01L29/84

Abstract: A sensor has an electrical interconnect grown in a cavity between first and second layers that are bonded together. Electrically conductive grain growth material is selectively deposited on at least one of two electrically conductive film interconnect regions that face one another across the cavity. The grain growth material is then grown upon predetermined conditions to form the electrical interconnect between the two interconnect regions. A sensor element deposited in the cavity is electrically coupled between the layers by the interconnect. The grain growth material can be tantalum that is heated after the layers are bonded to grow grains that interconnect the electrically conductive films.

公开(公告)号：SG43804A1

公开(公告)日：1997-11-14

申请号：SG1996001034

申请日：1995-02-22

Applicant: ROSEMOUNT INC

Inventor： ROMO MARK G

IPC: G01L9/04 ,  G01L9/00

Abstract: A micromachined device is described receiving a pressurizable fluid has a plurality of layers bonded together along at least one bond interface, the bond interface having a terminus bordering the pressurizable fluid. In a vicinity of at least one bond interface at least one layer has a shape that reduces a stress magnitude near the bond terminus. In a preferred embodiment a width of at least one layer increases toward the bond interface, to increase the pressure at which the device can operate without fracturing. In another embodiment, both layers bordering the bond interface have widths in the vicinity of the bond interface that increase toward the bond interface. Alternately, the layers have walls shaped such that, for a reference line perpendicular to the bond interface and passing through an end of the bond interface bordering the cavity, the cavity protrudes between the reference line and at least one of the walls.

公开(公告)号：CA2184161A1

公开(公告)日：1995-10-05

申请号：CA2184161

申请日：1995-02-22

Applicant: ROSEMOUNT INC

Inventor： ROMO MARK G

IPC: G01L9/04 ,  G01L9/00 ,  G01L13/00 ,  G01L13/06

Abstract: A micromachined device (32) receiving a pressurizable fluid has a plurality of layers (34, 36) bonded together along at least one bond interface (35), the bond interface having a terminus bordering the pressurizable fluid. In a vicinity of at least one bond interface (35) at least one layer (34, 36) has a shape that reduces a stress magnitude near the bond terminus. In a preferred embodiment a width of at least one layer (34) increases toward the bond interface (35), to increase the pressure at which the device call operate without fracturing. In another embodiment, both layers (34, 36) bordering the bond interface (35) have widths in the vicinity of the bond interface (35) that increase toward the bond interface (35). Alternately, the layers (34, 36) have walls shaped such that, for a reference line perpendicular to the bond interface (35) and passing through an end of the bond interface (35) bordering the cavity, the cavity protrudes between the reference line and at least one of the walls.

公开(公告)号：EP1698081A4

公开(公告)日：2015-09-09

申请号：EP04811293

申请日：2004-11-12

Applicant: ROSEMOUNT INC

Inventor： KARSCHNIA ROBERT J ,  PELUSO MARCOS ,  ROMO MARK G

IPC: H04B1/38 ,  G05B19/418 ,  H04B1/16 ,  H04W88/02

CPC classification number: H04W88/02 ,  G05B19/41855 ,  G05B2219/31251 ,  H02J5/005 ,  H02J7/025 ,  H02J13/0079 ,  Y02P90/185

Abstract: A process control system utilizes wireless transceivers to divorce the field devices from traditional wired network topologies. By providing field devices with wireless transceivers and shared wireless transceivers for adapting wired field devices, the field device network may be adapted to any number of network topologies without concern for additional wiring costs. Specifically, a power supply can be provided for each field device or for groups of field devices, as needed. Thus, the entire network can receive power from a single power bus, without expensive power filtering. In addition, the network can be a hybrid in which part of the information is transmitted and received over wired lines and part is transmitted and received over wireless communications.